Light emitting device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9455385-B2
Application number	US-201113150852-A
Country	US
Kind code	B2
Filing date	Jun 1, 2011
Priority date	Feb 14, 2006
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.

First claim

What is claimed is:

1. A light emitting device, comprising:
a substrate including a plurality of electrodes;
a light emitting diode on a first side of the substrate and electrically connected to the plurality of the electrodes;
a reflecting member on the plurality of electrodes and disposed around the light emitting diode, wherein the reflecting member includes a metal material; and
an insulating member on the plurality of electrodes,
wherein a top surface of the reflecting member is disposed higher than a topmost surface of the insulating member,
wherein the reflecting member comprises an inclined portion with respect to a top surface of the substrate,
wherein the insulating member is disposed between a bottom end of the inclined portion of the reflecting member and at least one top surface of the plurality of electrodes,
wherein the inclined portion of the reflecting member comprises a flat bottom surface,
wherein a bottom most surface of the reflecting member is disposed higher than a top-most surface of the insulating member, and
wherein the insulating member does not vertically overlap with the light emitting diode.

2. The light emitting device according to claim 1 , wherein the plurality of electrodes include Ag or Al.

3. The light emitting device according to claim 1 , wherein the reflecting member includes at least one of Ag, Al, Au, and an oxide-based material.

4. The light emitting device according to claim 1 , wherein at least one surface of the reflecting member has an angle in a range of 15° to 85° with respect to the top surface of the substrate.

5. The light emitting device according to claim 1 , further comprising:
a mold member on the substrate and covering the light emitting diode.

6. The light emitting device according to claim 5 , wherein the mold member is disposed inside the reflecting member.

7. The light emitting device according to claim 5 , wherein the mold member includes a fluorescent substance.

8. The light emitting device according to claim 5 , wherein the mold member includes epoxy resin or silicone resin.

9. The light emitting device according to claim 1 , wherein the light emitting diode includes a plurality of light emitting diode chips.

10. The light emitting device according to claim 9 , wherein the plurality of light emitting diode chips include each of a red light emitting diode chip, a green light emitting diode chip, and a blue light emitting diode chip, or wherein the plurality of light emitting diode chips include a plurality of blue light emitting diode chips.

11. The light emitting device according to claim 1 , wherein the light emitting diode includes an ultraviolet light emitting diode chip.

12. The light emitting device according to claim 1 ,
wherein the reflecting member includes an opening portion, and
wherein a portion of light emitted from the light emitting diode is directly emitted to the opening portion.

13. A light emitting device, comprising:
a substrate including a plurality of electrodes;
a light emitting diode on a first side of the substrate and electrically connected to the plurality of the electrodes;
a reflecting member on the substrate and disposed around the light emitting diode, wherein the reflecting member includes a metal material;
an insulating member on the plurality of electrodes; and
a mold member on the substrate and covering the light emitting diode,
wherein the reflecting member comprises a first inclined portion with respect to a top surface of the substrate,
wherein the mold member comprises a second inclined portion with respect to the top surface of the substrate,
wherein the first inclined portion of the reflecting member is substantially parallel to the second inclined portion of the mold member,
wherein the first inclined portion of the reflecting member comprises a flat bottom surface,
wherein a bottom most surface of the reflecting member is disposed higher than a top-most surface of the insulating member, and
wherein the insulating member does not vertically overlap with the light emitting diode.

14. The light emitting device according to claim 13 , wherein the reflecting member is disposed on at least one top surface of the plurality of electrodes.

15. The light emitting device according to claim 13 , wherein the plurality of electrodes include Ag or Al.

16. The light emitting device according to claim 13 , wherein the reflecting member includes at least one of Ag, Al, Au, and an oxide-based material.

17. The light emitting device according to claim 13 , wherein at least one surface of the reflecting member has an angle in a range of 15° to 85° with respect to a top surface of the substrate.

18. The light emitting device according to claim 13 , wherein the mold member is disposed inside the reflecting member.

19. The light emitting device according to claim 13 , wherein the mold member includes a fluorescent substance.

20. The light emitting device according to claim 13 , wherein the mold member includes epoxy resin or silicone resin.

21. The light emitting device according to claim 13 , wherein the light emitting diode includes a plurality of light emitting diode chips.

22. The light emitting device according to claim 21 , wherein the plurality of light emitting diode chips include each of a red light emitting diode chip, a green light emitting diode chip, and a blue light emitting diode chip, or wherein the plurality of light emitting diode chips include a plurality of blue light emitting diode chips.

23. The light emitting device according to claim 13 , wherein the light emitting diode includes an ultraviolet light emitting diode chip.

24. The light emitting device according to claim 13 ,
wherein the reflecting member includes an opening portion, and
wherein a portion of light emitted from the light emitting diode is directly emitted to the opening portion.

25. A light emitting device, comprising:
a substrate including a plurality of electrodes;
a plurality of wires connected to the plurality of electrodes;
a plurality of light emitting diode chips on a first side of the substrate and electrically connected to the plurality of electrodes;
a reflecting member on the substrate and disposed around the plurality of light emitting diode chips, wherein the reflecting member includes a metal material; and
an insulating member on the plurality of electrodes,
wherein the reflecting member is inclined with respect to a top surface of the substrate,
wherein the plurality of electrodes extend along at least a portion of the top surface of the substrate, and at least a portion of a bottom surface of the substrate,
wherein the reflecting member comprises an inclined portion with respect to the top surface of the substrate,
wherein the insulating member is disposed between a bottom end of the inclined portion of the reflecting member and at least one top surface of the plurality of electrodes,
wherein the inclined portion of the reflecting member comprises a flat bottom surface,
wherein a bottom most surface of the reflecting member is disposed higher than a top-most surface of the insulating member, and
wherein the insulating member does not vertically overlap with the plurality of light emitting diode chips.

26. The light emitting device according to claim 5 , wherein an angle of a top surface of the reflecting member with respect to the top surface of the substrate

Assignees

• Park Bo Geun
• Lg Innotek Co Ltd

Inventors

• Park Bo Geun

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H29/10

  Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title