(Meth)acrylate polymer, a resin composition and a shaped article

Patent metadata

Field	Value
Publication number	US-9464218-B2
Application number	US-201514811214-A
Country	US
Kind code	B2
Filing date	Jul 28, 2015
Priority date	Mar 10, 2009
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more.
This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.

First claim

The invention claimed is:

1. A resin composition comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).

2. The resin composition according to claim 1 , wherein the curable resin is an epoxy resin.

3. The resin composition according to claim 2 , further comprising a curing agent.

4. The resin composition according to claim 1 , further comprising a curing agent.

5. A shaped article obtained with shaping of the resin composition according to claim 1 .

6. A sealing material for semiconductors comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).

7. The sealing material according to claim 6 , wherein said curable resin is an epoxy resin.

8. The sealing material according to claim 6 , further comprising a curing agent.

9. An adhesive comprising:
100 parts by mass of a curable resin; and
0.1 to 50 parts by mass of a (meth)acrylate polymer having the following properties: a volume average primary particle size of 0.520 to 3.00 μm; a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below; a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more; and an acetone-insoluble component of 99% by mass or more;
wherein the (meth)acrylate polymer contains 81 to 98% by mass of a rubbery (meth)acrylate polymer (A) having a glass transition temperature of −40° C. or below and 2 to 19% by mass of a polymerized monomer mixture (b), which is polymerized in the presence of said rubbery (meth)acrylate polymer (A), totaling 100% by mass;
said rubbery (meth)acrylate polymer (A) is obtained by polymerizing a monomer mixture (a) comprising 0.0001 to 2.5% by mass of a cross-linkable monomer (a1) and 69.999 to 99.999% by mass of a (meth)acrylate monomer (a2) capable of giving a homopolymer having a glass transition temperature of −40° C. or below, based on 100% by mass of monomer mixture (a); and
said monomer mixture (b) comprises 0.1% by mass or more of a cross-linkable monomer (b1) and 99.9% by mass or less of a vinyl monomer (b2), based on 100% by mass of monomer mixture (b).

10. The adhesive according to claim 9 , wherein said curable resin is an epoxy resin.

11. The adhesive according to claim 9 , further comprising a curing agent.

Assignees

• Mitsubishi Rayon Co

Inventors

• Wakita Tsuneki
• Kasai Toshihiro

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C09J151/003

  grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds (C09J151/04, C09J151/06 take precedence) · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08F220/1808

  C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate · CPC title

• C08F265/06 Primary

  Polymerisation of acrylate or methacrylate esters on to polymers thereof · CPC title