Submount, assembly including submount, method of assembling and assembling device

Patent metadata

Field	Value
Publication number	US-9474155-B2
Application number	US-201314385071-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 15, 2012
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

The present invention pertains to a submount for mechanically and electrically coupling an electronic component to a carrier. The submount has a mounting portion for mounting the submount to the carrier and has attachment portions for holding the electronic component. The submount further has primary electric contacts for cooperation with respective electrical conductors in the carrier, and secondary electric contacts for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

First claim

The invention claimed is:

1. A submount for mechanically and electrically coupling an electronic component to a carrier, the submount having a mounting portion for mounting the submount to the carrier, having attachment portions for holding the electronic component, and having primary electric contacts for cooperation with respective electrical conductors in the carrier, and secondary electric contacts for cooperation with respective electric contacts of the electronic component, the secondary electric contacts being electrically connected to primary electric contacts, wherein the attachment portions are coupled to the mounting portion by respective extension portions that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion; wherein said respective attachment portions comprise a gripping element and wherein said electronic component is attached to said attachment portion by stretching at least one of said extension portions, arranging the electronic component upon said submount and allowing said at least one of said extension portions to at least partially relax to therewith have the attachment portions grip into respective attachment portions of said electronic component.

2. The submount of claim 1 , wherein the submount is integrally formed of a polymer foil.

3. The submount of claim 1 , wherein the extension portions have a meandering shape.

4. The submount of claim 1 , wherein the attachment portion comprises a gripping element.

5. The submount of claim 1 , further including an asymmetry for rotations in the plane of the mounting portion.

6. An assembly of a carrier and at least one submount according to claim 1 .

7. An assembly of a carrier and at least one submount according to claim 1 holding an electronic component.

8. A method of assembling, comprising the step of
providing a carrier with at least one submount as claimed in claim 1 ,
providing an electronic component,
attaching the electronic component to attachment portions of said submount.

9. An assembling device for assembling an electronic component to a carrier with at least one submount has claimed in claim 1 , the assembling device comprising
a facility for attaching the electronic component to the at least one submount,
a facility for maintaining at least one of the extension portions in a stretched state while attaching the component to the at least one submount.

10. The submount of claim 2 , wherein the polymer foil is coated with a metal layer, the metal layer forming an electric connection between the secondary electric contacts and their primary electric contact.

11. The method of assembling of claim 8 , wherein said electronic component is adhered to said attachment portions by an electrically conductive adhesive.

12. The method of assembling of claim 8 , wherein the carrier is made of a flexible material, wherein the carrier is guided over a curved surface to provide a space between the carrier and the attachment portions of the submount, inserting a stretching tool within said space, stretching the extension portions with said stretching tool, placing the electronic component and releasing the extension portions to allow the attachment portions to snap into respective attachment portions of said electronic component.

13. The method of assembling of claim 8 , comprising placing the electronic component in a position wherein at least one of its attachment portions cooperates with a respective attachment portion of the submount, exerting a force on the electronic component causing the extension portion corresponding to said attachment portion to stretch and therewith allowing at least a second one of the attachment portions of said electronic component to grip into another respective attachment portion of the submount.

14. The assembling device of claim 9 , wherein the facility for maintaining the at least one of the extension portions in a stretched state is a displacement device for laterally displacing the facility for attaching.

Assignees

• Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno
• Imec Vzw

Inventors

• Van Heck Gerardus Titus
• De Kok Margaretha Maria

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• H05K2201/09263

  Meander · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/09418

  Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation · CPC title