Tray for aligning semiconductor packages and test handler using the same, and method of aligning semiconductor packages and test method using the same

Patent metadata

Field	Value
Publication number	US-9459315-B2
Application number	US-201414217911-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Mar 18, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

A tray for aligning semiconductor packages, a test handler using the same, a method of aligning the semiconductor packages, and a test method using the same include a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.

First claim

What is claimed is:

1. A tray for aligning semiconductor packages, the tray comprising:
a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received; and
an air position-aligning unit coupled to each of the plurality of package pocket portions of the tray main body, the air position-aligning unit applying air having a preset pressure to a semiconductor package of the plurality of semiconductor packages received at a package pocket portion of the plurality of package pocket portions, wherein the semiconductor package is aligned at the package pocket portion by the application of air by the air position-aligning unit directly to the semiconductor package in the package pocket portion.

2. The tray according to claim 1 , wherein the air position-aligning unit comprises
an air channel in the tray main body that communicates with the package pocket portion and is provided in the tray main body to connect with an air injection hole for injecting the air; and
an air pump that supplies the air to the air channel.

3. The tray according to claim 2 , wherein the air injection hole is provided at a center region of a bottom wall of the tray main body and receives the air from the air position-aligning unit.

4. The tray according to claim 3 , further comprising a diffusion groove which is recessed from a surface about the air injection hole at the bottom wall, the diffusion groove communicating with the air injection hole, the diffusion groove having a cross-section area that is reduced it extends upward.

5. The tray according to claim 2 , wherein the air injection hole is connected to one air channel.

6. The tray according to claim 2 , wherein the air position-aligning unit further comprises a controller which controls the air pump to continuously supply air by a preset time to the air channel when the semiconductor packages to be tested are loaded into the tray main body, so that the semiconductor packages can vibrate.

7. The tray according to claim 1 , wherein the tray main body comprises:
a body portion which comprises the package pocket portion and a receiving groove formed in a lower portion of the package pocket portion; and
a package supporter which is arranged in the receiving groove of the body portion, and supports the semiconductor package received in the package pocket portion, and
the air injection hole is formed in the package supporter.

8. The tray according to claim 7 , wherein the package supporter comprises:
a package supporting frame which is relatively movably coupled to the body portion; and
a shock-absorbing member, which is interposed between the body portion and the package supporting frame and absorbs a shock applied to the package supporting frame.

9. The tray according to claim 1 , wherein the plurality of package pocket portions each comprises an inclined surface on an inner wall of the tray main body forming the package pocket portion so that a cross-section area of each package pocket portion gradually narrows as it extends from a top opening to a bottom surface.

10. The tray according to claim 1 , further comprising a buffer tray which is transferred from a customer tray loaded with the semiconductor packages to be tested and that receives the semiconductor packages.

11. A test handler comprising:
a tray for aligning semiconductor packages, in which the semiconductor packages are received, the tray comprising:
a tray main body comprising a plurality of package pocket portions in which semiconductor packages are individually received; and
an air position-aligning unit coupled to each of the plurality of package pocket portions of the tray main body, the air position-aligning unit applying air having a preset pressure to a semiconductor package received in the package pocket portion so that the semiconductor package can be aligned in the package pocket portion by the application of air by the air position-aligning unit directly to the semiconductor package in the package pocket portion.

12. The test handler according to claim 11 , wherein the air position-aligning unit comprises:
at least one air injection hole in the tray main body;
an air channel in the tray main body, the air channel communicating with the at least one injection hole for injecting the air; and
an air pump which supplies the air to the air channel so that the semiconductor package can vibrate when the semiconductor packages to be tested are loaded in the tray main body.

13. The test handler according to claim 12 , wherein the air injection hole is provided in a center region of a bottom wall of the tray main body forming the package pocket portion.

14. The test handler according to claim 13 , further comprising a diffusion groove which is recessed from a surface around the air injection hole of the bottom wall to communicate with the air injection hole, and has a cross-section area getting smaller as going upward.

15. The test handler according to claim 12 , wherein the air position-aligning unit further comprises a controller which controls the air pump to continuously supply air by preset time to the air channel when the semiconductor packages to be tested are loaded into the tray main body, so that the semiconductor packages can vibrate.

16. The test handler according to claim 11 , wherein the tray main body comprises:
a body portion which comprises the package pocket portion and a receiving groove formed in a lower portion of the package pocket portion; and
a package supporter which is arranged in the receiving groove of the body portion, and supports the semiconductor package received in the package pocket portion, and
the air injection hole is formed in the package supporter.

17. The test handler according to claim 16 , wherein the package supporter comprises:
a package supporting frame which is relatively movably coupled to the body portion; and
a shock-absorbing member which is interposed between the body portion and the package supporting frame and absorbs a shock applied to the package supporting frame.

18. The test handler according to claim 11 , wherein the plurality of package pocket portions each comprises an inclined surface on an inner wall of the tray main body forming the package pocket portion so that a cross-section area of each package pocket portion can get gradually narrower as going from a top opening to a bottom surface.

19. The test handler according to claim 11 , comprising a buffer tray which is transferred from a customer tray loaded with the semiconductor packages to be tested and receives the semiconductor packages.

20. A test handler, comprising:
a buffer tray that aligns a plurality of semiconductor packages to be tested, the buffer tray comprising:
a tray main body having a plurality of package pocket portions in which the semiconductor packages are individually received; and
an air position-aligning unit coupled to each of the plurality of package pocket portions of the tray main body, the air position-aligning unit applying air to each of the semiconductor packages to be received in the package pocket portions for aligning semiconductor packages in the package pocket portions by the application of air by the air position-aligning unit directly to the semiconductor package in the package pocket portion; and

a loader unit that transfers the semiconductor packages from the buffer tray to a test tray.

21. The test handler according to claim 20 , wherein the air position-ali

Assignees

• Samsung Electronics Co Ltd

Inventors

• Han Jong Won
• Kim Sang Il

Classifications

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/16 Primary

  Trays for chips · CPC title

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• G01R31/2893 Primary

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title

• H01L21/68

  Electricity · mapped topic