Addition-curable silicone composition, optical device encapsulating material and optical device

Patent metadata

Field	Value
Publication number	US-9464192-B2
Application number	US-201314654974-A
Country	US
Kind code	B2
Filing date	Nov 28, 2013
Priority date	Jan 10, 2013
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

An addition-curable silicone composition includes: a three-dimensional network organopolysiloxane having at least one alkenyl group and at least one aryl group in one molecule, having a siloxane unit represented by the following general formula, R 2 SiO, and SiO 2 , and not having a unit represented by RSiO 3/2 , wherein R represents an organic group; a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in one molecule; an organosilicon compound having at least two hydrogen atoms bonded to silicon atoms per one molecule, and not having an alkenyl group; and a hydrosilylation catalyst containing a platinum group metal. Thereby, there can be provided an addition-curable silicone composition which provides a cured product having high refractive index, transparency, and temperature cycling resistance, an optical device encapsulating material, and an optical device which is encapsulated with the optical device encapsulating material.

First claim

The invention claimed is:

1. An addition-curable silicone composition comprising:
A. a three-dimensional network organopolysiloxane having at least one alkenyl group and at least one aryl group in one molecule, having a siloxane unit represented by the following general formula,
R 2 SiO, and SiO 2 , and not having a unit represented by RSiO 3/2 ,
wherein R represents an organic group;

B. a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in one molecule;
C. an organosilicon compound having at least two hydrogen atoms bonded to silicon atoms per one molecule, and not having an alkenyl group, in an amount enough to cure the composition in the presence of a hydrosilylation catalyst described below; and
D. the hydrosilylation catalyst containing a platinum group metal.

2. The addition-curable silicone composition according to claim 1 , wherein the component A is a three-dimensional network organopolysiloxane represented by the following average composition formula,
(R 1 3 SiO 1/2 ) a (R 1 2 SiO) b (SiO 2 ) c   (1)

wherein R 1 independently represents an organic group; at least 1 mole % of all the R 1 is an alkenyl group; at least 10 mole % of all the R 1 is an aryl group; “a” represents 0 or a positive number; and “b” and “c” each represent a positive number, satisfying 0.1≦“b”/(a+b+c)≦0.8, and 0.2≦“c”/(a+b+c)≦0.8.

3. The addition-curable silicone composition according to claim 2 , wherein the component B is a linear organopolysiloxane represented by the following average composition formula,
(R 2 3 SiO 1/2 ) d (R 2 2 SiO) e   (2)

wherein R 2 independently represents an organic group; at least 0.1 mole % of all the R 2 is an alkenyl group; at least 10 mole % of all the R 2 is an aryl group; and “d” and “e” each represent a positive number, satisfying 0.001≦“d”/(d+e)≦0.7.

4. The addition-curable silicone composition according to claim 3 , wherein the component C is an organopolysiloxane represented by the following average composition formula,
(R 3 3 SiO 1/2 ) f (R 3 2 SiO) g (R 3 SiO 3/2 ) h   (3)

wherein:
R 3 represents an identical or different organic group or a hydrogen atom other than an alkenyl group; 0.1 to 50 mole % of all the R 3 is a hydrogen atom; 10 mole % or more of all the R 3 is an aryl group; “f” represents a positive number; and “g” and “h” each represent 0 or a positive number;
0.01≦“f”/(f+g+h)≦0.75 is satisfied;
in a case where “g” represents a positive number, 0.01≦“f”/“g”≦2 is satisfied; and
in a case where “h” represents a positive number, 0.1≦“f”/“h”≦3 is satisfied.

5. The addition-curable silicone composition according to claim 4 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

6. The addition-curable silicone composition according to claim 3 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

7. The addition-curable silicone composition according to claim 2 , wherein the component C is an organopolysiloxane represented by the following average composition formula,
(R 3 3 SiO 1/2 ) f (R 3 2 SiO) g (R 3 SiO 3/2 ) h   (3)

wherein:
R 3 represents an identical or different organic group or a hydrogen atom other than an alkenyl group; 0.1 to 50 mole % of all the R 3 is a hydrogen atom; 10 mole % or more of all the R 3 is an aryl group; “f” represents a positive number; and “g” and “h” each represent 0 or a positive number;
0.01≦“f”/(f+g+h)≦0.75 is satisfied;
in a case where “g” represents a positive number, 0.01≦“f”/“g”≦2 is satisfied; and
in a case where “h” represents a positive number, 0.1≦“f”/“h”≦3 is satisfied.

8. The addition-curable silicone composition according to claim 7 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

9. The addition-curable silicone composition according to claim 2 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

10. The addition-curable silicone composition according to claim 1 , wherein the component B is a linear organopolysiloxane represented by the following average composition formula,
(R 2 3 SiO 1/2 ) d (R 2 2 SiO) e   (2)

wherein R 2 independently represents an organic group; at least 0.1 mole % of all the R 2 is an alkenyl group; at least 10 mole % of all the R 2 is an aryl group; and “d” and “e” each represent a positive number, satisfying 0.001≦“d”/(d+e)≦0.7.

11. The addition-curable silicone composition according to claim 10 , wherein the component C is an organopolysiloxane represented by the following average composition formula,
(R 3 3 SiO 1/2 ) f (R 3 2 SiO) g (R 3 SiO 3/2 ) h   (3)

wherein:
R 3 represents an identical or different organic group or a hydrogen atom other than an alkenyl group; 0.1 to 50 mole % of all the R 3 is a hydrogen atom; 10 mole % or more of all the R 3 is an aryl group; “f” represents a positive number; and “g” and “h” each represent 0 or a positive number;
0.01≦“f”/(f+g+h)≦0.75 is satisfied;
in a case where “g” represents a positive number, 0.01≦“f”/“g”≦2 is satisfied; and
in a case where “h” represents a positive number, 0.1≦“f”/“h”≦3 is satisfied.

12. The addition-curable silicone composition according to claim 11 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

13. The addition-curable silicone composition according to claim 10 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

14. The addition-curable silicone composition according to claim 1 , wherein the component C is an organopolysiloxane represented by the following average composition formula,
(R 3 3 SiO 1/2 ) f (R 3 2 SiO) g (R 3 SiO 3/2 ) h   (3)

wherein:
R 3 represents an identical or different organic group or a hydrogen atom other than an alkenyl group; 0.1 to 50 mole % of all the R 3 is a hydrogen atom; 10 mole % or more of all the R 3 is an aryl group; “f” represents a positive number; and “g” and “h” each represent 0 or a positive number;
0.01≦“f”/(f+g+h)≦0.75 is satisfied;
in a case where “g” represents a positive number, 0.01≦“f”/“g”≦2 is satisfied; and
in a case where “h” represents a positive number, 0.1≦“f”/“h”≦3 is satisfied.

15. The addition-curable silicone composition according to claim 14 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

16. The addition-curable silicone composition according to claim 1 , wherein the amount of the component B is a mass ratio of 0.01 to 100, relative to the component A, and the amount of the component C is a mass ratio of 0.01 to 100, relative to the total of the components A and B.

Assignees

• Shinetsu Chemical Co

Inventors

• Kimura Shinji

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title