Light emitter devices and methods for light emitting diode (LED) chips

Patent metadata

Field	Value
Publication number	US-9461024-B2
Application number	US-201313956814-A
Country	US
Kind code	B2
Filing date	Aug 1, 2013
Priority date	Aug 1, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips, and can include providing a substrate and a plurality of LED chips over the substrate. The devices and methods described herein can further include providing a plurality of integral lenses over the LED chips, where at least some of the lenses can be distorted. In some aspects, the distorted lenses can be compressed towards each other along one or more directions.

First claim

What is claimed is:

1. A light emitter device comprising:
a substrate;
at least two light emitting diode (LED) chips disposed over the substrate; and
at least two lenses provided over the substrate and contacting the at least two LED chips, wherein each lens comprises a respective lens base at least partially disposed over the substrate and an apex centrally located with respect to each respective lens base and one or more of the at least two LED chips, wherein at least a portion of at least one of the lenses adjacent another lens is distorted, and wherein each respective lens base at least partially surrounds one or more of the at least two LED chips.

2. The light emitter device according to claim 1 , wherein the at least two lenses are integrally formed.

3. The light emitter device according to claim 1 , wherein the lenses are both distorted.

4. The light emitter device according to claim 3 , wherein the lenses are compressed towards each other.

5. The light emitter device according to claim 1 , wherein the portion of the lens distorted is linear.

6. The light emitter device according to claim 1 , wherein at least one lens is bounded by one or more linear surfaces and one or more curved surfaces.

7. The light emitter device according to claim 6 , wherein the linear surfaces are elevated over the substrate and parallel thereto.

8. The light emitter device according to claim 6 , wherein the curved surfaces are disposed directly on the substrate.

9. The light emitter device according to claim 1 , wherein at least one lens comprises a dome comprising a first sectional arc and a second sectional arc of different lengths.

10. The light emitter device according to claim 9 , wherein the first and second sectional arcs are substantially orthogonal.

11. The light emitter device according to claim 1 , wherein at least one of the lenses comprises a first maximum width and a second maximum width, and wherein the first maximum width is smaller than the second maximum width.

12. The light emitter device according to claim 11 , wherein the second maximum width comprises a diameter of a sphere.

13. The light emitter device according to claim 1 , wherein the at least two LED chips comprise a same color.

14. The light emitter device according to claim 1 , wherein the at least two LED chips comprise different colors.

15. The light emitter device according to claim 13 , wherein a layer of phosphor is provided over each LED chip.

16. The light emitter device according to claim 1 , wherein the substrate comprises a printed circuit board.

17. The light emitter device according to claim 1 , wherein the substrate comprises a ceramic material.

18. The light emitter device according to claim 1 , wherein at least two traces are provided over the substrate.

19. The light emitter device according to claim 18 , wherein at least one of the LED chips is wirebonded to at least one trace.

20. The light emitter device according to claim 1 , wherein the at least two LED chips are each provided under a same lens.

21. The light emitter device according to claim 1 , wherein each LED chip is provided under a different lens.

22. The light emitter device according to claim 1 , further comprising a plurality of LED chips provided in multiple rows.

23. The light emitter device according to claim 22 , wherein the rows are staggered in a first direction.

24. The light emitter device according to claim 1 , comprising a plurality of hexagonally shaped lenses distorted in portions of the lenses where the lenses are adjacent each other.

25. A light emitter device comprising:
a substrate;
a plurality of light emitting diode (LED) chips disposed over the substrate; and
a plurality of integrally formed lenses provided over the substrate, wherein each lens of the plurality of lenses comprises a lens base at least partially disposed over the substrate and an apex centrally located with respect to the lens base, and wherein each lens completely surrounds one or more of the plurality of LED chips;
wherein a period of each lens is larger than each LED chip, and wherein the plurality of lenses intersect in a plurality of locations along a first direction.

26. The light emitter device according to claim 25 , wherein the lenses are compressed in the first direction.

27. The light emitter device according to claim 25 , wherein each lens comprises a first maximum width and a second maximum width, wherein the first maximum width is smaller than the second maximum width.

28. The light emitter device according to claim 27 , wherein the second maximum width comprises a diameter of a sphere.

29. The light emitter device according to claim 25 , wherein each lens is provided over multiple LED chips.

30. The light emitter device according to claim 25 , wherein the plurality of LED chips are provided in a square array.

31. The light emitter device according to claim 25 , wherein the plurality of LED chips are provided in multiple rows.

32. The light emitter device according to claim 31 , wherein the rows are staggered in the first direction.

Assignees

• Cree Inc

Inventors

• Hussell Christopher P

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/853

  characterised by their shape · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H01L2224/48091

  Electricity · mapped topic

• H01L25/0753 Primary

  Electricity · mapped topic