Conductive paste, method for forming conductive pattern, and object with printed conductive pattern

Patent metadata

Field	Value
Publication number	US-9464198-B2
Application number	US-201414440199-A
Country	US
Kind code	B2
Filing date	Jan 23, 2014
Priority date	Jan 30, 2013
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

First claim

The invention claimed is:

1. A conductive paste for bezel-pattern printing performed by a gravure offset printing process, the conductive paste comprising conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure,
wherein a ratio of non-volatile matter of the (B) to a total of the (A) to (D) in terms of mass is 1.0% to 3.0%, and
a mass ratio R/P of a total amount R of, in terms of mass of non-volatile matter, the organic compound (B) and the organic compound (C) used to an amount P of the conductive metal particles (A) used is 0.07 to 0.15.

2. The conductive paste according to claim 1 , wherein the organic solvent (D) has a blanket swelling ratio of 5% to 20%.

3. The conductive paste according to claim 1 , having a paste viscosity of 100 Pa·s or less at a shear rate of 1 s −1 and a paste viscosity of 2.0 to 5.0 Pa·s at a shear rate of 100 s −1 .

4. The conductive paste according to claim 1 , further comprising an organic compound having at least one functional group selected from the group consisting of a phosphoric acid group, phosphate groups, and phosphoric ester groups.

5. The conductive paste according to claim 1 , wherein the organic compound (B) includes a thermoplastic resin having a hydroxy group.

6. The conductive paste according to claim 1 , wherein the organic compound (B) includes a thermoplastic resin having a hydroxy group, and the organic compound (C) includes a blocked polyisocyanate compound and a polyfunctional epoxy compound and/or a high-molecular-weight polyol compound.

7. The conductive paste according to claim 1 , comprising no inorganic binder for bonding the conductive metal particles to a printing object, the inorganic binder melting at a temperature that is equal to or more than a decomposition temperature of the organic compound (B) and less than a melting point of the conductive metal particles.

8. A conductive-pattern-printed product formed with the conductive paste according to claim 1 .

9. The conductive paste according to claim 2 , having a paste viscosity of 100 Pa·s or less at a shear rate of 1 s −1 and a paste viscosity of 2.0 to 5.0 Pa·s at a shear rate of 100 s −1 .

10. The conductive paste according to claim 2 , further comprising an organic compound having at least one functional group selected from the group consisting of a phosphoric acid group, phosphate groups, and phosphoric ester groups.

11. The conductive paste according to claim 2 , wherein the organic compound (B) includes a thermoplastic resin having a hydroxy group.

12. The conductive paste according to claim 2 , wherein the organic compound (B) includes a thermoplastic resin having a hydroxy group, and the organic compound (C) includes a blocked polyisocyanate compound and a polyfunctional epoxy compound and/or a high-molecular-weight polyol compound.

13. The conductive paste according to claim 2 , comprising no inorganic binder for bonding the conductive metal particles to a printing object, the inorganic binder melting at a temperature that is equal to or more than a decomposition temperature of the organic compound (B) and less than a melting point of the conductive metal particles.

14. A method for forming a conductive pattern by a gravure offset printing process, the method employing a gravure plate having a bezel-pattern recess to be filled with a paste, a doctor configured to fill the paste into the recess of the gravure plate, and a blanket onto which the paste is transferred from the recess of the gravure plate, the method comprising:
supplying a printing object so as to face the blanket, making the printing object and the blanket come into contact with each other by pressing to print a pattern corresponding to a fine wiring pattern on the blanket onto the printing object, and subsequently performing firing,
wherein the paste is a conductive paste comprising:
conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure,
wherein a ratio of non-volatile matter of the (B) to a total of the (A) to (D) in terms of mass is 1.0% to 3.0%, and
a mass ratio R/P of a total amount R of, in terms of mass of non-volatile matter, the organic compound (B) and the organic compound (C) used to an amount P of the conductive metal particles (A) used is 0.07 to 0.15.

15. The method for forming a conductive pattern according to claim 14 , wherein the gravure plate has the recess corresponding to a bezel pattern, the recess having a line width of 10 to 50 μm and a depth of 5 to 20 μm.

16. The method for forming a conductive pattern according to claim 14 , comprising a step of, after the printing onto the printing object, drying the blanket having absorbed the organic solvent (D).

17. The method for forming a conductive pattern according to claim 14 , wherein the firing is performed at 150° C. or less.

18. The method for forming a conductive pattern according to claim 16 , wherein the printing object is a polyethylene terephthalate film or a transparent conductive film having a polyethylene terephthalate film as a support.

19. A method for forming a conductive pattern by a gravure offset printing process according to claim 14 , wherein the organic solvent (D) has a blanket swelling ratio of 5% to 20%.

20. The method for forming a conductive pattern according to claim 15 , comprising a step of, after the printing onto the printing object, drying the blanket having absorbed the organic solvent (D).

Assignees

• Dainippon Ink & Chemicals

Inventors

• Sente Yasuhiro
• Kanno Tsutomu
• Okamoto Tomoko
• Katayama Yoshinori

Classifications

• H05K3/1275

  by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing · CPC title

• H05K1/095 Primary

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title

• C09D5/24 Primary

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title