Composite sensor and composite sensor module having first and second substrates mounted to form a seal body about a thermal image sensor with a range image sensor arranged with the second substrate

Patent metadata

Field	Value
Publication number	US-9476773-B2
Application number	US-201314415868-A
Country	US
Kind code	B2
Filing date	Apr 16, 2013
Priority date	Aug 1, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

In a composite sensor, an arrangement region of thermal image sensors and an arrangement region of range image sensors are arranged so as to overlap each other as seen in the mounting direction. This makes it possible to acquire thermal and range images coaxially, thereby suppressing image misalignment between the thermal and range images. In the composite sensor, a seal body formed by mounting the first and second substrates on top of each other seals a space about the thermal image sensors in a vacuum state. This can prevent the heat occurring about the range image sensors from affecting the thermal image sensor side. In addition, the substrate arranged with the thermal image sensors and the substrate arranged with the range image sensors are separate from each other, which can secure a degree of freedom in designing.

First claim

The invention claimed is:

1. A composite sensor comprising:
a first substrate arranged with a thermal image sensor constituted by a plurality of thermoelectric elements; and
a second substrate arranged with a range image sensor having a charge generation region for generating an electric charge in response to light incident thereon and a transfer electrode for transferring the electric charge generated in the charge generation region to a predetermined charge collection region according to a charge transfer signal given beforehand;
wherein the second substrate is mounted on the first substrate such that a region arranged with the thermal image sensor and a region arranged with the range image sensor overlap each other as seen in the mounting direction; and
wherein the first and second substrates are mounted on top of each other so as to form a seal body sealing a space about the thermal image sensor with the first substrate serving as a top plate.

2. A composite sensor according to claim 1 , wherein the range image sensor in the second substrate has an arrangement pitch smaller than that of the thermal image sensor in the first substrate.

3. A composite sensor according to claim 1 , wherein an optical filter film transparent to light in a mid-infrared region is formed on an inner wall surface of the seal body.

4. A composite sensor according to claim 1 , wherein the seal body has a vacuum state therewithin.

5. A composite sensor module comprising:
the composite sensor according to claim 1 ; and
a lens arranged such as to have an imaging plane at the region arranged with the range image sensor in the second substrate.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Ojima Fumikazu
• Mase Mitsuhito
• Sakurai Naoto

Classifications

• H04N25/76

  Addressed sensors, e.g. MOS or CMOS sensors · CPC title

• G01S17/894

  Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar · CPC title

• G01S7/4816

  of receivers alone · CPC title

• G01J5/0859

  Sighting arrangements, e.g. cameras · CPC title

• G01J5/0275 Primary

  Control or determination of height or distance or angle information for sensors or receivers · CPC title