Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

Patent metadata

Field	Value
Publication number	US-9468994-B2
Application number	US-201414263416-A
Country	US
Kind code	B2
Filing date	Apr 28, 2014
Priority date	May 24, 2013
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.

First claim

What is claimed is:

1. A sensor unit comprising:
a first sensor device provided with a first electrode disposed on an outer surface and a second electrode disposed on the outer surface; and
a board having:
a first board surface and a second board surface opposite to each other;
a first board side surface that is continuously formed between the first and second board surfaces;
a first conductive terminal arranged at a peripheral of the first board surface next to the first board side surface; and
a second conductive terminal arranged at a peripheral of the second board surface next to the first board side surface, wherein

the first board side surface abuts the outer surface of the first sensor device so that the outer surface is divided into first and second divided outer surfaces,
the first and second electrodes are disposed on the first and second divided outer surfaces, respectively,
the first and second electrodes are electrically connected to the first and second conductive terminals via first and second conductive bodies, respectively,
the second electrode and the second conductive terminal are electrically connected to each other via the second conductive body and a connection member, and the connection member is at least one of a chip resistor and a chip capacitor, and
a first projection length of the first divided outer surface that is projected out from a side of the first board surface is smaller than a second projection length of the second divided outer surface that is projected out from a side of the second board surface.

2. The sensor unit according to claim 1 , wherein
a first electronic component is mounted on the first board surface of the board, and
a maximum thickness of the first electronic component is equal to or smaller than the first projection length.

3. The sensor unit according to claim 1 , wherein
a second electronic component is mounted on the second board surface of the board, and
a maximum thickness of the second electronic component is equal to or smaller than the second projection length.

4. The sensor unit according to claim 1 , further comprising:
a second sensor device wherein
the board has a second board side surface that is continuously formed between the first and second board surfaces, and the second board side surface intersects the first board side surface, and
the second sensor device is disposed a on the second board side surface.

5. The sensor unit according to claim 4 , wherein
the board has a rectangular shape, and
the first sensor device and the second sensor device are disposed respectively on the first and second board side surfaces so that the first sensor device and the second sensor device are located adjacent to each other.

6. The sensor unit according to claim 1 , wherein
the first board side surface has a cut-out in which the first sensor device is disposed, and
a depth of the cut-out is larger than a thickness of the first sensor device.

7. The sensor unit according to claim 1 , further comprising:
a third sensor device that is mounted on one of the first board surface and the second board surface, and
an integrated circuit that is mounted on the other of the first board surface and the second board surface.

8. An electronic apparatus comprising:
the sensor unit according to claim 1 .

9. A moving object comprising:
the sensor unit according to claim 1 .

10. A method of manufacturing a sensor unit, comprising:
providing a sensor device having a first electrode disposed on an outer surface and a second electrode disposed on the outer surface;
providing a board, the board having:
a first board surface and a second board surface opposite to each other;
a board side surface that is continuously formed between the first and second board surfaces;
a first conductive terminal arranged at a peripheral of the first board surface next to the board side surface; and
a second conductive terminal arranged at a peripheral of the second board surface next to the board side surface;

disposing the outer surface of the sensor device on the board side surface of the board so that the outer surface is divided into first and second divided outer surfaces, the first and second electrodes being disposed on the first and second divided outer surfaces, respectively;
irradiating obliquely the first conductive terminal and the first electrode with a laser beam to melt a conductive material to form a first conductive body adapted to connect the first electrode and the first conductive terminal to each other irradiating obliquely the second conductive terminal and the second electrode with the laser beam to melt a conductive material to form a second conductive body adapted to connect the second electrode and the second conductive terminal to each other, wherein
the second electrode and the second conductive terminal are electrically connected to each other via the second conductive body and a connection member, and the connection member is at least one of a chip resistor and a chip capacitor, and
a first projection length of the first divided outer surface that is projected out from a side of the first board surface is smaller than a second projection length of the second divided outer surface that is projected out from a side of the second board surface.

Assignees

• Seiko Epson Corp

Inventors

• Kinoshita Yusuke
• Kobayashi Yoshihiro
• Saito Yoshikuni
• Sakuma Masayasu

Classifications

• H05K2201/10022

  Non-printed resistor · CPC title

• H05K2201/1053

  Mounted components directly electrically connected to each other, i.e. not via the PCB · CPC title

• H05K2201/10151

  Sensor · CPC title

• B23K26/211 Primary

  with interposition of special material to facilitate connection of the parts · CPC title

• G01C19/00 Primary

  Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects · CPC title