Optical element module

Patent metadata

Field	Value
Publication number	US-9466942-B2
Application number	US-201414564270-A
Country	US
Kind code	B2
Filing date	Dec 9, 2014
Priority date	Jun 22, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

First claim

What is claimed is:

1. An optical element module comprising:
a casing having a bottom plate;
a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion;
a support member mounted on the temperature-adjusting unit in the casing; and
a semiconductor laser element being mounted on the support member and outputting a laser light to a front side, wherein
the upper layer portion of the temperature-adjusting unit projects at a rear side of the semiconductor laser element relative to the lower layer portion.

2. The optical element module according to claim 1 , wherein the temperature-adjusting unit is configured with a Peltier element having a structure that a plurality of semiconductor elements are disposed upright between substrates.

3. The optical element module according to claim 1 , wherein the semiconductor laser element has a DFB semiconductor laser portion.

4. The optical element module according to claim 3 , wherein the DFB semiconductor laser portion is positioned at the rear side of the semiconductor laser element.

5. The optical element module according to claim 3 , wherein the DFB semiconductor laser portion is positioned near a projecting portion of the upper layer portion of the temperature-adjusting unit.

6. The optical element module according to claim 3 , wherein the DFB semiconductor laser portion is disposed so that an end portion at the front side of the DFB semiconductor laser portion is disposed rearwardly by a distance equal to or larger than 0.5 mm, from an end, at the front side, of a superposed portion of the temperature-adjusting unit, the superposed portion being a portion in which the upper layer portion and the lower layer portion are superposed in a front-to rear direction of the semiconductor laser element.

7. The optical element module according to claim 1 , wherein 0.5<y/x<0.85 holds true, where x indicates a total of a length of a superposed portion of the upper layer portion and the lower layer portion of the temperature-adjusting unit in a front-to rear direction of the semiconductor laser element and a length of a projecting portion of the upper layer portion, and y indicates a length of the lower layer portion in the superposed portion.

8. The optical element module according to claim 4 , wherein the DFR semiconductor laser portion is disposed so that an end portion at the front side of the DFB semiconductor laser portion is disposed rearwardly by a distance equal to or larger than 0.5 mm from an end, at the front side, of a superposed portion of the temperature-adjusting unit, the superposed portion being a portion in which the upper layer portion and the lower layer portion are superposed in a front-to rear direction of the semiconductor laser element.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Matsuyama Tetsuya
• Ariga Maiko
• Sugaya Toshio
• Kimura Toshio

Classifications

• H01S5/02248

  Electricity · mapped topic

• H01S5/02208

  characterised by the shape of the housings · CPC title

• H01S5/0222

  Gas-filled housings · CPC title

• H01S5/12

  the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers (comprising a photonic bandgap structure H01S5/11; surface-emitting lasers H01S5/18) · CPC title

• H01S5/02446

  Cooling being separate from the laser chip cooling · CPC title