Heat sink and method for manufacturing heat sink

US9459058B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9459058-B2
Application numberUS-201214236011-A
CountryUS
Kind codeB2
Filing dateJul 26, 2012
Priority dateJul 29, 2011
Publication dateOct 4, 2016
Grant dateOct 4, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This heat sink has bonded on one surface a member to be bonded, and has a cooling member in contact with the other surface. The heat sink is provided with a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and the metal plate is provided with a center portion where the member to be bonded is bonded, and a plurality of linear peripheral slits formed in a whirl-like radial manner such that the linear peripheral slits surround the center portion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat sink having a surface which is to be bonded to a member to be bonded, the heat sink comprising: a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and buried metals; wherein the metal plate is provided with a center portion where the member to be bonded is bonded and a plurality of linear peripheral slits formed in a whirl-like radial manner and in such a way as to surround the center portion, the buried metals are buried in the plurality of linear peripheral slits, and the buried metals are plastically deformed by a shearing stress along the peripheral slits easily as compared with the metal plate. 2. The heat sink according to claim 1 , wherein the heat sink having the other surface in contact with a cooling member, and wherein an outer edge portion of the surface on the cooling member side of the metal plate is fixed to the cooling member by at least three fixing portions present in the outer edge portion, and a portion excluding the fixing portions in the surface on the cooling member side of the metal plate is configured to be displaceable relative to the cooling member. 3. The heat sink according to claim 1 , wherein the metal plate is provided with a plurality of linear center slits disposed in the center portion, and the plurality of center slits intersect with each other at a center of the center portion. 4. The heat sink according to claim 1 , wherein the metal plate is made from pure Cu, pure Al, or an alloy thereof. 5. The heat sink according to claim 1 , wherein the buried metal is made from Sn, Pb, Ag, Bi, Zn, Al, an alloy of at least two types of metals selected from them, pure Nb, or pure Ta. 6. The heat sink according to claim 1 , wherein the buried metal is made from a Zn—Al alloy or a Zn—Al based superplastic metal. 7. A heat sink having a surface which is to be bonded to a member to be bonded, the heat sink comprising: a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and buried metals; wherein the metal plate is provided with a center portion where the member to be bonded is bonded and a plurality of peripheral slits formed in a whirl-like radial manner and in such a way as to surround the center portion, the buried metals are buried in the plurality of peripheral slits, and the buried metals are plastically deformed by a shearing stress along the peripheral slits easily as compared with the metal plate wherein the plurality of peripheral slits have a curved shape. 8. A method for manufacturing the heat sink according to claim 1 , the method comprising the steps of: assembling an integrated composite columnar member by allowing columnar members made from a material for forming the metal plate to adhere to tabular members made from a material for forming the buried metal in an assembling step, contracting the composite columnar member formed in the assembling step by hydrostatic extrusion in a direction orthogonal to the axial direction of the composite columnar member in an extrusion step, and slicing the composite columnar member contracted in the extrusion step along the surface orthogonal to the axial direction thereof in a slice step. 9. The method for manufacturing the heat sink, according to claim 8 , wherein the metal plate is made from pure Cu, the buried metal is made from pure Nb or pure Ta, and the extrusion temperature of the hydrostatic extrusion is a temperature within the temperature range of 600° C. to 900° C. 10. The method for manufacturing the heat sink, according to claim 8 , wherein the metal plate is made from pure Al, the buried metal is made from pure Ta, and the extrusion temperature of the hydrostatic extrusion is a temperature within the temperature range of 200° C. to 600° C. 11. The method for manufacturing the heat sink, according to claim 8 , wherein the metal plate is made from pure Cu or pure Al, the buried metal is made from Sn, Pb, Ag, Bi, Zn, Al, or an alloy of at least two types of metals selected from them, and the extrusion temperature of the hydrostatic extrusion is 200° C. or lower. 12. The method for manufacturing the heat sink, according to claim 8 , wherein the extrusion temperature of the hydrostatic extrusion is 200° C. or lower, in the assembling step, foil is sandwiched at the interfaces between a plurality of the columnar members made from a material for forming the metal plate, and the foil is made from Sn, Pb, Ag, Bi, Zn, Al, or an alloy of at least two types of metals selected from them and has a thickness of 50 μm or less. 13. A method for manufacturing the heat sink according to claim 1 , the method comprising the steps of: assembling an integrated composite columnar member by allowing columnar members made from a material for forming the metal plate to adhere to tabular members made from a material for forming the buried metal to be buried into places corresponding to the places of formation of the plurality of linear peripheral slits in the columnar members in an assembling step, contracting the composite columnar member formed in the assembling step by hydrostatic extrusion in a direction orthogonal to the axial direction of the composite columnar member in an extrusion step, removing the buried metal in the composite columnar member contracted in the extrusion step by heating, an acid-base reaction, or dissolving with a solvent to elute the buried metal from the composite columnar member in an elution step, and slicing the composite columnar member, from which the buried metal has been removed in the elution step, along the surface orthogonal to the axial direction thereof in a slice step. 14. A method for manufacturing the heat sink according to claim 1 , the method comprising the step of: forming the plurality of linear peripheral slits in the metal plate by die punching.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

  • having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

  • H10W40/10Primary

    Arrangements for heating · CPC title

  • Making metal-coated products; Making products from two or more metals · CPC title

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What does patent US9459058B2 cover?
This heat sink has bonded on one surface a member to be bonded, and has a cooling member in contact with the other surface. The heat sink is provided with a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and the metal plate is provided with a center portion where the member to be bonded is bonded, and a plurality of linear peripheral slits formed…
Who is the assignee on this patent?
Yokota Yoshihiro, Inoue Kenichi, Inoue Koji, and 3 more
What technology area does this patent fall under?
Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).