Wafer Stage Temperature Control
US-2015338747-A1 · Nov 26, 2015 · US
US9465304B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9465304-B2 |
| Application number | US-201313929505-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2013 |
| Priority date | Dec 23, 2008 |
| Publication date | Oct 11, 2016 |
| Grant date | Oct 11, 2016 |
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A system for making flexible circuit films includes an inelastic conveyor, a web handling apparatus configured to pass a flexible substrate around the inelastic conveyor, an image acquisition apparatus configured to measure positions of a first set of alignment marks on the flexible substrate at a first conveyor location, an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at a second conveyor location, and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks. The exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions.
Opening claim text (preview).
The invention claimed is: 1. A roll-to-roll photolithography system, comprising: an inelastic conveyor, wherein the inelastic conveyor consists of a single roller; a web handling apparatus configured to pass a flexible substrate around the conveyor such that the substrate and the conveyor move together at least from a first conveyor location to a second conveyor location; an image acquisition apparatus configured to measure positions of a first set of alignment marks on the substrate at the first conveyor location; an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at the second conveyor location; and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks; wherein the exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions; and wherein the image acquisition apparatus comprises an array of high resolution camera devices to generate a high resolution digital image of the first set of the alignment marks. 2. The system of claim 1 , wherein the image acquisition apparatus is configured to measure the positions of the first set of alignment marks while the substrate is in motion. 3. The system of claim 2 , wherein the image acquisition apparatus comprises a strobed light source. 4. The system of claim 1 , wherein the exposure apparatus is configured to patternwise expose the photosensitive material while the substrate is in motion. 5. The system of claim 1 , wherein the image processor is further configured to calculate a distortion of the substrate based on the comparison, and wherein the exposure apparatus is configured to patternwise expose the photosensitive material based on the calculated distortion. 6. The system of claim 1 , wherein the system is configured to synchronize operation of the image acquisition apparatus with operation of the exposure apparatus such that the exposure apparatus exposes a portion of the substrate that was measured by the image acquisition apparatus. 7. The system of claim 1 , wherein the image acquisition apparatus has an imaging area of length “L” at the first conveyor location, and a depth of focus “h”; and wherein the single roller has a minimum radius of curvature “r” according to the expression: r=L 2 /8 h. 8. The system of claim 1 , wherein the exposure apparatus has an exposure area of length “L” at the second conveyor location, and a depth of field “h”; and wherein the single roller has a minimum radius of curvature “r” according to the expression: r=L 2 /8 h. 9. The system of claim 1 , wherein the first and the second conveyor locations are far enough from first and last points of contact between the flexible substrate and the inelastic conveyor such that the flexible substrate cannot slip with respect to the inelastic conveyor. 10. The system of claim 1 , wherein the first set of alignment marks comprises more than 4 alignment marks. 11. A roll-to-roll photolithography system, comprising: an inelastic conveyor; a web handling apparatus configured to pass a flexible substrate around the conveyor such that the substrate and the conveyor move together at least from a first conveyor location to a second conveyor location; an image acquisition apparatus configured to measure positions of a first set of alignment marks on the substrate at the first conveyor location, wherein the first set of alignment marks comprises more than 4 alignment marks; an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at the second conveyor location; and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks; wherein the exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions; wherein the image processor is further configured to calculate a nonlinear distortion of the first portion of the flexible substrate; wherein the exposure apparatus is further configured to patternwise expose the photosensitive material based on the calculated nonlinear distortion; and wherein the image acquisition apparatus comprises an array of high resolution camera devices to generate a high resolution digital image of the first set of the alignment marks. 12. The system of claim 11 , wherein the image acquisition apparatus is configured to measure the positions of the first set of alignment marks while the substrate is in motion. 13. The system of claim 11 , wherein the exposure apparatus is configured to patternwise expose the photosensitive material while the substrate is in motion.
Alignment type or strategy, e.g. leveling, global alignment · CPC title
characterised by the exposure method of radiation-sensitive masks · CPC title
for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015) · CPC title
Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title
Monitoring a manufacturing process · CPC title
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