Substrate support with wire mesh plasma containment

Patent metadata

Field	Value
Publication number	US-9478447-B2
Application number	US-201213684672-A
Country	US
Kind code	B2
Filing date	Nov 26, 2012
Priority date	Nov 26, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

Embodiments of substrate supports having a wire mesh plasma containment are provided herein. In some embodiments, a substrate support may include a plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the plate; at least one electrical connection between the wire mesh and the ground connector; and an elongate shaft comprising a first end and an opposite second end, wherein the plate second surface is mounted to the first end of the shaft.

First claim

The invention claimed is:

1. A substrate support, comprising: a heater plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the heater plate; at least one electrical connection between the wire mesh and the ground connector; and an elongated shaft comprising a first end and an opposite second end, wherein the heater plate second surface is mounted to the first end of the shaft, wherein the ground connector comprises an annular ground plate.

2. A substrate support, of claim 1 , wherein the heater plate is a monolithic sintered plate.

3. The substrate support of claim 2 , wherein the first heater element is sintered in place in the heater plate.

4. The substrate support of claim 3 , further comprising a second heater element sintered in place in the heater plate.

5. The substrate support of claim 2 , wherein the wire mesh is sintered in place in the heater plate.

6. The substrate support of claim 5 , wherein the wire mesh is located adjacent the first surface and the first heater element.

7. The substrate support of claim 1 , wherein the ground connector is mounted on the heater plate second surface.

8. The substrate support of claim 1 , further comprising:
one or more additional ground connectors, each ground connector comprising an annular ground plate; and
at least one electrical connection between the wire mesh and each additional ground connector.

9. The substrate support of claim 1 , wherein the ground connector is mounted on the first perimetrical surface.

10. The substrate support of claim 9 , wherein the ground connector comprises a segment of an annulus.

11. The substrate support of claim 10 , further comprising:
one or more additional ground connectors, each ground connector comprising an annular segment; and
at least one electrical connection between the wire mesh and each additional ground connector.

12. The substrate support of claim 1 , wherein the first perimetrical surface bounds the first surface, the substrate support further comprising:
a second perimetrical surface bounding the second surface; and
a ledge surface formed between the first perimetrical surface and the second perimetrical surface;
wherein the ground connector is mounted on the ledge surface.

13. A process chamber comprising:
a grounded chamber body having the substrate support of claim 1 disposed therein, wherein the ground connector is electrically coupled to the chamber body via a conductor.

14. The process chamber of claim 13 wherein the conductor comprises at least one of a ground spring, a ground strap, or a ground loop.

15. A process chamber comprising:
a grounded chamber body having the substrate support of claim 1 disposed therein; and
a conductive liner disposed within and electrically coupled to the grounded chamber body;
wherein the ground connector is electrically coupled to the conductive liner via a conductor.

16. The process chamber of claim 15 wherein the conductor comprises at least one of a ground spring, a ground strap, or a ground loop.

Assignees

• Applied Materials Inc

Inventors

• Cuvalci Olkan
• Tzu Gwo-Chuan

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H05B3/283

  the insulating material being an inorganic material, e.g. ceramic · CPC title

• H01L21/67103 Primary

  Electricity · mapped topic