Gravure offset printing method, gravure offset printing device, and gravure plate

US9457558B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9457558-B2
Application numberUS-201414761716-A
CountryUS
Kind codeB2
Filing dateJan 16, 2014
Priority dateJan 17, 2013
Publication dateOct 4, 2016
Grant dateOct 4, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from the groove on the gravure plate to the blanket, and a step of transferring the printing paste from the blanket to a substrate. The groove on the gravure plate includes a region having a width of 100 to 700 μm in a direction perpendicular to a print direction. The region has a leading end tapered forward in the print direction and a trailing end split into a pair of branches by a notch tapered forward in the print direction.

First claim

Opening claim text (preview).

The invention claimed is: 1. A gravure offset printing method for printing a fine wiring pattern on a material to be printed, the method comprising: a filling step of filling a groove defined on a gravure plate such that the groove corresponds to the fine wiring pattern with a printing paste; after the filling step, an offset step of bringing a blanket into contact with the gravure plate to offset the printing paste from the groove to the blanket; and after the offset step, a transfer step of bringing the blanket into contact with the material to be printed to transfer the printing paste from the blanket to the material to be printed, wherein the groove comprises a region having a width of 100 to 700 μm in a direction perpendicular to a print direction, the region has in the print direction a leading end tapered forward in the print direction, and the region has in the print direction a trailing end split into a pair of branches by a notch tapered forward in the print direction, each branch being tapered backward in the print direction, wherein the relational expression a <0.23w+13.6 is satisfied, where a (°) is the angle between two sides defining the shape of the leading end, and w (μm) is the width of the region, and the relational expression b <90 is satisfied, where b (°) is the angle between two sides defining the shape of the notch. 2. A gravure offset printing apparatus for printing a fine wiring pattern on a material to be printed, the apparatus comprising: a blanket configured to be brought into contact with a gravure plate having a groove defined thereon such that the groove corresponds to the fine wiring pattern to offset a printing paste from the groove to the blanket and to be brought into contact with the material to be printed to transfer the printing paste from the blanket to the material to be printed; a first moving mechanism configured to move the gravure plate while maintaining the blanket in contact with the gravure plate; and a second moving mechanism configured to move the material to be printed while maintaining the blanket in contact with the material to be printed, wherein the groove comprises a region having a width of 100 to 700 μm in a direction perpendicular to a print direction, the region has in the print direction a leading end tapered forward in the print direction, and the region has in the print direction a trailing end split into a pair of branches by a notch tapered forward in the print direction, each branch being tapered backward in the print direction, wherein the relational expression a <0.23w+13.6 is satisfied, where a (°) is the angle between two sides defining the shape of the leading end, and w (μm) is the width of the region, and the relational expression b <90 is satisfied, where b (°) is the angle between two sides defining the shape of the notch. 3. A gravure plate for use in a gravure offset printing apparatus for printing a fine wiring pattern on a material to be printed, the gravure plate having a groove defined thereon such that the groove corresponds to the fine wiring pattern, wherein the groove comprises a region having a width of 100 to 700 μm in a direction perpendicular to a print direction, the region has in the print direction a leading end tapered forward in the print direction, and the region has in the print direction a trailing end split into a pair of branches by a notch tapered forward in the print direction, each branch being tapered backward in the print direction, wherein the relational expression a <0.23w+13.6 is satisfied, where a (°) is the angle between two sides defining the shape of the leading end, and w (μm) is the width of the region, and the relational expression b <90 is satisfied, where b (°) is the angle between two sides defining the shape of the notch.

Assignees

Inventors

Classifications

  • B41F3/36Primary

    for intaglio or heliogravure printing (proof-print presses B41F3/28) · CPC title

  • with fixed type-beds and travelling impression cylinders · CPC title

  • Intaglio printing {; Gravure printing} · CPC title

  • Transfer cylinders; Offset cylinders {(attaching blankets B41F30/04)} · CPC title

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Frequently asked questions

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What does patent US9457558B2 cover?
Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from …
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification B41F3/36. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).