Lighting device with electrostatically adhered scattering particles and method of manufacture

Patent metadata

Field	Value
Publication number	US-9470380-B2
Application number	US-201214122288-A
Country	US
Kind code	B2
Filing date	Jun 5, 2012
Priority date	Jun 10, 2011
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A lighting device has an array of light emitting diodes (LEDs), an adhesion layer having portions with photo-activated electrical conductivity over the LEDs, and electrically charged scattering particles adhered by electrostatic attraction to the adhesion layer portions, thereby forming scattering regions that are self-aligned to the light emitting diodes. A method for manufacturing the lighting device includes photo-activating the adhesion layer using light output from the light emitting diodes to locally vary the conductivity of the adhesion layer; and attaching electrically charged scattering particles to the adhesion layer by electrostatic attraction.

First claim

The invention claimed is:

1. A light output device comprising:
an array of electrically interconnected light emitting diodes;
a substrate layer within which or on which the light emitting diode array is positioned;
an adhesion layer having portions over the light emitting diodes, wherein the adhesion layer portions have a photo-activated electrical conductivity and
electrically charged scattering particles adhered by electrostatic attraction to the adhesion layer portions, thereby forming scattering regions that are self-aligned to the light emitting diodes.

2. A device as claimed in claim 1 , wherein the substrate layer is flexible.

3. A device as claimed in claim 2 , wherein the substrate layer comprises silicone.

4. A device as claimed in claim 3 , wherein the scattering particles comprise TiO 2 particles.

5. A device as claimed in claim 4 , wherein a light guide layer is positioned between the substrate layer and the adhesion layer.

6. A method of manufacturing a light output device, comprising:
positioning an array of electrically interconnected light emitting diodes into a substrate layer;
providing an adhesion layer over the light emitting diodes;
photo-activating the adhesion layer using light output from the light emitting diodes to locally vary the conductivity of the adhesion layer; and
attaching electrically charged scattering particles to the adhesion layer by electrostatic attraction.

7. A method as claimed in claim 6 , further comprising curing the scattering particles in their attracted positions.

Assignees

• Cornelissen Hugo Johan
• Van Delden Martinus Hermanus Wilhelmus Maria
• Gommans Hendrikus Hubertus Petrus
• Stofmeel Leon Wilhelmus Godefridus
• Cennini Giovanni
• Yu Jianghong
• Koninl Philips Electronics Nv

Inventors

• Cornelissen Hugo Johan
• Van Delden Martinus Hermanus Wilhelmus Maria
• Gommans Hendrikus Hubertus Petrus
• Stofmeel Leon Wilhelmus Godefridus
• Cennini Giovanni
• Yu Jianghong

Classifications

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8516

  having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient · CPC title

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title