Input device layers and nesting

US9465412B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9465412-B2
Application numberUS-201414517048-A
CountryUS
Kind codeB2
Filing dateOct 17, 2014
Priority dateMar 2, 2012
Publication dateOct 11, 2016
Grant dateOct 11, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Input device layer and nesting techniques are described. In one or more implementations, an input device includes a pressure sensitive key assembly including a substrate having a plurality of hardware elements secured to a surface. The input device also includes one or more layers disposed proximal to the surface, the one or more layers having respective openings configured to nest the one or more hardware elements therein.

First claim

Opening claim text (preview).

What is claimed is: 1. An input device comprising: a key assembly including a sensor substrate having a first side and a second side opposite the first side, and a plurality of surface mount hardware elements secured to the second side and extending above the second side; and one or more layers disposed on the second side of the sensor substrate, the one or more layers having one or more openings therein such that at least a portion of the surface mount hardware elements is disposed through the one or more openings thereby nesting the surface mount hardware elements within the one or more layers. 2. An input device as described in claim 1 , wherein the one or more layers include a support board. 3. An input device as described in claim 2 , wherein the one or more layers also include a support layer disposed between the support board and the sensor substrate, the support layer configured to extend through a flexible hinge to a connection portion that is configured to provide a communicative coupling to a computing device. 4. An input device as described in claim 3 , wherein the connection portion is configured to implement a removable physical coupling with the computing device using one or more magnetic coupling devices. 5. An input device as described in claim 1 , wherein the surface mount hardware elements include one or more of a processor or a sensor. 6. An input device as described in claim 1 , wherein the sensor substrate includes one or more conductors disposed on the first side of the sensor substrate, and the key assembly further includes a flexible contact layer spaced apart from the sensor substrate and configured to flex in response to an application of pressure to contact the sensor substrate to initiate an input for a computing device that is communicatively coupled to the input device. 7. An input device as described in claim 1 , wherein the key assembly includes a plurality of mechanical keys or capacitive sensors. 8. An input device as described in claim 1 , wherein the surface mount hardware elements include one or more linear regulators. 9. An input device as described in claim 1 , wherein the surface mount hardware elements include an authentication integrated circuit that is configured to authenticate the input device for operation with a computing device. 10. An input device comprising: a key assembly including a substrate having a plurality of surface mount hardware elements secured to a surface thereof and extending above the surface; one or more layers disposed proximal to the surface, the one or more layers having respective openings configured to nest the surface mount hardware elements therein; and a connection portion that is configured to provide a removable physical coupling with a computing device using one or more magnetic coupling devices. 11. An input device as described in claim 10 , wherein the one or more layers include a support board. 12. An input device as described in claim 11 , wherein the one or more layers also include a support layer disposed between the support board and the substrate, the support layer configured to extend through a flexible hinge to the connection portion. 13. An input device as described in claim 10 , wherein the surface mount hardware elements include one or more of an integrated circuit configured as a processor or an authentication integrated circuit that is configured to authenticate the input device for operation with the computing device. 14. An input device as described in claim 10 , wherein the surface mount hardware elements include an accelerometer. 15. An input device as described in claim 10 , wherein the surface mount hardware elements include one or more linear regulators. 16. A keyboard comprising: a key assembly including a sensor substrate having a hardware element secured to a surface thereof, the hardware element configured to process signals received from the key assembly into a respective human interface device (HID) compliant output; and one or more layers disposed proximal to the surface of the sensor substrate, the one or more layers having one or more openings therein such that at least a portion of the hardware element is disposed through the one or more openings thereby nesting the hardware element within the one or more layers. 17. A keyboard as described in claim 16 , wherein the key assembly also includes a different hardware element secured to the surface, the different hardware element configured as an accelerometer. 18. A keyboard as described in claim 16 , wherein the key assembly also includes a different hardware element secured to the surface, the different hardware element configured as a touch controller. 19. A keyboard as described in claim 16 , wherein the one or more layers include a support board and a support layer disposed between the support board and the sensor substrate, the support layer configured to extend through a flexible hinge to a connection portion that is configured to provide a communicative coupling to a computing device. 20. A keyboard as described in claim 16 , wherein the sensor substrate includes one or more conductors disposed on a different surface opposite the surface.

Assignees

Inventors

Classifications

  • by interfacing with external accessories (hands-free H04M1/60) · CPC title

  • Constructional details or processes of manufacture of the input device · CPC title

  • Assembling or joining · CPC title

  • using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser · CPC title

  • the display being foldable up to the back of the other housing with a single degree of freedom, e.g. by 360° rotation over the axis defined by the rear edge of the base enclosure · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9465412B2 cover?
Input device layer and nesting techniques are described. In one or more implementations, an input device includes a pressure sensitive key assembly including a substrate having a plurality of hardware elements secured to a surface. The input device also includes one or more layers disposed proximal to the surface, the one or more layers having respective openings configured to nest the one or m…
Who is the assignee on this patent?
Microsoft Technology Licensing Llc
What technology area does this patent fall under?
Primary CPC classification H01H13/704. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 11 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).