Axial field rotary energy device having pcb stator and variable frequency drive
US-2024429765-A1 · Dec 26, 2024 · US
Power semiconductor module
US9474191B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9474191-B2 |
| Application number | US-201314379957-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 8, 2013 |
| Priority date | Mar 30, 2012 |
| Publication date | Oct 18, 2016 |
| Grant date | Oct 18, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Each of a plurality of power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.
First claim
Opening claim text (preview).
The invention claimed is: 1. A power semiconductor module comprising: a semiconductor device configured to perform conversion into DC power and AC power; conductor plates placed on both sides of the semiconductor device, the conductor plates being connected to electrode surfaces of the semiconductor device with solder; a sealed unit having the semiconductor device and the conductor plates sealed therein with resin; a case for housing the sealed unit; and an insulating member place…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9474191B2 cover?
- Each of a plurality of power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.
- Who is the assignee on this patent?
- Hitachi Automotive Systems Ltd
- What technology area does this patent fall under?
- Primary CPC classification H02M7/003. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).