Modulation device and power supply arrangement

Patent metadata

Field	Value
Publication number	US-9455122-B2
Application number	US-201314400561-A
Country	US
Kind code	B2
Filing date	May 8, 2013
Priority date	May 14, 2012
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

The invention relates to a modulation device for modulating charged particle beamlets in accordance with pattern data in a multi-beamlet charged particle lithography system. The device comprises a plate-like body, an array of beamlet deflectors, a plurality of power supply terminals ( 202 - 205 ) for supplying at least two different voltages, a plurality of control circuits, and a conductive slab ( 201 ) for supplying electrical power to one or more of the power supply terminals ( 202 - 205 ). The plate-like body is divided into an elongated beam area ( 51 ) and an elongated non-beam area ( 52 ) positioned with their long edges adjacent to each other. The beamlet deflectors are located in the beam area. The control circuits are located in non-beam area. The conductive slab is connected to the control circuits in the non-beam area. The conductive slab comprises a plurality of thin conductive plates ( 202 - 205 ).

First claim

The invention claimed is:

1. A modulation device for use in a charged particle lithography system adapted to generate charged particle beamlets, the modulation device arranged for modulating the charged particle beamlets in accordance with pattern data and comprising:
a plate-like body;
an array of beamlet deflectors arranged on the plate-like body for deflecting the beamlets;
a plurality of power supply terminals for supplying at least two different voltages;
a plurality of control circuits arranged on the plate-like body to receive the pattern data and supply corresponding control signals to the beamlet deflectors, wherein the control circuits are fed by the plurality of power supply terminals; and
a conductive slab arranged to supply electrical power to one or more of the power supply terminals,
wherein the body of the modulation device is divided into an elongated beam area and an elongated non-beam area positioned adjacent to the beam area so that a long edge of the beam area borders a long edge of an adjacent non-beam area,
wherein the beamlet deflectors are arranged in the beam area,
wherein the control circuits are located in the non-beam area for providing control signals to the beamlet deflectors; and
wherein the conductive slab is connected to the one or more of the power supply terminals in the non-beam area, the conductive slab comprising a plurality of thin conductive plates.

2. A modulation as claimed in claim 1 , comprising a plurality of conductive slabs arranged to supply electrical power to the power supply terminals;
wherein the body of the modulation device is divided into a plurality of elongated beam areas and a plurality of elongated non-beam areas positioned adjacent to the beam areas so that a long edge of each beam area borders a long edge of an adjacent non-beam area;
wherein the beamlet deflectors are arranged in groups, each group of beamlet deflectors located in one of the beam areas;
wherein the control circuits are located in the non-beam areas for providing control signals to the beamlet deflectors, each control circuit located in one of the non-beam areas adjacent to one of the beam areas containing one or more of the beamlet deflectors receiving control signals from the control circuit; and
wherein the conductive slabs are connected to the control circuits in the non-beam areas, each conductive slab comprising a plurality of thin conductive plates, wherein the plurality of conductive slabs forms part of the power supply arrangement.

3. The modulation device of claim 1 , wherein each thin conductive plate is configured for connecting to a respective one of said power supply terminals.

4. The modulation device of claim 1 , wherein each of the conductive plates of the conductive slab has a face terminating in one or more edges, and the plates are arranged with their faces substantially parallel to each other, wherein the face of each of the conductive plates of the conductive slab is substantially equal in area.

5. The modulation device of claim 1 , wherein each conductive plate of the conductive slab has substantially the same resistivity relative to the other conductive plates of the conductive slab.

6. The modulation device of claim 1 , wherein each conductive plate of the conductive slab has substantially the same resistivity at every position over its extent relative to the other conductive plates of the conductive slab.

7. The modulation device of claim 1 , wherein at least one edge of each conductive plate is adapted for connection to a power supply and at least one different edge of each plate is adapted for connection to a plurality of the control circuits.

8. The modulation device of claim 1 , wherein the control circuits are distributed along substantially all of the length of the long edge of a non-beam area which borders the long edge of an adjacent beam area.

9. The modulation device of claim 8 , wherein connections between the conductive slab and the control circuits in a non-beam area are distributed along substantially all of the length of the long edge of a non-beam area which borders the long edge of an adjacent beam area.

10. The modulation device of claim 1 , wherein connections between the conductive slab and the control circuits are made via a plurality of conductive bumps or solder joints on a surface of the body of the modulation device, wherein the conductive slab comprises a first portion with a face parallel to the surface of the body where the bumps are located, and a larger second portion substantially perpendicular to the surface of the body.

11. The modulation device of claim 10 , wherein a first plurality of the conductive bumps or solder joints connect with a first one of the conductive plates of a conductive slab, and a second plurality of the conductive bumps connect with a second one of the conductive plates of the conductive slab.

12. The modulation device of claim 1 , wherein the conductive slab comprises a plurality of conductive plates arranged to conduct forward electrical current from a power supply to the control circuits and beamlet deflectors, and at least one conductive plate arranged to conduct return electrical current from the control circuits and beamlet deflectors to the power supply, wherein the forward electrical current is substantially equal to the return electrical current.

13. The modulation device of claim 1 , wherein the control circuits comprise a plurality of light sensitive elements arranged to receive modulated optical signals carrying the pattern data and converting the optical signals into electrical control signals for control of the beamlet deflectors, and wherein conductive lines from the conductive plates to the light sensitive elements and return lines are substantially perpendicular to the face of the conductive plates.

14. The modulation device of claim 1 , wherein the beam areas have a length and a width, the length being at least five times the width.

15. The modulation device of claim 1 , wherein the control circuits comprise a plurality of light sensitive elements arranged to receive modulated optical signals carrying the pattern data and converting the optical signals into electrical control signals for control of the beamlet deflectors.

16. The modulation device of claim 15 , wherein the control circuits further comprise a plurality of demultiplexers, each demultiplexer arranged to receive a control signal from a corresponding one of the light sensitive elements, and demultiplex the control signal to generate a plurality of control signals to control a plurality of beamlet deflectors.

17. A charged particle lithography system comprising:
a beam generator arranged for generating a plurality of charged particle beamlets divided into separate groups;
a modulation device according to claim 1 ; and
a projection system arranged for projecting the modulated beamlets onto a target to be exposed;
wherein each beam area of the modulation device is positioned in the path of one of the groups of beamlets and each non-beam area is positioned outside the path of the beamlets.

18. A power supply arrangement for use in a charged particle lithography system comprising a modulation device arranged for modulating charged particle beamlets in accordance with pattern data and comprising:
a plate-like body;
an array of beamlet deflectors arranged on the plate-like body for deflecting the beamlets;
a plurality of power supply terminals for supplying at least two different voltages; and
a plurality of control circuits arranged on the plate-like body to rec

Assignees

• Mapper Lithography Ip Bv

Inventors

• Van De Peut Teunis
• Den Boer Hendrik

Classifications

• H01J37/045 Primary

  Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge · CPC title

• H01J2237/31754

  using electron beams · CPC title

• H01J37/3177

  Multi-beam, e.g. fly's eye, comb probe · CPC title

• H01J37/3007

  Electron or ion-optical systems · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title