Interposer connectors with alignment features

US9474156B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9474156-B2
Application numberUS-201213492895-A
CountryUS
Kind codeB2
Filing dateJun 10, 2012
Priority dateFeb 10, 2011
Publication dateOct 18, 2016
Grant dateOct 18, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of assembling a mating board, interposer, and main-logic board, the method comprising: providing a main-logic board having a plurality of contacts placed around a first opening, an alignment post, and an alignment pin; providing an interposer having a first opening, a second opening to accept the alignment post, a first notch to accept the alignment pin, a first plurality of contacts on a first side, and a second plurality of contacts on a second side; fitting the interposer to the main logic board such that the first opening aligns with the first opening on the main-logic board, the second opening accepts the alignment post, the first notch in an outside edge of the interposer accepts the alignment pin, and the first plurality of contacts mates with the contacts on the main logic board; providing a mating board having a first opening, a second opening to accept the alignment post, and a plurality of contacts on a first side; fitting the mating board to the interposer such that the first opening aligns with the first opening on the interposer, the second opening accepts the alignment post, and the plurality of contacts mates with the second plurality of contacts on the interposer; and fastening the mating board, interposer, and main logic board together. 2. The method of claim 1 wherein the interposer is rectangular. 3. The method of claim 1 wherein the interposer is square. 4. The method of claim 1 wherein fastening the mating board, interposer, and main logic board together comprises inserting a screw through the first opening in the mating board, the first opening in the interposer, and the first opening in the main-logic board. 5. The method of claim 4 further comprising inserting a screw through a backer plate, the backer plate located on a top side of the mating board. 6. The method of claim 5 further comprising screwing the screw into a second backing plate located below the main-logic board. 7. The method of claim 5 further comprising aligning a notch in the backer plate to the alignment post. 8. The method of claim 1 wherein the interposer is circular. 9. An electronic device comprising: a main logic board having a plurality of contacts on a first side, a first alignment feature, a second alignment feature, and an opening for a fastener; an interposer having a first opening for the fastener, a second opening aligned with the first alignment feature, a first notch in an outside edge of the interposer aligned with the second alignment feature, a first plurality of contacts on a first side aligned with the plurality of contacts on the first side of the main logic board, and a second plurality of contacts on a second side; a mating board having a first opening for the fastener, a second opening aligned with the first alignment feature, a plurality of contacts on a first side aligned with the second plurality of contacts on the second side of the interposer; and the fastener holding the mating board, interposer, and main logic board together. 10. The electronic device of claim 9 wherein the interposer is rectangular. 11. The electronic device of claim 9 wherein the interposer is square. 12. The electronic device of claim 9 wherein the fastener comprises a screw. 13. The electronic device of claim 9 wherein the first alignment feature comprises an alignment post. 14. The electronic device of claim 13 wherein the second alignment feature comprises an alignment pin. 15. The electronic device of claim 9 wherein the mating board further comprises a plurality of electronic components. 16. The electronic device of claim 9 wherein the mating board is further attached to a plurality of conductive lines. 17. The electronic device of claim 9 wherein the interposer is circular. 18. An electronic device comprising: a main logic board having a plurality of contacts on a first side, a first alignment feature, and an opening for a fastener; an interposer having a first opening for the fastener, a second opening aligned with the first alignment feature, a first plurality of contacts on a first side aligned with the plurality of contacts on the first side of the main logic board, and a second plurality of contacts on a second side; a mating board having a first opening for the fastener, a second opening aligned with the first alignment feature, a plurality of contacts on a first side aligned with the second plurality of contacts on the second side of the interposer; and the fastener holding the mating board, interposer, and main logic board together. 19. The electronic device of claim 18 wherein the interposer is rectangular. 20. The electronic device of claim 18 wherein the interposer is square. 21. The electronic device of claim 18 wherein the interposer is circular.

Assignees

Inventors

Classifications

  • Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • Non-rectangular flat PCB, e.g. circular · CPC title

  • Stacked arrangements of planar printed circuit boards · CPC title

  • Screws · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9474156B2 cover?
Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or mo…
Who is the assignee on this patent?
Fosnes Greg, Miletich Aaron, Ligtenberg Chris, and 5 more
What technology area does this patent fall under?
Primary CPC classification H05K1/141. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).