Resin, positive photosensitive resin composition and use
US-11886115-B1 · Jan 30, 2024 · US
US9465289B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9465289-B2 |
| Application number | US-201314416204-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 9, 2013 |
| Priority date | Dec 28, 2012 |
| Publication date | Oct 11, 2016 |
| Grant date | Oct 11, 2016 |
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The present invention discloses a photosensitive resin composition for an insulating film of a display device including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a color material having a maximum absorption wavelength of 400 to 550 nm; and (D) a solvent, an insulation film using the same, and a display device including the insulation film.
Opening claim text (preview).
The invention claimed is: 1. A photosensitive resin composition for an insulating film of a display device, comprising: (A) an alkali soluble resin, wherein the alkali soluble resin (A) is a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) a color material having a maximum absorption wavelength of 400 to 550 nm; and (D) a solvent, wherein the color material includes a compound represented by the following Chemical Formula 10, a compound represented by the following Chemical Formula 11, or a combination thereof: wherein in the above Chemical Formula 10, R 1 to R 6 are independently selected from hydrogen, a halogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, and a substituted or unsubstituted C6 to C30 heteroaryl group; wherein in the above Chemical Formula 11, R 11 to R 14 and R 20 to R 39 are each independently selected from a hydrogen atom, a halogen atom, a hydroxy group, a sulfonic acid group (—SO 3 H), a nitro group, a carboxyl group, a cyan group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C3 to C20 heterocycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C6 to C30 heteroaryl group, and a combination thereof, and Z is selected from two hydrogen atoms, a divalent metal atom, a divalent metal oxide, a divalent metal hydroxide, and a divalent metal chloride. 2. The photosensitive resin composition of claim 1 comprising: 5 to 100 parts by weight of the photosensitive diazoquinone compound (B); 1 to 30 parts by weight of the color material (C); and 100 to 900 parts by weight of the solvent (D) based on 100 parts by weight of the alkali soluble resin (A). 3. The photosensitive resin composition of claim 1 , further comprising a silane compound. 4. The photosensitive resin composition of claim 1 , further comprising a phenol compound. 5. An insulation film of a display device manufactured using the photosensitive resin compositions according to claim 1 . 6. A display device including the insulation film according to claim 5 .
characterised by the non-macromolecular additives · CPC title
characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides · CPC title
having substances, e.g. indicators, for forming visible images · CPC title
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