Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9478357-B2
Application number	US-201414549795-A
Country	US
Kind code	B2
Filing date	Nov 21, 2014
Priority date	May 24, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

First claim

The invention claimed is:

1. A multilayer ceramic electronic component comprising:
an outer layer portion having one or more ceramic layers;
a thermal-shock absorbing portion in contact with the outer layer portion and that includes curved ceramic layers and inner electrode layers varying in thickness from point to point in a direction along a principal surface of the outer layer portion; and
a normal multilayer portion that includes ceramic layers with less curvature than the curved ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in the direction along the principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

2. The multilayer ceramic electronic component according to claim 1 , wherein, in the thermal-shock absorbing portion, a coefficient of variation of a thickness of any of the curved ceramic layers is 15% or less.

3. The multilayer ceramic electronic component according to claim 1 , wherein, in the thermal-shock absorbing portion, a coefficient of variation of a thickness of at least one of the inner electrode layers is 40% or more.

4. The multilayer ceramic electronic component according to claim 1 , wherein, in the thermal-shock absorbing portion, a coefficient of variation of a center-to-center distance between any pair of adjacent curved ceramic layers is 40% or more.

5. The multilayer ceramic electronic component according to claim 1 , wherein, in the thermal-shock absorbing portion,
a coefficient of variation of a thickness of any of the curved ceramic layers is 15% or less,
a coefficient of variation of a thickness of at least one of the inner electrode layers is 40% or more, and
a coefficient of variation of a center-to-center distance between any pair of adjacent curved ceramic layers is 40% or more.

6. The multilayer ceramic electronic component according to claim 5 , wherein, in the normal multilayer portion,
a coefficient of variation of a thickness of any of the ceramic layers is 15% or less,
a coefficient of variation of a thickness of any of the inner electrode layers is 20% or less, and
a coefficient of variation of a center-to-center distance between any pair of adjacent ceramic layers is 20% or less.

7. The multilayer ceramic electronic component according to claim 1 , wherein, in the normal multilayer portion, a coefficient of variation of a thickness of any of the ceramic layers is 15% or less.

8. The multilayer ceramic electronic component according to claim 1 , wherein, in the normal multilayer portion, a coefficient of variation of a thickness of any of the inner electrode layers is 20% or less.

9. The multilayer ceramic electronic component according to claim 1 , wherein, in the normal multilayer portion, a coefficient of variation of a center-to-center distance between any pair of adjacent ceramic layers is 20% or less.

10. The multilayer ceramic electronic component according to claim 1 , wherein in the normal multilayer portion,
a coefficient of variation of a thickness of any of the ceramic layers is 15% or less,
a coefficient of variation of a thickness of any of the inner electrode layers is 20% or less, and
a coefficient of variation of a center-to-center distance between any pair of adjacent ceramic layers is 20% or less.

11. The multilayer ceramic electronic component according to claim 1 , wherein the curved ceramic layers are irregularly curved.

12. The multilayer ceramic electronic component according to claim 11 , wherein the thickness of each inner electrode varies in an irregular manner.

13. The multilayer ceramic electronic component according to claim 1 , wherein the thickness of each inner electrode varies in an irregular manner.

14. The multilayer ceramic electronic component according to claim 1 , wherein the inner electrode layers in the normal multilayer portion and the inner electrode layers in the thermal-shock absorbing portion have no breaks.

15. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a surface-mount multilayer ceramic capacitor.

Assignees

• Murata Manufacturing Co

Inventors

• Wada Hiroyuki
• Hirata Yosuke
• Hiramatsu Takashi
• Saito Yoshito
• Tsuji Hideaki
• Ukai Hiroyuki

Classifications

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01C7/1006

  Thick film varistors · CPC title

• H01G4/258 Primary

  Temperature compensation means · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title