Resin molding, method for manufacturing the same, and metal mold for manufacturing the same

US9457501B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9457501-B2
Application numberUS-201314046287-A
CountryUS
Kind codeB2
Filing dateOct 4, 2013
Priority dateMar 19, 2008
Publication dateOct 4, 2016
Grant dateOct 4, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin molding is provided. A main body is comprised of 100 parts by weight of thermoplastic resin and 0.1 to 4 parts by weight of bright material having the aspect ratio of 30 to 50. A main body has a design surface formed with a groove. The lower limit of the depth of the groove is set to 0.3 mm and the upper limit of the depth of the groove is set to 0.5 mm.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a resin molding, comprising: laminating a plurality of plates to form a cavity and a gate through which resin material is injected into the cavity; injecting the resin material which is comprised of 100 parts by weight of thermoplastic resin and 0.1 to 4 parts by weight of bright material, into the cavity through the gate; hardening the resin material to form the resin molding; and separating the plates to extract the resin molding from the cavity, wherein the plates are formed such that: the resin molding includes a main body having a round-shaped design surface formed with a plurality of rectangular-shaped grooves, the longest groove of which extends in a first direction, the lower limit of the depth of the grooves is set to 0.3 mm and the upper limit of the depth of the grooves is set to 0.5 mm, the gate extends toward a center of the round-shaped design surface and at an angle range of 45°±30° with respect to the first direction, the bright material has the aspect ratio of 30 to 50, and Y and Xd satisfy the following expressions: Y≧ 30; Xd≧ 0.3; and Y≦− 100 Xd+ 80, where Y denotes the aspect ratio of the bright material and Xd denotes the depth of the groove. 2. The method as set forth in claim 1 , wherein the plates are formed such that the gate extends at an angle range of 45°±10° with respect to the first direction. 3. The method as set forth in claim 2 , wherein the plates are formed such that the gate extends at an angle of 45° with respect to the first direction. 4. The method as set forth in claim 1 , wherein the plates are formed such that Y and Xd further satisfy the following expression: Y≦− 50 Xd+ 55. 5. The method as set forth in claim 1 , wherein the bright material has the mean particle diameter of 5 to 20 μm.

Assignees

Inventors

Classifications

  • Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity · CPC title

  • Gates (B29C45/2703 takes precedence) · CPC title

  • including variation in thickness · CPC title

  • using fillers dispersed in the moulding material, e.g. metal particles · CPC title

  • Preventing defects on the moulded article, e.g. weld lines, shrinkage marks (preventing defects on the preformed parts or layers B29C45/14836) · CPC title

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What does patent US9457501B2 cover?
A resin molding is provided. A main body is comprised of 100 parts by weight of thermoplastic resin and 0.1 to 4 parts by weight of bright material having the aspect ratio of 30 to 50. A main body has a design surface formed with a groove. The lower limit of the depth of the groove is set to 0.3 mm and the upper limit of the depth of the groove is set to 0.5 mm.
Who is the assignee on this patent?
Suzuki Motor Corp
What technology area does this patent fall under?
Primary CPC classification B29C45/0013. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).