Piezoelectric/electrostrictive element and wiring substrate

Patent metadata

Field	Value
Publication number	US-9455396-B2
Application number	US-201414224507-A
Country	US
Kind code	B2
Filing date	Mar 25, 2014
Priority date	Mar 26, 2013
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

A piezoelectric/electrostrictive element includes a substrate, an adhesive layer, a first conductive layer, an anchor portion and a second conductive layer. The substrate contains a ceramic as a main component. The substrate has a main surface. The adhesive layer is formed on the main surface of the substrate. The adhesive layer contains a metal oxide as a main component. The first conductive layer is formed on the adhesive layer. The anchor portion is formed on the adhesive layer. The anchor portion is embedded in the conductive layer. The anchor portion contains glass as a main component. The second conductive layer is disposed opposite to the first conductive layer with the substrate located in-between.

First claim

What is claimed is:

1. A piezoelectric/electrostrictive element comprising,
a substrate containing ceramic as a main component, the substrate having a main surface;
an adhesive layer formed on the main surface of the substrate, the adhesive layer containing a metal oxide as a main component;
a first conductive layer formed on the adhesive layer;
an anchor portion formed on the adhesive layer, the anchor portion embedded in the first conductive layer, the anchor portion containing glass as a main component; and
a second conductive layer disposed opposite to the first conductive layer with the substrate located in-between.

2. The piezoelectric/electrostrictive element according to claim 1 , wherein
the metal oxide contained in the adhesive layer includes at least one of bismuth oxide, lead oxide and vanadium oxide.

3. The piezoelectric/electrostrictive element according to claim 1 , wherein
the glass contained in the anchor portion includes silicon oxide and boron oxide.

4. The piezoelectric/electrostrictive element according to claim 3 , wherein
a weight concentration ratio of silicon to boron in the anchor portion is at least 2.5.

5. The piezoelectric/electrostrictive element according to claim 1 , wherein
the anchor portion is positioned at a triple junction of a crystal grain of the conductive layer.

6. The piezoelectric/electrostrictive element according to claim 1 , wherein
the ceramic contained in the substrate is lead-based piezoelectric ceramic.

7. The piezoelectric/electrostrictive element according to claim 1 , wherein
the conductive layer contains at least one of gold, silver, copper and platinum as a main component.

8. A wiring substrate comprising,
a substrate containing ceramic as a main component, the substrate having a main surface;
an adhesive layer formed on the main surface of the substrate, the adhesive layer containing a metal oxide as a main component;
a conductive layer formed on the adhesive layer; and
an anchor portion formed on the adhesive layer, the anchor portion embedded in the conductive layer, the anchor portion containing glass as a main component.

Assignees

• Ngk Insulators Ltd

Inventors

• Kashiwaya Toshikatsu

Classifications

• H10W70/05 Primary

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H01L41/29

  Electricity · mapped topic

• C04B41/009

  characterised by the material treated · CPC title

• C04B2111/00844

  for electronic applications · CPC title

• H01L21/4846

  Electricity · mapped topic