Method of depositing metals using high frequency plasma

Patent metadata

Field	Value
Publication number	US-9466524-B2
Application number	US-201313742596-A
Country	US
Kind code	B2
Filing date	Jan 16, 2013
Priority date	Jan 31, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

Methods for depositing metal layers, and more specifically TaN layers, using CVD and ALD techniques are provided. In one or more embodiments, the method includes sequentially exposing a substrate to a metal precursor, or more specifically a tantalum precursor, followed by a high frequency plasma.

First claim

What is claimed is:

1. A method of depositing a tantalum nitride film on a surface of a substrate, the method comprising:
placing the substrate in a processing chamber comprising a gas distribution plate, the gas distribution plate comprising at least one first reactive gas injector and at least one second reactive gas injector, the at least one first reactive gas injector providing a tantalum precursor and the at least one second reactive gas injector providing a high frequency plasma, the at least one first reactive gas injector being separated from the at least one second reactive gas injector by one or more vacuum ports and one or more purge gas injectors; and
passing a portion of the substrate across the gas distribution plate in a first direction so that the portion of the substrate is sequentially exposed to the tantalum precursor followed by the high frequency plasma.

2. The method of claim 1 , wherein the high frequency plasma has a frequency greater than about 20 MHz.

3. The method of claim 1 , wherein the high frequency plasma comprises one or more of argon, hydrogen, ammonia, helium and nitrogen.

4. The method of claim 1 , wherein the high frequency plasma has a frequency of about 40 MHz.

5. The method of claim 1 , wherein the high frequency plasma has a pressure in the range of about 1 Torr to about 20 Torr.

6. The method of claim 1 , wherein the high frequency plasma is a capacitively coupled plasma.

7. The method of claim 1 , wherein the high frequency plasma has a power in the range of about 200 watts to about 1200 watts.

8. The method of claim 1 , wherein the tantalum precursor comprises one or more of pentakis(dimethylamino)tantalum (PDMAT), tantalum fluoride, tertbutylimido-tris(ethylmethylamino)tantalum (TBTEMT), tertbutylimido-tris(diethylamino)tantalum (TBTDEAT), tertbutylimido-tris(dimethylamino)tantalum (TBTDMAT), tertiaryamylimido-tris(dimethylamino)tantalum (TAIMATA), tertiaryamylimido-tris(diethylamino)tantalum, tertiaryamylimido-tris(methylethylamino)tantalum, pentakis(ethylmethylamino)tantalum (PEMAT), pentakis(diethylamido)tantalum (PDEAT), plasmas thereof, derivatives thereof, or combinations thereof.

9. The method of claim 1 , wherein the tantalum precursor is pentakis(dimethylamido)tantalum (PDMAT).

10. The method of claim 1 , further comprising heating the substrate to a temperature in the range of about 150° C. to about 350° C.

11. The method of claim 1 , further comprising adjusting a distance between the substrate and a gas distribution plate.

12. The method of claim 11 , wherein the distance between the substrate and the gas distribution plate is in the range of about 50 mil to about 800 mil.

13. The method of claim 11 , wherein the distance between the substrate and the gas distribution plate is in the range of about 300 mil and about 580 mil.

14. The method of claim 1 , wherein the resultant film has a lower resistivity than a similar film processed without the high frequency plasma.

15. The method of claim 1 , where in the resultant film has a higher density than a similar film processed without the high frequency plasma.

Assignees

• Applied Materials Inc

Inventors

• Ma Paul F
• Liu Guojun
• Lakshmanan Annamalai
• Wu Dien-Yeh
• Subramani Anantha K

Classifications

• H10P14/432

  using selective deposition · CPC title

• H10W20/0523

  by irradiating with ultraviolet or particle radiation · CPC title

• H10W20/032

  of conductive barrier, adhesion or liner layers · CPC title

• H10W20/031 Primary

  of conductive parts of the interconnections · CPC title

• C23C16/34 Primary

  Nitrides {(C23C16/303 takes precedence)} · CPC title