Heat-resistant SAN resin, method for manufacturing same, and heat-resistant ABS resin composition comprising same

US9458313B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9458313-B2
Application numberUS-201414764555-A
CountryUS
Kind codeB2
Filing dateFeb 27, 2014
Priority dateJul 2, 2013
Publication dateOct 4, 2016
Grant dateOct 4, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are a heat-resistant SAN resin, a method of preparing the same, and a heat-resistant ABS resin composition comprising the same. More particularly, a heat-resistant SAN resin comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound (except for α-methylstyrene), the heat-resistant SAN resin having a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., a method of preparing the same, and a heat-resistant ABS resin composition comprising the same are disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of preparing a heat-resistant styrene-acrylonitrile (SAN) resin, the method comprising: polymerizing by adding 0.05 to 0.5 parts by weight of a multifunctional initiator to 100 parts by weight of a monomer mixture comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and removing by volatilizing unreacted monomers and a solvent under a pressure of 25 torr or less after the polymerization. 2. The method according to claim 1 , wherein the multifunctional initiator comprises 2 to 4 functional groups. 3. The method according to claim 2 , wherein the functional groups are peroxide groups. 4. The method according to claim 2 , wherein the multifunctional initiator is 2,2-bis(4,4-di-t-butylperoxy cyclohexyl) propane, 1,1-bis(t-butylperoxy) cyclohexane, and a mixture thereof. 5. The method according to claim 1 , wherein the polymerization is performed at 95 to 105° C. 6. The method according to claim 1 , wherein the polymerization is performed for 6 to 8 hours. 7. The method according to claim 1 , wherein the polymerization is continuous bulk polymerization. 8. The method according to claim 1 , wherein the removing is performed at 200 to 250° C. 9. A heat-resistant acrylonitrile butadiene styrene (ABS) resin composition comprising: an ABS resin; and a heat-resistant styrene-acrylonitrile (SAN) resin, wherein the heat-resistant SAN resin has a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., wherein the heat-resistant SAN resin comprises 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and wherein the heat-resistant SAN resin comprises 0.1 to 0.8 wt % of an oligomer. 10. The heat-resistant ABS resin composition according to claim 9 , wherein the heat-resistant ABS resin composition comprises 10 to 40 wt % of an ABS resin and 60 to 90 wt % of the heat-resistant SAN resin. 11. The heat-resistant ABS resin composition according to claim 9 , wherein the heat-resistant ABS resin composition comprises a hindered phenolic antioxidant, a phosphorous antioxidant, or a mixture thereof. 12. A heat-resistant ABS resin composition comprising: an acrylonitrile butadiene styrene (ABS) resin; and a heat-resistant styrene-acrylonitrile (SAN) resin, wherein the heat-resistant SAN resin has a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., wherein the heat-resistant SAN resin comprises 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and wherein the heat-resistant ABS resin composition comprises 10 to 40 wt % of an ABS resin and 60 to 90 wt % of the heat-resistant SAN resin.

Assignees

Inventors

Classifications

  • C08L25/12Primary

    with unsaturated nitriles · CPC title

  • Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical · CPC title

  • ABS [Acrylonitrile-Butadiene-Styrene] polymers · CPC title

  • Per-compounds with more than one peroxy radical · CPC title

  • Polymerisation in bulk · CPC title

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What does patent US9458313B2 cover?
Disclosed are a heat-resistant SAN resin, a method of preparing the same, and a heat-resistant ABS resin composition comprising the same. More particularly, a heat-resistant SAN resin comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound (except for α-methylstyrene), the heat-resistant SAN resin having a degree of bra…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification C08L25/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).