What is claimed is:
1. A display apparatus, comprising:
a first substrate that is curved;
a display unit on the first substrate; and
a second substrate that covers the display unit, is curved, and faces the first substrate,
one or more of edges of the first substrate or edges of the second substrate being at least partially chamfered.
2. The display apparatus as claimed in claim 1 , wherein at least one of the first substrate and the second substrate includes:
a first edge portion having a curvature; and
a second edge portion connected to the first edge portion.
3. The display apparatus as claimed in claim 2 , wherein a first surface roughness of the first edge portion is less than a second surface roughness of the second edge portion.
4. The display apparatus as claimed in claim 3 , wherein the first surface roughness ranges from 0.05 μm to 0.8 μm.
5. The display apparatus as claimed in claim 3 , wherein the first surface roughness of the first edge portion increases from a center portion of the first edge portion toward end portions of the first edge portion in a length direction.
6. The display apparatus as claimed in claim 1 , wherein at least one of the first substrate and the second substrate is a curved surface having a plurality of radii of curvature or a constant radius of curvature.
7. A method of manufacturing a display apparatus, the method comprising:
attaching a second substrate to a first substrate on which a display unit is formed;
cutting the first substrate and the second substrate to a predetermined size;
chamfering one or more of a cut portion of the first substrate or a cut portion of the second substrate; and
compressing the first substrate and the second substrate so that the first and second substrate have curvatures.
8. The method as claimed in claim 7 , further comprising, after chamfering at least one of the cut portion of the first substrate and the cut portion of the second substrate, polishing at least one of the cut portion of the first substrate and the cut portion of the second substrate.
9. The method as claimed in claim 7 , wherein cutting the first substrate and the second substrate includes cutting the first substrate and the second substrate so that the first substrate and the second substrate each includes a first edge portion and a second edge portion connected to the first edge portion and having a length that is less than the first edge portion.
10. The method as claimed in claim 9 , wherein the chamfering includes chamfering the first edge portion and the second edge portion so that a first surface roughness of the first edge portion is less than a second surface roughness of the second edge portion.
11. The method as claimed in claim 10 , wherein the first surface roughness ranges from 0.05 μm to 0.8 μm.
12. The method as claimed in claim 10 , wherein the chamfering is performed so that the first surface roughness of the first edge portion increases from a center portion of the first edge portion toward end portions of the first edge portion in a length direction.
13. The method as claimed in claim 12 , wherein the chamfering includes grinding the first and second edge portions while moving a grinder that rotates, and a first velocity of the grinder when the grinder moves along the first edge portion is less than a second velocity of the grinder when the grinder moves along the second edge portion.
14. The method as claimed in claim 13 , wherein the first velocity increases as the grinder moves from the center portion of the first edge portion toward the end portions of the first edge portion.
15. The method as claimed in claim 7 , wherein compressing the first and second substrates includes compressing the first and second substrates so that at least one of the first substrate and the second substrate is a curved surface having a plurality of radii of curvature or a constant curvature.
16. A method of manufacturing a display apparatus, the method comprising:
cutting a first substrate on which a display unit is formed, and cutting a second substrate to correspond to a size of the first substrate;
chamfering one or more of a cut portion of the first substrate or a cut portion of the second substrate;
attaching the second substrate to the first substrate; and
compressing the first substrate and the second substrate so that the first substrate and the second substrate have curvatures.
17. The method as claimed in claim 16 , further comprising, after chamfering at least one of the cut portion of the first substrate and the cut portion of the second substrate, polishing at least one of the cut portion of the first substrate and the cut portion of the second substrate.
18. The method as claimed in claim 16 , wherein cutting the first and second substrates includes cutting the first substrate and the second substrate so that the first substrate and the second substrate each includes a first edge portion and a second edge portion connected to the first edge portion and having a length that is less than the first edge portion.
19. The method as claimed in claim 18 , wherein the chamfering includes grinding the first and second edge portions while moving a grinder that rotates, and a first velocity of the grinder when the grinder moves along the first edge portion is less than a second velocity of the grinder when the grinder moves along the second edge portion.
20. The method as claimed in claim 19 , wherein the first velocity increases as the grinder moves from a center portion of the first edge portion toward end portions of the first edge portion.