Integrated inductor device with high inductance in a radiofrequency identification system

Patent metadata

Field	Value
Publication number	US-9460841-B2
Application number	US-201213437843-A
Country	US
Kind code	B2
Filing date	Apr 2, 2012
Priority date	Apr 1, 2011
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.

First claim

The invention claimed is:

1. An article, comprising:
a plurality of modules, each module comprising,
a first conductive coil that has an outer end and an inner end and that spirals in a direction from the outer end to the inner end; and
a second conductive coil that is disposed over the first coil, has an outer end and an inner end, and spirals in the direction from the inner end to the outer end, one of the outer and inner ends of the second coil electrically coupled to a respective one of the outer and inner ends of the first coil;
at least one first adhesive conductive region, each first adhesive conductive region being formed on an upper surface or a lower surface of the module to mechanically interconnect the module to at least one other module and being electrically isolated from the first and second conductive coils of the module; and
at least one second adhesive conductive region formed on at least one of the upper and lower surfaces, each second adhesive conductive region being positioned to electrically interconnect the module to at least one other module.

2. The article of claim 1 wherein for each of the modules:
the first conductive coil is approximately planar; and
the second conductive coil is approximately planar.

3. The article of claim 1 wherein for each of the modules:
the first conductive coil is approximately flat; and
the second conductive coil is approximately flat.

4. The article of claim 1 wherein for each of the modules the inner end of the first coil is electrically coupled with the inner end of the second coil.

5. The article of claim 1 wherein for each of the modules the outer end of the first coil is electrically coupled with the outer end of the second coil.

6. The article of claim 1 , wherein each of the modules further comprises:
a first insulator layer;
a second insulator layer disposed over the first insulator layer;
wherein the first coil is disposed over the first insulator layer; and
wherein the second coil is disposed over the second insulator layer.

7. The article of claim 1 , wherein each of the modules further comprises:
a first insulator layer having a side, an edge, and a conductor disposed on the side along the edge;
a second insulator layer disposed over, and having a side that faces away from, the side of the first insulator layer;
wherein the first coil is disposed over the side of the first insulator layer; and
wherein the second coil is disposed over the side of the second insulator layer that faces away from the first insulator layer.

8. The article of claim 1 wherein each of the modules further comprises:
a first insulator layer having a side;
a second insulator layer disposed over, and having a side that faces toward, the side of the first insulator layer, having an edge, having an opposite side, and having a conductor disposed on the side along the edge;
wherein the first coil is disposed over the side of the first insulator layer; and
wherein the second coil is disposed over the opposite side of the second insulator layer.

9. The article of claim 1 wherein each of the modules further comprises:
a first insulator layer;
a second insulator layer disposed over the first insulator layer;
wherein the first coil is disposed over the first insulator layer;
wherein the second coil is disposed over the second insulator layer;
a first current return disposed over the first insulator later;
a second current return disposed over the second insulator layer in alignment with the first current return; and
a via that electrically couples the first and second current returns.

10. The article of claim 9 , wherein each first adhesive conductive region comprises a peripheral region disposed on the upper or lower surface around the entire periphery of the module.

11. The article of claim 9 , further comprising a third coil that is disposed over the second coil, has an outer end and an inner end, and spirals in the direction from the outer end to the inner end, one of the outer and inner ends of the third coil electrically coupled to the other one of the outer and inner ends of the second coil that is not coupled to the first coil.

12. The article of claim 1 , wherein each of the at least one first and second adhesive conductive regions comprises one of an adhesive glue, a lead-free solder paste, a conductive ink, and an organic compound.

13. The article of claim 12 , wherein the lead-free solder paste comprises one of a tin-silver and a tin-silver-copper solder paste.

14. The article of claim 1 , wherein each of the plurality of modules comprises one of a ball grid array substrate and a land grid array substrate.

15. An article, comprising:
a plurality of modules, each module comprising,
a first conductive coil that has an outer end and an inner end and that spirals in a direction from the outer end to the inner end; and
a second conductive coil that is disposed over the first coil, has an outer end and an inner end, and spirals in the direction from the inner end to the outer end, one of the outer and inner ends of the second coil electrically coupled to a respective one of the outer and inner ends of the first coil;
at least one first adhesive conductive region, each first adhesive conductive region being formed on an upper surface or a lower surface of the module and the first adhesive conductive region extending around the module near edges defining a periphery of the module to mechanically interconnect the module to at least one other module, and each first adhesive conductive region being electrically isolated from the first and second conductive coils of the module; and
at least one second adhesive conductive region formed on at least one of the upper and lower surfaces, each second adhesive conductive region being positioned to electrically interconnect the module to at least one other module.

16. The article of claim 15 , wherein each of the at least one first and second adhesive conductive regions comprises one of an adhesive glue, a lead-free solder paste, a conductive ink, and an organic compound.

Assignees

• Fontana Fulvio Vittorio
• Graziosi Giovanni
• St Microelectronics Srl

Inventors

• Fontana Fulvio Vittorio
• Graziosi Giovanni

Classifications

• H01F17/0013 Primary

  with stacked layers · CPC title