Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels

Patent metadata

Field	Value
Publication number	US-9468131-B2
Application number	US-201414254518-A
Country	US
Kind code	B2
Filing date	Apr 16, 2014
Priority date	Apr 16, 2014
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.

First claim

What is claimed is:

1. A cooling system comprising:
a plurality of walls having a plurality of mounting rails and a plurality of embedded cooling channels arranged in a multi-planar arrangement, at least a portion of the embedded cooling channels embedded in one or more of the mounting rails, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations proximate to the mounting rails, the cooling fluid configured to absorb heat transferred from a heat source mounted to at least one of the mounting rails;
wherein at least one interface is disposed in at least one of the walls, the at least one interface configured to allow the cooling fluid to enter or exit the cooling system;
wherein at least some of the embedded cooling channels form a multiple helix configured to carry the cooling fluid towards and away from the heat source repeatedly in a cyclical manner; and
wherein the walls, the mounting rails, and the embedded cooling channels are formed integrally and without seams using an additive manufacturing process.

2. The cooling system of claim 1 , wherein the walls, the mounting rails, and the embedded cooling channels are formed integrally using a Selective Laser Melting (SLM) process.

3. The cooling system of claim 1 , wherein the embedded cooling channels are configured to carry the cooling fluid in a continuous fashion through at least two of the walls of the cooling system.

4. The cooling system of claim 1 , wherein each mounting rail has a length from a first end to a second end, and at least a portion of the embedded cooling channels embedded in the one or more mounting rails extends substantially along the length of the one or more mounting rails.

5. The cooling system of claim 1 , wherein the cooling system comprises at least one portion that is formed as a lattice, web, or mesh in the additive manufacturing process.

6. The cooling system of claim 1 , wherein each cooling channel comprises a plurality of channel walls that define an interior space of the cooling channel, wherein a plurality of heat transfer structures project from at least one of the channel walls into the interior space of the cooling channel.

7. The cooling system of claim 6 , wherein the plurality of heat transfer structures comprises at least one of: a pin shaped fin, a pigtail shaped fin, or a tear drop shaped fin.

8. An electronics chassis configured to house and cool a plurality of heat generating electronics, the electronics chassis comprising:
at least one cold wall having a plurality of mounting rails and a plurality of embedded cooling channels arranged in a multi-planar arrangement, at least a portion of the embedded cooling channels embedded in one or more of the mounting rails, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations proximate to the mounting rails, the cooling fluid configured to absorb heat transferred from a heat generating electronic source mounted to at least one of the mounting rails,
wherein at least some of the embedded cooling channels form a multiple helix configured to carry the cooling fluid towards and away from the heat generating electronic source repeatedly in a cyclical manner, and
wherein the at least one cold wall, the mounting rails, and the embedded cooling channels are formed integrally and without seams using an additive manufacturing process.

9. The electronics chassis of claim 8 , wherein the at least one cold wall, the mounting rails, and the embedded cooling channels are formed using a Selective Laser Melting (SLM) process.

10. The electronics chassis of claim 8 , wherein the at least one cold wall comprises multiple cold walls, and the embedded cooling channels are configured to carry the cooling fluid in a continuous fashion through at least two of the cold walls of the electronics chassis.

11. The electronics chassis of claim 8 , wherein each mounting rail has a length from a first end to a second end, and at least a portion of the embedded cooling channels embedded in the one or more mounting rails extends substantially along the length of the one or more mounting rails.

12. The electronics chassis of claim 8 , wherein the electronics chassis comprises at least one portion that is formed as a lattice, web, or mesh in the additive manufacturing process.

13. The electronics chassis of claim 8 , wherein each cooling channel comprises a plurality of walls that define an interior space of the cooling channel, wherein a plurality of heat transfer structures project from at least one of the walls into the interior space of the cooling channel.

14. The electronics chassis of claim 13 , wherein the plurality of heat transfer structures comprises at least one of: a pin shaped fin, a pigtail shaped fin, or a tear drop shaped fin.

15. A method comprising:
forming an electronics chassis comprising at least one cold wall having a plurality of mounting rails and a plurality of cooling channels formed integrally and without seams using an additive manufacturing process, at least a portion of the cooling channels embedded in one or more of the mounting rails;
wherein the embedded cooling channels are arranged in a multi-planar arrangement and configured to carry a cooling fluid to a plurality of locations proximate to the mounting rails, the cooling fluid configured to absorb heat transferred from a heat generating source mounted to at least one of the mounting rails; and
wherein at least some of the embedded cooling channels form a multiple helix configured to carry the cooling fluid towards and away from the heat generating source repeatedly in a cyclical manner.

16. The method of claim 15 , wherein the at least one cold wall, the mounting rails, and the embedded cooling channels are formed integrally using a Selective Laser Melting (SLM) process.

17. The method of claim 15 , wherein the at least one cold wall comprises multiple cold walls, and wherein the embedded cooling channels are configured to carry the cooling fluid in continuous fashion through at least two walls of the electronics chassis.

18. The method of claim 15 , wherein each mounting rail has a length from a first end to a second end, and at least a portion of the embedded cooling channels embedded in the one or more mounting rails extends substantially along the length of the one or more mounting rails.

19. The method of claim 15 , wherein the electronics chassis comprises at least one portion that is formed as a lattice, web, or mesh in the additive manufacturing process.

20. The method of claim 15 , wherein each cooling channel comprises a plurality of walls that define an interior space of the cooling channel, wherein a plurality of heat transfer structures project from at least one of the walls into the interior space of the cooling channel.

21. The method of claim 20 , wherein the plurality of heat transfer structures comprises at least one of: a pin shaped fin, a pigtail shaped fin, or a tear drop shaped fin.

Assignees

• Raytheon Co

Inventors

• Brandt David B
• Dodds Robert K
• Chu David W
• Allen Alicia G
• Schaefer Gregory P

Classifications

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20636

  within sub-racks for removing heat from electronic boards · CPC title

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title