Liquid ejection head and manufacturing method of liquid ejection head

US9475288B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9475288-B2
Application numberUS-201514721264-A
CountryUS
Kind codeB2
Filing dateMay 26, 2015
Priority dateMay 30, 2014
Publication dateOct 25, 2016
Grant dateOct 25, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A liquid ejection head with high environmental reliability which suppresses a crack of a Si substrate and peeling-off of an ejection port forming member by relaxing a residual stress in a printing element substrate and a manufacturing method of a liquid ejection head are provided. For that purpose, after the printing element substrate is bonded and fixed to a support member, the support member is screwed and fixed through an elastic member.

First claim

Opening claim text (preview).

What is claimed is: 1. A liquid ejection head, comprising: a printing element substrate including an ejection port ejecting a liquid; a plate-shaped first support member formed of a resin, configured to support the printing element substrate and including a supply port for supplying the liquid to the printing element substrate; a second support member configured to support the first support member and formed with a channel for supplying the liquid to the first support member; and a first screw and a second screw for joining the first support member and the second support member, the first screw being provided at one side of the printing element substrate, and the second screw being provided at the other side of the printing element substrate, wherein the first support member includes a thin portion having a thickness smaller than a thickness of a portion of the first support members where the printing element substrate is disposed, the thin portion being provided between a portion of the first support member where one of the first screw and the second screw is disposed and the portion where the printing element substrate is disposed, and wherein the first support member is deformed so that a portion between the second screw and the first screw becomes convex toward a side at which the printing element substrate is provided. 2. The liquid ejection head according to claim 1 , wherein an elastic member is disposed between the first support member and the second support member.

Assignees

Inventors

Classifications

  • dividing the wafer into individual chips · CPC title

  • Production of nozzles · CPC title

  • Assembling elements of heads · CPC title

  • bonding and adhesion · CPC title

  • B41J2/14Primary

    Structure thereof {only for on-demand ink jet heads} · CPC title

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Frequently asked questions

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What does patent US9475288B2 cover?
A liquid ejection head with high environmental reliability which suppresses a crack of a Si substrate and peeling-off of an ejection port forming member by relaxing a residual stress in a printing element substrate and a manufacturing method of a liquid ejection head are provided. For that purpose, after the printing element substrate is bonded and fixed to a support member, the support member …
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B41J2/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).