Polishing pad compound

Patent metadata

Field	Value
Publication number	US-9458280-B2
Application number	US-201414299580-A
Country	US
Kind code	B2
Filing date	Jun 9, 2014
Priority date	Jun 10, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

A polishing pad compound and a polishing pad, the polishing pad compound including a pre-polymer; and a hardener, wherein the pre-polymer includes about 45 wt % to about 50 wt % of a polyol, about 5 wt % to about 25 wt % of a hardness regulator, and a balance of an isocyanate.

First claim

What is claimed is:

1. A polishing pad compound, comprising:
a pre-polymer; and
a methylenebis(2-chloroaniline) hardener,
wherein the pre-polymer includes:
45 wt % to 50 wt % of a polyol, the polyol being a 1:1:1 mixture of poly tetramethylene glycol, poly ethylene glycol, and poly propylene glycol,
5 wt % to 25 wt % of a hardness regulator, and
a balance of an isocyanate, and

wherein the pre-polymer and the methylenebis(2-chloroaniline) are mixed in an equivalent weight ratio of 1:1.

2. The polishing pad compound as claimed in claim 1 , wherein the polyol has a molecular mass of 1,000 or higher.

3. The polishing pad compound as claimed in claim 1 , wherein the hardness regulator includes dicyclohexylmethane-4,4′-diisocyanate.

4. The polishing pad compound as claimed in claim 1 , wherein the isocyanate includes toluene diisocyanate.

5. The polishing pad compound as claimed in claim 1 , wherein the pre-polymer includes 9.0 wt % to 9.5 wt % of a —N═C═O group.

6. The polishing pad compound as claimed in claim 1 , wherein the polishing pad compound has a shore-D hardness of 70 to 75.

7. A polishing pad prepared using the polishing pad compound as claimed in claim 1 .

8. The polishing pad as claimed in claim 7 , wherein:
the polyol of the polishing pad compound forms a soft segment in the polishing pad,
the isocyanate forms a hard segment in the polishing pad, and
the hardness regulator is included between hard segments in the polishing pad.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jang Youngjun
• Ahn Bong-Su
• Jeong Jin-Su
• Choi Jungsik

Classifications

• C08G18/4833

  Polyethers containing oxyethylene units · CPC title

• C08G18/7621

  being toluene diisocyanate including isomer mixtures · CPC title

• C08G18/12

  using two or more compounds having active hydrogen in the first polymerisation step · CPC title

• C08G18/4808

  Mixtures of two or more polyetherdiols · CPC title

• C08G18/758 Primary

  containing two or more cycloaliphatic rings · CPC title