Heat resistant alloy member, method for manufacturing the same, and method for repairing the same

US9457422B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9457422-B2
Application numberUS-201213529156-A
CountryUS
Kind codeB2
Filing dateJun 21, 2012
Priority dateJun 21, 2011
Publication dateOct 4, 2016
Grant dateOct 4, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat resistant alloy member that maintains the creep strength and improves the fatigue characteristics is provided. The heat resistant alloy member according to the present invention includes a recrystallized structure layer including finer grains on the surface of the member than those inside of the member. The recrystallized structure layer is formed by forming a stirred layer by giving processing strain to the surface of the member using a friction stir processing, and applying recrystallization heat treatment to the stirred layer for recrystallization.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a heat resistant alloy member, the member being made of a Ni-based alloy and comprising a coarse grain layer, the method comprising the steps of: forming a stirred layer by giving processing strain to at least a part of the surface of the coarse grain layer using a friction stir processing, and forming a recrystallized structure layer including finer grains than the coarse grain layer, by applying recrystallization heat treatment to the stirred layer for recrystallization, whereby: the recrystallized structure layer is composed of grains having an average size of 1 μm or more and 100 μm or less, and a thickness of the recrystallized structure layer is 1 mm or more and 5 mm or less. 2. The method for manufacturing the heat resistant alloy member according to claim 1 , wherein the stirred layer is provided at least on a portion of the surface of the coarse grain layer where fatigue damages are expected to be incurred. 3. The method for manufacturing the heat resistant alloy member according to claim 1 , wherein the coarse grain layer is composed of grains having an average size of 1 mm or more. 4. The method for manufacturing the heat resistant alloy member according to claim 3 , wherein the stirred layer is provided at least on a portion of the surface of the coarse grain layer where fatigue damages are expected to be incurred. 5. A method for repairing a heat resistant alloy member, the member being made of a Ni-based alloy and comprising a coarse grain layer, the method comprising the steps of: forming a stirred layer by giving processing strain using a friction stir processing to at least a portion of the surface of the member where cracks have occurred due to fatigue damage, and forming a recrystallized structure layer including finer grains than the coarse grain layer, by applying recrystallization heat treatment to the stirred layer for recrystallization, whereby: the recrystallized structure layer is composed of grains having an average size of 1 μm or more and 100 μm or less, and a thickness of the recrystallized structure layer is 1 mm or more and 5 mm or less.

Assignees

Inventors

Classifications

  • Tools therefor, e.g. characterised by the shape of the probe · CPC title

  • Operations & Transport · mapped topic

  • Operations & Transport · mapped topic

  • involving metallurgical change · CPC title

  • Iron or ferrous alloys · CPC title

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What does patent US9457422B2 cover?
A heat resistant alloy member that maintains the creep strength and improves the fatigue characteristics is provided. The heat resistant alloy member according to the present invention includes a recrystallized structure layer including finer grains on the surface of the member than those inside of the member. The recrystallized structure layer is formed by forming a stirred layer by giving pro…
Who is the assignee on this patent?
Kamoshida Hironori, Imano Shinya, Yoshida Takehiko, and 2 more
What technology area does this patent fall under?
Primary CPC classification B23K20/1255. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).