Hybrid integration using folded Mach-Zehnder modulator array block

Patent metadata

Field	Value
Publication number	US-9477134-B2
Application number	US-201213730497-A
Country	US
Kind code	B2
Filing date	Dec 28, 2012
Priority date	Dec 28, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

An apparatus comprising a modulation block comprising a plurality of modulators, wherein each of the plurality of modulators comprises an optical input port and an optical output port, and wherein all of the optical input ports and all of the optical output ports are positioned on one face of the modulation block. Another apparatus comprising a modulation block comprising one or more Mach-Zehnder modulators (MZMs), wherein each MZM is coupled to an optical input port, an optical output port, and at least one electrical trace, wherein all of the optical input ports and all of the optical output ports are positioned on a first side of the modulation block, and wherein all of the electrical traces are positioned on a second side of the modulation block, and a planar lightwave circuit (PLC) coupled to the modulation block via an optical interface.

First claim

What is claimed is:

1. An apparatus comprising:
a modulation block comprising a plurality of modulators,
wherein the plurality of modulators comprises a first modulator at least partially folded within a second modulator,
wherein each of the plurality of modulators comprises an optical input port and an optical output port,
wherein all of the optical input ports and all of the optical output ports are positioned on one face of the modulation block,
wherein the first modulator comprises a first optical input port and a first optical output port and the second modulator comprises a second optical input port and a second optical output port, and
wherein partially folded means that the first optical input port, the first optical output port, or both are located between the second optical input port and the second optical output port on the one face.

2. The apparatus of claim 1 , wherein the modulators are Mach-Zehnder modulators (MZMs).

3. The apparatus of claim 2 , wherein each of the MZMs further comprises Indium Phosphide (InP).

4. The apparatus of claim 2 , wherein each of the MZMs further comprises a waveguide connected to the optical input port, and wherein the waveguide comprises a curved section.

5. The apparatus of claim 2 , wherein each of the MZMs further comprises one or more electrical connections, and wherein all of the electrical connections are positioned on another face of the modulation block.

6. An apparatus comprising:
a modulation block comprising:
a first plurality of markers; and
one or more Mach-Zehnder modulators (MZMs), wherein each MZM is coupled to an optical input port, an optical output port, and at least one electrical input, wherein all of the optical input ports and all of the optical output ports are positioned on a first side of the modulation block, and wherein all of the electrical inputs are positioned on a second side of the modulation block that is parallel to the first side;

an optical interface;
a planar lightwave circuit (PLC) carrier comprising:
a second plurality of markers; and
a plurality of stoppers comprising first portions and second portions, wherein the first portions are etched and configured to provide electrical interfaces with the modulation block, and wherein the second portions are etched deeper than the first portions and configured to provide thermal interfaces and mechanical interfaces with the modulation block; and

a PLC monolithically grown on the PLC carrier and optically coupled to the modulation block via the optical interface.

7. The apparatus of claim 6 , wherein the PLC comprises a passive optical network component.

8. The apparatus of claim 6 , wherein the modulation block is coupled to the PLC carrier.

9. The apparatus of claim 8 , wherein no electrical input overlaps any optical component positioned on the PLC carrier, and wherein the PLC is further coupled to the modulation block via flip-chip bonding.

10. The apparatus of claim 8 , wherein at least one of the optical output ports is offset from a PLC optical input port by an angle greater than zero and less than 30 degrees.

11. The apparatus of claim 8 , wherein the modulation block comprises a first waveguide, wherein the PLC comprises a second waveguide coupled to the first waveguide via the optical interface, and wherein the plurality of stoppers are configured to align the modulation block such that the first waveguide and the second waveguide have equal vertical positions at the optical interface.

12. The apparatus of claim 11 , wherein the first plurality of markers and the second plurality of markers are configured to align the modulation block to the PLC carrier such that the first waveguide and the second waveguide have equal horizontal positions at the optical interface.

13. The apparatus of claim 11 , further comprising at least one additional modulation block coupled to the PLC carrier.

14. The apparatus of claim 1 , further comprising:
a planar lightwave circuit (PLC) carrier;
a first termination resistor deposited on the PLC carrier and associated with the first modulator; and
a second termination resistor deposited on the PLC carrier and associated with the second modulator.

15. The apparatus of claim 1 , further comprising a planar lightwave circuit (PLC) carrier, wherein the PLC carrier comprises a first plurality of markers and the modulation block comprises a second plurality of markers.

16. The apparatus of claim 15 , further comprising a PLC monolithically grown on the PLC carrier, wherein the PLC comprises a first waveguide and the modulation block comprises a second waveguide.

17. The apparatus of claim 16 , wherein the first plurality of markers and the second plurality of markers are configured to align the modulation block to the PLC carrier such that the first waveguide and the second waveguide have equal horizontal positions.

18. The apparatus of claim 6 , wherein the one or more MZMs comprises a first MZM, and wherein the apparatus further comprises a first termination resistor deposited on the PLC carrier and associated with the first MZM.

19. The apparatus of claim 18 , further comprising:
a bonding pad coupled to the first termination resistor;
a transmission line coupled to the modulation block; and
a solder coupling the bonding pad to the transmission line.

20. The apparatus of claim 6 , wherein the first portions are etched to silicon dioxide (SiO 2 ) layers and the second portions are etched to silicon (Si) layers.

Assignees

• Futurewei Technologies Inc

Inventors

• Liao Chunlei
• Chen Morgan
• Shen Xiao A
• Bai Yusheng

Classifications

• G02B2006/12104

  Mirror; Reflectors or the like · CPC title

• G02F2001/212

  Physics · mapped topic

• G02B2006/12159

  Interferometer · CPC title

• G02B2006/12142

  Modulator · CPC title

• G02F1/00

  Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics · CPC title