Coil component, method for manufacturing the same, and coil electronic component
US-9490059-B2 · Nov 8, 2016 · US
US9478346B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9478346-B2 |
| Application number | US-201214352254-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2012 |
| Priority date | Dec 22, 2011 |
| Publication date | Oct 25, 2016 |
| Grant date | Oct 25, 2016 |
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A coil component includes a magnetic core, a coil-wire portion wound on the magnetic core, and a case made of a resin covering the magnetic core and the coil-wire portion. The magnetic core is made of a pressed magnetic material powder and forms a closed magnetic circuit. The magnetic core has a lower surface configured to contact a mounting surface. The case has a lower surface configured to contact the mounting surface. The lower surface of the magnetic core includes an exposed-core portion exposed from the case. The exposed-core portion is flush with the lower surface of the case. This coil component enhances the efficiency of heat dissipation.
Opening claim text (preview).
The invention claimed is: 1. A coil component configured to be mounted onto a mounting surface, said coil component comprising: a magnetic core including a middle leg, an outer leg, and a connecting rod that connects the middle leg and the outer leg, the magnetic core being made of pressed magnetic material powder, the magnetic core forming a closed magnetic circuit; a coil-wire portion wound on the middle leg of the magnetic core; and a case made of a resin covering the magnetic core and the coil-wire portion, wherein the magnetic core has a lower surface configured to face the mounting surface while the coil component is mounted onto the mounting surface, wherein the case has a lower surface configured to face the mounting surface while the coil component is mounted onto the mounting surface, wherein the lower surface of the magnetic core has a first exposed-core portion exposed from the case, and wherein the first exposed-core portion is flush with the lower surface of the case, wherein the case includes a case-crossing portion connected to two portions of the case which face each other across the lower surface of the magnetic core, the case-crossing portion passing through under the middle leg and extending along the lower surface of the magnetic core, wherein the lower surface of the magnetic core further includes a second exposed-core portion exposed from the case, and wherein the first exposed-core portion and the second exposed-core portion are disposed symmetrical to each other with respect to the case-crossing portion. 2. The coil component according to claim 1 , wherein the connecting rod includes the lower surface of the magnetic core, and wherein the middle leg and the outer leg extend upward from the connecting rod. 3. The coil component according to claim 1 , wherein the lower surface of the case and the first exposed-core portion are configured to surface-contact the mounting surface. 4. The coil component according to claim 1 , wherein the case includes a case bottom portion extending along the lower surface of the magnetic core. 5. The coil component according to claim 4 , wherein the case bottom portion is disposed under the outer leg. 6. The coil component of claim 1 , wherein the first exposed-core portion is disposed under the coil-wire portion. 7. The coil component according to claim 1 , wherein the case includes a plurality of mounting portions for fixing the case to the mounting surface, each of the plurality of mounting portions being disposed at respective one of the two portions of the case. 8. The coil component according to claim 1 , wherein the case-crossing portion includes a wide portion having a width which is locally larger. 9. The coil component according to claim 1 , wherein the first exposed-core portion has an impregnated portion that is locally impregnated with a resin. 10. The coil component according to claim 1 , further comprising a supporting layer contacting the first exposed-core portion, wherein the supporting layer contains a resin and thermally-conductive filler dispersed in the resin, and wherein a lower surface of the supporting layer is configured to contact the mounting surface while the coil component is mounted onto the mounting surface. 11. The coil component according to claim 10 , wherein a thermal conductivity of the supporting layer is higher than thermal conductivities of the pressed magnetic material powder and the case. 12. The coil component according to claim 10 , wherein an elastic modulus of the supporting layer is lower than elastic moduli of the pressed magnetic material powder and the case. 13. The coil component according to claim 10 , wherein a withstanding voltage of the supporting layer is higher than withstanding voltages of the pressed magnetic material powder and the case. 14. The coil component according to claim 2 , wherein the lower surface of the case and the first exposed-core portion are configured to surface-contact the mounting surface. 15. The coil component according to claim 2 , wherein the case includes a case bottom portion extending along the lower surface of the magnetic core. 16. The coil component according to claim 15 , wherein the case bottom portion is disposed under the outer leg. 17. The coil component of claim 2 , wherein the first exposed-core portion is disposed under the coil-wire portion. 18. A coil component configured to be mounted onto a mounting surface, said coil component comprising: a magnetic core including a middle leg, an outer leg, and a connecting rod that connects the middle leg and the outer leg, the magnetic core being made of pressed magnetic material powder, the magnetic core forming a closed magnetic circuit; a coil-wire portion wound on the middle leg of the magnetic core; and a case made of a resin covering the magnetic core and the coil-wire portion, wherein the magnetic core has a lower surface configured to face the mounting surface while the coil component is mounted onto the mounting surface, wherein the case has a lower surface configured to face the mounting surface while the coil component is mounted onto the mounting surface, wherein the lower surface of the magnetic core has a first exposed-core portion exposed from the case, and wherein the first exposed-core portion is flush with the lower surface of the case, wherein the connecting rod includes the lower surface of the magnetic core, wherein the middle leg and the outer leg extend upward from the connecting rod, wherein the case includes a case-crossing portion connected to two portions of the case which face each other across the lower surface of the magnetic core, the case-crossing portion passing through under the middle leg and extending along the lower surface of the magnetic core, wherein the lower surface of the magnetic core further includes a second exposed-core portion exposed from the case, and wherein the first exposed-core portion and the second exposed-core portion are disposed symmetrical to each other with respect to the case-crossing portion. 19. The coil component according to claim 18 , wherein the case includes a plurality of mounting portions for fixing the case to the mounting surface, each of the plurality of mounting portions being disposed at respective one of the two portions of the case. 20. The coil component according to claim 18 , wherein the case-crossing portion includes a wide portion having a width which is locally large. 21. The coil component according to claim 2 , wherein the first exposed-core portion has an impregnated portion that is locally impregnated with a resin. 22. The coil component according to claim 2 , further comprising a supporting layer contacting the first exposed-core portion, wherein the supporting layer contains a resin and thermally-conductive filler dispersed in the resin, and wherein a lower surface of the supporting layer is configured to contact the mounting surface while the coil component is mounted onto the mounting surface. 23. The coil component according to claim 22 , wherein a thermal conductivity of the supporting layer is higher than thermal conductivities of the pressed magnetic material powder and the case. 24. The coil component according to claim 22 , wherein an elastic modulus of the supporting layer is lower than elastic moduli of the pressed magnetic material powder and the case. 25. The coil component according to
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