Light emitting diode package and method of manufacturing the same
US-8963188-B2 · Feb 24, 2015 · US
US9470395B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9470395-B2 |
| Application number | US-201313834599-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2013 |
| Priority date | Mar 15, 2013 |
| Publication date | Oct 18, 2016 |
| Grant date | Oct 18, 2016 |
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Disclosed are optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.
Opening claim text (preview).
We claim: 1. A circuit board comprising: a. an upper surface on which at least one light emitting diode and at least one electronic component are positioned; b. an optic positioned on the upper surface of the circuit board, wherein the optic comprises: i. at least one lens positioned over the at least one light emitting diode such that an air gap exists between the at least one lens and at least one light emitting diode; and ii. a portion integral with the at least one lens and having a lower surface that conforms to the shape of the at least one electronic component so as to seal and protect the at least one electronic component on the circuit board, wherein: the at least one lens of the optic comprises (i) an inner optic having optical properties and an outer surface and (ii) an outer optic having optical properties different than the optical properties of the inner optic and an inner surface; the outer surface of the inner optic and the inner surface of the outer optic contact such that no gap exists between the inner optic and the outer optic of the at least one lens; the inner optic comprises an interlocking feature that the outer optic engages to mechanically interlock the inner and outer optic; the interlocking feature of the inner optic comprises a groove; the outer optic comprises a protrusion configured to engage in the groove; and the protrusion extends in a direction parallel to the upper surface of the circuit board. 2. The circuit board of claim 1 , wherein the optic comprises silicone. 3. The circuit board of claim 1 , wherein the circuit board further comprises at least one aperture that extends at least partially through the circuit board and wherein the lower surface of the optic extends at least partially within the aperture. 4. The circuit board of claim 3 , wherein the at least one aperture extends entirely through the circuit board. 5. The circuit board of claim 1 , wherein the inner optic comprises silicone and the outer optic comprises silicone different from the silicone of the inner optic. 6. A circuit board comprising: a. an upper surface on which at least one light emitting diode and at least one electronic component are mounted; b. a reflective surface coating having a lower surface that conforms to the upper surface of the circuit board, wherein the reflective surface coating terminates proximate the at least one light emitting diode; and c. an optic positioned on the upper surface of the circuit board, wherein the optic comprises: (i) at least one lens positioned over the at least one light emitting diode such that an air gap exists between the at least one lens and the at least one light emitting diode; and (ii) a portion integral with the at least one lens and having a lower surface that conforms to the shape of the at least one electronic component so as to seal and protect the at least one electronic component on the circuit board, wherein: the reflective surface coating is adapted to direct light emitted by the at least one light emitting diode toward the at least one lens; the at least one lens of the optic comprises (i) an inner optic having optical properties and an outer surface and (ii) an outer optic having optical properties different than the optical properties of the inner optic and an inner surface; the outer surface of the inner optic and the inner surface of the outer optic contact such that no gap exists between the inner optic and the outer optic of the at least one lens; the inner optic comprises an interlocking feature that the outer optic engages to mechanically interlock the inner and outer optic; the interlocking feature of the inner optic comprises a groove; the outer optic comprises a protrusion configured to engage in the groove; and the protrusion extends in a direction parallel to the upper surface of the circuit board. 7. The circuit board of claim 6 , wherein the optic comprises silicone. 8. The circuit board of claim 6 , wherein the reflective surface coating comprises silicone. 9. The circuit board of claim 6 , wherein the inner optic and the outer optic comprise silicone. 10. The circuit board of claim 6 , wherein the optic covers at least a portion of an upper surface of the reflective surface coating. 11. The circuit board of claim 6 , wherein the circuit board further comprises at least one aperture that extends at least partially through the circuit board and wherein the reflective surface coating extends at least partially within the aperture. 12. The circuit board of claim 1 , wherein the at least one electronic component comprises a trace or resistor. 13. The circuit board of claim 1 , wherein: the at least one light emitting diode comprises a plurality of light emitting diodes; and the optic covers all of the plurality of light emitting diodes. 14. The circuit board of claim 1 , wherein the optic covers the entire upper surface of the circuit board.
characterised by coatings · CPC title
Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008) · CPC title
characterised by the material · CPC title
Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title
the substrate is supporting also the light source · CPC title
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