Composite plating liquid

US9476138B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9476138-B2
Application numberUS-201213403331-A
CountryUS
Kind codeB2
Filing dateFeb 23, 2012
Priority dateFeb 24, 2011
Publication dateOct 25, 2016
Grant dateOct 25, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite plating liquid comprising: a plating metal salt including a halide salt, wherein the halide salt includes nickel bromide; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; carbon nanotubes; and a dispersant, wherein the dispersant is polyacrylic acid, wherein a metal of the plating metal salt comprises nickel, wherein a concentration of the plating metal salt is 10 to 100 g/L, and a concentration of the sulfate is 200 to 500 g/L, wherein a concentration of the carbon nanotubes is such that, when the composite plating liquid is made into a composite plating film by plating the composite plating liquid on a member, a weight percent of the carbon nanotubes in the composite plating film is 0.1 to 10 wt %, and wherein a weight ratio between a metal of the plating metal salt and the boric acid is in a range of 1:1 to 1:5. 2. A plating method comprising; plating a member using the composite plating liquid according to claim 1 . 3. A composite plating film formed by the method of claim 2 , wherein the carbon nanotubes are provided in the composite plating film in the weight percent of 0.1 to 10 wt %. 4. A plated member comprising the composite plating film of claim 3 . 5. A heat radiation component comprising: a first surface having a plurality of grooves therein; and the composite plating film of claim 3 , which is formed over an entire surface of the first surface, wherein a thickness of the composite plating film is substantially uniform over the first surface.

Assignees

Inventors

Classifications

  • from solutions (C25D5/34 - C25D5/46 take precedence) · CPC title

  • C25D15/00Primary

    Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires · CPC title

  • of nickel or cobalt · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9476138B2 cover?
In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed …
Who is the assignee on this patent?
Suwa Yoriyuki, Kawamura Kenji, Aoki Syuzo, and 4 more
What technology area does this patent fall under?
Primary CPC classification C25D15/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).