Moisture-curable polyurethane hot-melt resin composition, adhesive, and article

Patent metadata

Field	Value
Publication number	US-9464155-B2
Application number	US-201314391271-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Apr 12, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

An object of the present invention is to provide a moisture-curable polyurethane hot-melt resin composition with superior properties such as water resistance, fast-curing properties, and flexibility. The present invention provides a moisture-curable polyurethane hot-melt resin composition containing an isocyanate-containing urethane prepolymer (i) that is a reaction product of polyols (A) including a polyether polyol (A-1), a crystalline polyester polyol (A-2), an amorphous polyester polyol (A-3), and an acrylic polyol (A-4) with a polyisocyanate (B); and a curing catalyst (ii) represented by general formula (1) below, and also provides an adhesive and article produced using the resin composition. The adhesive produced using the moisture-curable polyurethane hot-melt resin composition according to the present invention is suitable not only for the bonding of fibers and the lamination of construction materials, but also for the lamination of optical elements.

First claim

The invention claimed is:

1. A moisture-curable polyurethane hot-melt resin composition comprising:
an isocyanate-containing urethane prepolymer (i) being a reaction product of polyols (A) including a polyether polyol (A-1), a crystalline polyester polyol (A-2), an amorphous polyester polyol (A-3), and an acrylic polyol (A-4) with a polyisocyanate (B); and
a curing catalyst (ii) represented by general formula (1):

wherein:
R 1 and R 2 are independently at each occurrence hydrogen or alkyl, and n is independently at each occurrence an integer of 1 to 6;
the amorphous polyester polyol (A-3) is a reaction product of an alkylene oxide adduct of bisphenol A with a polybasic acid; and
the amorphous polyester polyol (A-3) has a glass transition temperature of −70° C. to −10° C.

2. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , wherein the acrylic polyol (A-4) has a number average molecular weight of 5,000 to 50,000.

3. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , wherein the acrylic polyol (A-4) has a glass transition temperature of 30° C. to 120° C.

4. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , wherein the acrylic polyol (A-4) is used in an amount of 20 to 400 parts by mass based on 100 parts by mass of the polyether polyol (A-1).

5. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , wherein the curing catalyst (ii) is at least one selected from the group consisting of dimorpholinodiethyl ether and bis(2,6-dimethylmorpholinoethyl) ether.

6. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , wherein the curing catalyst (ii) is used in an amount of 0.05 to 5.0 parts by mass based on 100 parts by mass of the urethane prepolymer (i).

7. The moisture-curable polyurethane hot-melt resin composition according to claim 1 , further comprising an acrylic resin (iii).

8. The moisture-curable polyurethane hot-melt resin composition according to claim 7 , wherein the acrylic resin (iii) has a glass transition temperature of 0° C. or lower.

9. The moisture-curable polyurethane hot-melt resin composition according to claim 7 , wherein the acrylic resin (iii) is used in an amount of 0.5 to 50 parts by mass based on 100 parts by mass of the polyols (A).

10. An adhesive prepared using the moisture-curable polyurethane hot-melt resin composition according to claim 1 .

11. An article comprising at least two members laminated together with the adhesive according to claim 10 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Kanagawa Yoshinori
• Fujiwara Toyokuni
• NONAKA Ryou

Classifications

• C08G18/307

  Atmospheric humidity · CPC title

• C09J175/04

  Polyurethanes · CPC title

• C08G18/12 Primary

  using two or more compounds having active hydrogen in the first polymerisation step · CPC title

• C08G18/7671

  containing only one alkylene bisphenyl group · CPC title

• Y10T428/31504

  Composite [nonstructural laminate] · CPC title