Mounting arrangements

Patent metadata

Field	Value
Publication number	US-9457546-B2
Application number	US-201213981784-A
Country	US
Kind code	B2
Filing date	Jan 24, 2012
Priority date	Jan 31, 2011
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

In an arrangement for transmitting power or data through a solid rigid substrate without penetrating the substrate, acoustic transducer components are mounted on the substrate by means of strain isolator elements which are welded or otherwise bonded to the substrate and providing an attachment surface to which the attachment interface of the acoustic transducer may be attached. The strain isolator element is of the same or similar acoustic impedance as the rigid substrate and may indeed be formed of the same material. Various geometries of strain isolator are disclosed, including one comprising a stalk attached to the solid rigid substrate and topped by a disc in a ‘mushroom’ configuration.

First claim

The invention claimed is:

1. A non-penetrating data transfer mounting arrangement configured for use on a surface of a solid rigid substrate which in use is subjected to strains in excess of 0.5×10 −3 , which arrangement comprises:
a first acoustic transducer, and a first strain isolating element having a relatively narrow stem portion having a first surface configured for attachment to a first surface of said substrate and an enlarged head portion having a second surface configured for attachment to an attachment interface of said first acoustic transducer, the stem portion and the head portion forming a solid region of material between the first and second surfaces of the first strain isolating element, the first strain isolating element being configured such that when said substrate is subjected to a compressive strain in use, the strain at said second surface of said first strain isolating element is lower than that at said first surface of said first strain isolating element; and
a second acoustic transducer, and a second strain isolating element having a relatively narrow stem portion having a first surface configured for attachment to a second surface of said substrate and an enlarged head portion having a second surface configured for attachment to an attachment interface of said second acoustic transducer, the stem portion and the head portion forming a solid region of material between the first and second surfaces of the second strain isolating element, the second strain isolating element being configured such that when said substrate is subjected to a compressive strain in use, the strain at said second surface of said second strain isolating element is lower than that at said first surface of said second strain isolating element,
a flexural mounting disposed between the periphery of the enlarged head of each said first and second strain isolating elements and said substrate to reduce flexing movement of the periphery of each said head;
wherein said first strain isolating element and said second strain isolating element being aligned with respect to each other on said first and second surfaces of said substrate such that a non-penetrating data transfer is passed through said substrate when said substrate is subjected to strains in excess of 0.5×10 −3 ;
wherein the flexural mounting comprises a plurality of hinges; and
wherein each of the first and second strain isolating elements further comprises an annular ring attached to the periphery of each respective enlarged head and configured to attach to the substrate, the plurality of hinges being disposed between the periphery of each respective enlarged head and the annular ring.

2. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein said first surface of each said first and second strain isolating elements is configured to be in contact with said substrate over substantially the whole of each said first surface.

3. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating elements reduces said strain by a factor of at least 3.

4. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating elements reduces said strain by a factor of at least 20.

5. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating elements reduces said strain by a factor of at least 40.

6. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating elements is attached to said rigid solid substrate by one of welding, brazing, soldering, diffusion bonding and friction stir welding.

7. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating elements is formed of a single material.

8. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein each of said first and second strain isolating element is formed of two elements of different material.

9. A non-penetrating data transfer mounting arrangement according to claim 1 , wherein the thickness of each of said first and second strain isolating elements in a direction normal to the interface is between 5 mm and 30 mm.

10. A non-penetrating data transfer mounting arrangement according to claim 9 , wherein said thickness is between 10 mm and 20 mm.

11. A method for non-penetrating data transfer through a surface of a solid rigid substrate which in use is subjected to strains in excess of 0.5×10 −3 , comprising the steps of:
interposing between a first acoustic transducer and said substrate, a first strain isolating element having a relatively narrow stem portion having a first surface configured for attachment to a first surface of said substrate and an enlarged head portion having a second surface configured for attachment to an attachment interface of said first acoustic transducer, the stem portion and the head portion forming a solid region of material between the first and second surfaces of the first strain isolating element, the first strain isolating element being configured such that when said substrate is subjected to a compressive strain in use, the strain at said second surface of said first strain isolating element is lower than that at said first surface of said first strain isolating element;
interposing between a second acoustic transducer and said substrate, a second strain isolating element having a relatively narrow stem portion having a first surface configured for attachment to a second surface of said substrate and an enlarged head portion having a second surface configured for attachment to an attachment interface of said second acoustic transducer whereby, the stem portion and the head portion forming a solid region of material between the first and second surfaces of the second strain isolating element, the second strain isolating element being configured such that when said substrate is subjected to a compressive strain in use, the strain at said second surface of said second strain isolating element is lower than that at said first surface of said second strain isolating element;
providing a flexural mounting disposed between the periphery of the enlarged head of each said first and second strain isolating elements and said substrate to reduce flexing movement of the periphery of each said head;
wherein the flexural mounting comprises a plurality of hinges; and
wherein each of the first and second strain isolating elements further comprises an annular ring attached to the periphery of each respective enlarged head and configured to attach to the substrate, the plurality of hinges being disposed between the periphery of each respective enlarged head and the annular ring; and
aligning said first strain isolating element and said second strain isolating element with respect to each other on said first and second surfaces of said substrate such that a non-penetrating data transfer is passed through said substrate when said substrate is subjected to strains in excess of 0.5×10 −3 .

Assignees

• Bagshaw John Martin
• Archer Nicholas John
• Kent Lionel William John
• Rowe Duncan Peter
• Bae Systems Plc

Inventors

• Bagshaw John Martin
• Archer Nicholas John
• Kent Lionel William John
• Rowe Duncan Peter

Classifications

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• G10K11/004 Primary

  Mounting transducers, e.g. provided with mechanical moving or orienting device (mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00) · CPC title

• B32B37/12 Primary

  characterised by using adhesives · CPC title

• Y10T403/477

  Fusion bond, e.g., weld, etc. · CPC title

• H04B11/00

  Transmission systems employing ultrasonic, sonic or infrasonic waves · CPC title