Components with multi-layered cooling features and methods of manufacture

US9476306B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9476306-B2
Application numberUS-201314089888-A
CountryUS
Kind codeB2
Filing dateNov 26, 2013
Priority dateNov 26, 2013
Publication dateOct 25, 2016
Grant dateOct 25, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A manufacturing method includes providing a substrate having one or more grooves formed therein. One or more coatings having one or more grooves formed therein are disposed on the substrate and in fluid communication with the one or more grooves in the substrate. A cover coating is disposed on a portion of an outermost surface of the one or more coatings, having one or more cooling outlets formed therein and in fluid communication with the one or more grooves in the one or more coatings. The substrate, the one or more coatings and the cover coating define therein a cooling network for cooling a component. A component having a cooling network defined therein a substrate, one or more coatings disposed on at least a portion of the substrate, and a cover coating disposed over at least a portion of an outermost coating of the one or more coatings.

First claim

Opening claim text (preview).

The invention claimed is: 1. A manufacturing method comprising: providing a substrate with an outer surface and at least one interior space and having one or more grooves formed in a portion of the substrate, wherein each groove extends at least partially along the substrate; applying two or more coatings on at least a portion of the substrate; forming one or more grooves in each of the two or more coatings, wherein each groove extends at least partially along a respective coating of the two or more coatings and wherein the one or more grooves in the two or more coatings are in fluid communication with one another and with the one or more grooves in the substrate; applying a cover coating on at least a portion of an outermost surface of the two or more coatings; and forming one or more cooling outlets in the cover coating and in fluid communication with the one or more grooves formed in each of the two or more coatings, wherein the substrate, the two or more coatings and the cover coating define therein a cooling network for cooling a component. 2. The manufacturing method of claim 1 , wherein each of the one or more grooves in each of the two or more coatings is formed using one or more of an abrasive liquid jet, plunge electrochemical machining (ECM), electric discharge machining (EDM) with a spinning electrode (milling EDM), and laser machining. 3. The manufacturing method of claim 1 , wherein the cooling network is defined by one or more cooling flow channels having portions formed in the substrate and in the two or more coatings. 4. The manufacturing method of claim 3 , wherein the cooling network includes one or more cross-channels defined in the two or more coatings. 5. The manufacturing method of claim 3 , wherein the cooling network includes one or more serpentine cooling flow channels defined in the two or more coatings. 6. The manufacturing method of claim 3 , wherein the cooling network includes one or more u-shaped cooling flow channels defined in the two or more coatings. 7. The manufacturing method of claim 3 , wherein the cooling network includes one or more distribution headers defined in the substrate. 8. The manufacturing method of claim 7 , wherein the one or more distribution headers comprise an inlet header. 9. The manufacture method of claim 8 , wherein the one or more distribution headers further comprise an outlet header. 10. A manufacturing method comprising: providing a substrate with an outer surface and at least one interior space and having one or more grooves formed in a portion of the substrate, wherein each groove extends at least partially along the substrate; applying two or more coatings on at least a portion of the substrate to define at least one distribution header in the substrate; forming one or more grooves in each of the two or more coatings, wherein each groove extends at least partially along a respective coating of the two or more coatings and wherein the one or more grooves in the two or more coatings are in fluid communication with one another and with the at least one distribution header in the substrate; applying a cover coating on at least a portion of an outermost surface of the two or more coatings; and forming one or more cooling outlets in the cover coating and in fluid communication with the one or more grooves formed in each of the two or more coatings, wherein the substrate, the two or more coatings and the cover coating define a cooling network defined by one or more cooling flow channels having portions formed in the substrate and in the two or more coatings for cooling a component. 11. The manufacturing method of claim 10 , wherein the cooling network includes one or more cross-channels defined in the two or more coatings. 12. The manufacturing method of claim 10 , wherein the cooling network includes an inlet header and an outlet header defined in the substrate. 13. The manufacturing method of claim 12 , wherein the cooling network includes one or more cross-channels defined in the two or more coatings and extending transversely between the inlet header and the outlet header. 14. The manufacturing method of claim 10 , wherein the cooling network includes one or more serpentine cooling flow channels defined in the two or more coatings. 15. The manufacturing method of claim 10 , wherein the cooling network includes one or more u-shaped cooling flow channels defined in the two or more coatings. 16. A component comprising a substrate comprising an outer surface and an inner surface, wherein the inner surface defines at least one interior space, the substrate including one or more grooves formed in a portion of the substrate, wherein each groove extends at least partially along the substrate and wherein one or more cooling supply inlets are formed through a base of a respective groove in the substrate, to connect the groove in fluid communication with an interior space; two or more coatings disposed on at least a portion of the substrate, wherein each of the two or more coatings define one or more grooves therein, wherein each groove extends at least partially along a respective coating of the two or more coatings and wherein the one or more grooves in the two or more coatings are in fluid communication with one another and with the one or more grooves in the substrate; and a cover coating disposed over at least a portion of an outermost coating of the two or more coatings and wherein one or more cooling outlets are formed through the cover coating, to connect the one or more grooves in each of the two or more coatings to an exterior, wherein the substrate, the two or more coatings and the cover coating together define a cooling network for cooling comprised of one or more cooling flow channels for cooling the component. 17. The component of claim 16 , wherein the cooling network includes one or more cross-channels defined in the two or more coatings. 18. The component of claim 16 , wherein the cooling network includes one or more serpentine cooling flow channels defined in the two or more coatings. 19. The component of claim 16 , wherein the cooling network includes one or more u-shaped cooling flow channels defined in the two or more coatings. 20. The component of claim 16 , wherein the cooling network includes one or more distribution headers defined in the substrate.

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What does patent US9476306B2 cover?
A manufacturing method includes providing a substrate having one or more grooves formed therein. One or more coatings having one or more grooves formed therein are disposed on the substrate and in fluid communication with the one or more grooves in the substrate. A cover coating is disposed on a portion of an outermost surface of the one or more coatings, having one or more cooling outlets form…
Who is the assignee on this patent?
Gen Electric
What technology area does this patent fall under?
Primary CPC classification F01D5/187. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).