Radiation curable resin composition and rapid three-dimensional imaging process using the same

Patent metadata

Field	Value
Publication number	US-9457515-B2
Application number	US-201313959738-A
Country	US
Kind code	B2
Filing date	Aug 6, 2013
Priority date	Mar 13, 2009
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

The invention relates to a liquid radiation curable resin capable of curing into a solid upon irradiation comprising: (A) from about 0 to about 12 wt % of a cycloaliphatic epoxide having a linking ester group; (B) from about 30 to about 65 wt % of one or more epoxy functional components other than A; (C) from about 10 to about 30 wt % of one or more oxetanes; (D) from, about 1 to about 10 wt % of one or more polyols; (E) from about 2 to about 20 wt % of one or more radically curable (meth) acrylate components; (F) from about 2 to about 12 wt % of one or more impact modifiers; (G) from about 0.1 to about 8 wt % of one or more free radical photoinitiators; and (H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators; wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 600 cps to about 1300 cps.

First claim

What is claimed is:

1. A liquid radiation curable resin comprising:
(A) from about 0 to about 12 wt % of a cycloaliphatic epoxide having a linking ester group;
(B) from about 30 to about 65 wt % of one or more epoxy functional components, wherein element (B) is not the same as element (A);
(C) from about 10 to about 30 wt % of one or more oxetanes;
(D) from about 1 to about 10 wt % of one or more polyols;
(E) from about 2 to about 20 wt % of one or more radically curable (meth) acrylate components;
(F) from about 2 to about 12 wt % of one or more impact modifiers;
(G) from about 0.1 to about 8 wt % of one or more free radical photoinitiators; and
(H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators;
wherein the one or more epoxy functional components other than (A) comprises a mono-functional epoxy with an ethylhexyl chain.

2. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 200 cps to about 1300 cps.

3. The liquid radiation curable resin of claim 1 , comprising:
(A) from about 5 to about 10 wt % of a cycloaliphatic epoxide having a linking ester group;
(B) from about 35 to about 45 wt % of one or more epoxy functional components, wherein element (B) is not the same as element (A);
(C) from about 15 to about 30 wt % of one or more oxetanes;
(D) from about 1 to about 8 wt % of one or more polyols;
(E) from about 2 to about 20 wt % of one or more radically curable (meth) acrylate components;
(F) from about 2 to about 10 wt % of one or more impact modifiers; and
(G) from about 0.1 to about 5 wt % of one or more free radical photoinitiators.

4. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has
a Young's modulus of from about 2 GPa to about 3 GPa,
a notched Izod impact strength of from about 0.30 J/cm to about 0.60 J/cm,
a heat deflection temperature of from about 40° C. to about 65° C., and
a 24-hour water absorption value of from about 0.2 weight % to about 0.7 weight %.

5. The liquid radiation curable resin of claim 3 wherein the liquid radiation curable resin, after full cure, has
a Young's modulus of from about 2 GPa to about 3 GPa,
a notched Izod impact strength of from about 0.30 J/cm to about 0.60 J/cm,
a heat deflection temperature of from about 40° C. to about 65° C., and
a 24-hour water absorption value of from about 0.2 weight % to about 0.7 weight %.

6. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 600 cps to about 1250 cps.

7. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has a Young's modulus of from about 2.25 GPa to about 2.80 GPa.

8. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has a notched Izod impact strength of from about 0.30 J/cm to about 0.53 J/cm.

9. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has a heat deflection temperature of from about 55° C. to about 65° C.

10. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has a 24-hour water absorption value of from about 0.20 to about 0.61 weight %.

11. The liquid radiation curable resin of claim 1 wherein the liquid radiation curable resin, after full cure, has a strain softening value of from about 20 to about 30% of yield stress.

12. The liquid radiation curable resin of claim 1 wherein the one or more radically curable (meth) acrylate components comprises one or more components with at least two (meth) acrylate groups.

13. The liquid radiation curable resin of claim 1 wherein the one or more impact modifiers comprises one or more elastomers.

14. The liquid radiation curable resin of claim 1 wherein the one or more oxetane functional components comprises from about 0.25 wt % to about 5.0 wt % of a mono-functional oxetane with an ethylhexyl chain.

15. The liquid radiation curable resin of claim 1 wherein the one or more impact modifiers comprises an impact modifier with a dispersed average particle size of from about 50 nm to about 850 nm.

16. The liquid radiation curable resin of claim 1 wherein the one or more impact modifiers comprises a first impact modifier and a second impact modifier wherein the dispersed average particle size of the first impact modifier is different than the dispersed average particle size of the second impact modifier.

17. The liquid radiation curable resin of claim 16 wherein the ratio of diameters of the first impact modifier to the second impact modifier is about 7 to 1 and the ratio of the presence in the liquid radiation curable resin in terms of weight percent of the entire composition of the first impact modifier to the second impact modifier is about 4 to 1.

18. The liquid radiation curable resin of claim 1 wherein the cationically polymerizable/hydroxy ratio of the liquid radiation curable resin is from about 2.0 to about 4.0.

19. A radiation curable resin composition comprising, relative to the entire weight of the composition:
(A) less than about 12 wt % of a cycloaliphatic epoxide with a linking ester group;
(B) from about 30 wt % to about 65 wt % of one or more epoxy functional components, wherein (B) is different than (A);
(C) from about 10 wt % to about 30 wt % of one or more oxetanes;
(D) greater than about 1 wt % to about 30 wt % of one or more polyols;
(E) from about 2 wt % to about 20 wt % of one or more radically curable (meth)acrylate components;
(F) from about 2 to about 12 wt % of pre-fabricated elastomer particles;
(G) from about 0.1 to about 8 wt % of one or free radical photoinitiators; and
(H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators;
wherein (B) comprises a constituent that is a mono-functional epoxy with an ethylhexyl chain.

Assignees

• Dsm Ip Assets Bv

Inventors

• Southwell John
• Register Brett A
• Sarmah Satyendra Kumar
• Steeman Paulus Antonius Maria
• Keestra Beert Jacobus
• Driessen Marcus Matheus

Classifications

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title