Controlling adhesives between substrates and carriers

Patent metadata

Field	Value
Publication number	US-9475278-B2
Application number	US-201214394696-A
Country	US
Kind code	B2
Filing date	Jun 18, 2012
Priority date	Jun 18, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.

First claim

What is claimed is:

1. A method for controlling adhesives between substrates and carriers, comprising:
forming a depression into a bonding area of as backside surface of a substrate of a print head, the depression having a retaining lip, said bonding area being formed proximate an ink feed pathway formed through a thickness of said substrate from said backside surface to a from side surface, said backside surface being adjacent an ink reservoir and said front side surface being adjacent an ink firing chamber;
placing an adhesive between said bonding area and a substrate carrier;
moving-said substrate and said substrate carrier together such that said adhesive flows into said depression; and
preventing, via said depression and the retaining lip thereof, said adhesive from bulging into said ink feed pathway.

2. The method of claim 1 , wherein forming a depression into a bonding area of a backside surface of a substrate of a print head includes removing an etchant resistant layer formed on said backside surface with laser machining.

3. The method of claim 1 , wherein forming a depression into a bonding area of a backside surface of a substrate of a prim bead includes wet etching an area of said backside surface exposed from removing an etchant resistant layer formed on said backside surface with laser machining.

4. The method of claim 1 , where said bonding area is located between said ink feed pathway and a second ink feed pathway formed in said backside surface.

5. The method of claim 4 , wherein forming, a depression into a bonding area of a backside surface of a substrate of a print bead includes forming a first groove and a second groove, wherein said first groove runs along a first length of said ink feed pathway and said second groove runs along a second length of said second ink feed pathway.

6. The method of claim 4 , wherein forming a depression into a bonding area of a backside surface of a substrate of a print head includes forming a groove that runs along to length of one of said ink feed pathway and said second ink feed pathway, wherein said groove comprises a width that spans at least fifty percent of a distance from said ink feed pathway and said second ink feed pathway.

7. The method of claim 1 , wherein said depression is formed a distance away from said ink feed pathway.

8. The method of claim 1 , wherein said depression is formed during a different time period, than a formation of said ink flow pathway.

9. A print head with a controlled adhesive between a substrate and a carrier, comprising:
a substrate with a front side surface and a backside surface;
at least one ink firing chamber adjacent said front side surface and an ink reservoir adjacent said backside surface;
an ink feed slot formed through a thickness of said substrate from said backside surface to said front side surface: and
said backside surface comprising a bonding area proximate said ink feed slot and at least one depression formed in said bonding area wherein:
a depth of said depression is equivalent to a gap height between said substrate and said carrier; and
said at least one depression comprises a retaining, lip to prevent adhesive from bulging into said ink feed slot.

10. The print bead of claim 9 , wherein said at least one depression is a groove that runs along a length of said ink feed slot.

11. The print head of claim 9 , wherein said bonding area is located between said ink feed slot and a second ink feed slot formed in said backside surface.

12. The print head of claim 11 , wherein said at least one depression is a first groove and a second groove, wherein said first groove runs along a first length of said in feed slot and said second groove runs along a second length of said second ink feed slot.

13. The print head of claim 11 , wherein said at least one depression is a groove that runs along a length of one of said ink feed slot and said second ink feed slot, wherein said groove comprises a width that spans at least fifty percent of a distance from said ink feed slot and said second ink feed slot.

14. The print head of claim 9 , wherein said at least one depression is in fluid communication with said ink fixed slot.

15. The print head of claim 9 , wherein said depression has a convex, surface.

16. The print head of claim 9 , wherein said depression has a curved surface.

17. The print head of claim 9 , wherein said depression joins said bonding area to an inside wall of said ink feed slot.

18. A system with a controlled adhesive between a substrate and a carrier, comprising,
a substrate with a front side surface and a backside surface;
at least one ink firing chamber adjacent said front side surface and an ink reservoir adjacent said backside surface;
an ink feed slot formed through a thickness of said substrate from said backside surface to said front, side surface;
said backside surface being bonded with an adhesive to a substrate carrier at bonding areas funned in said backside surface and in said substrate carrier, said bonding area being located between said ink feed slot and a second ink feed slot formed in said backside surface; and
at least one depression formed in one of said bonding areas being at least partially filled with said adhesive to keep the adhesive outside of said ink feed slot, the depression comprising a retaining lip that prevents adhesive from bulging into said ink feed slot.

19. The system of claim 18 , where said at least one depression is a first groove and a second groove, wherein said first groove runs alone a first length of said ink feed slot and said second groove runs along a second length of said second ink feed slot.

20. The system of claim 18 , were said at least one depression is a single groove that runs along a length of one of said ink feed slot and said second ink teed slot, wherein said groove comprises a width that spans at least fitly percent of a distance from said ink feed slot and said second ink feed slot.

Assignees

• Rivas Rio
• Friesen Ed
• Thurber Lawrence
• Clark Garrett E
• Bigford Rosanna L
• Hewlett Packard Development Co Lp

Inventors

• Rivas Rio
• Friesen Ed
• Thurber Lawrence
• Clark Garrett E
• Bigford Rosanna L

Classifications

• B41J2/01 Primary

  Ink jet · CPC title

• Y10T156/1064

  Partial cutting [e.g., grooving or incising] · CPC title

• B41J2/14024 Primary

  Assembling head parts · CPC title

• B32B38/0004

  Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence) · CPC title

• B41J2/1623

  bonding and adhesion · CPC title