Crack and thickness detecting apparatus

Patent metadata

Field	Value
Publication number	US-9453820-B2
Application number	US-201414339687-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 24, 2013
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

A crack and thickness detecting apparatus for detecting a crack in a wafer and also detecting the thickness of the wafer. The apparatus includes an ultrasonic oscillating unit oscillating a first ultrasonic wave toward the upper surface of the wafer at a predetermined incident angle, an ultrasonic oscillating and receiving unit oscillating a second ultrasonic wave toward the upper surface of the wafer in a direction perpendicular thereto and also receiving reflected waves obtained by the reflection of the first and second ultrasonic waves from the wafer, a crack determining unit determining whether or not the crack is present in the wafer according to the first reflected wave, and a thickness calculating unit calculating the thickness of the wafer according to the second reflected wave. The ultrasonic oscillating and receiving unit alternately receives the first reflected wave and the second reflected wave.

First claim

What is claimed is:

1. A crack and thickness detecting apparatus for detecting a crack in a wafer held on a rotating chuck table and also detecting the thickness of said wafer, said crack and thickness detecting apparatus comprising:
an ultrasonic oscillating unit oscillating a first ultrasonic wave toward the upper surface of said wafer held on the chuck table at a predetermined incident angle;
an ultrasonic oscillating and receiving unit oscillating a second ultrasonic wave toward the upper surface of said wafer in a direction perpendicular thereto and also receiving said first ultrasonic wave and said second ultrasonic wave propagated and reflected in said wafer;
a pulse voltage generating unit applying a pulse voltage to said ultrasonic oscillating unit and said ultrasonic oscillating and receiving unit;
a crack determining unit determining whether or not the crack is present in said wafer from waveform information on said first ultrasonic wave received by said ultrasonic oscillating and receiving unit; and
a thickness calculating unit calculating the thickness of said wafer from waveform information on said second ultrasonic wave received by said ultrasonic oscillating and receiving unit,
wherein said ultrasonic oscillating unit and said ultrasonic oscillating and receiving unit alternately oscillate said first ultrasonic wave and said second ultrasonic wave to said wafer held on said rotating chuck table with a time difference, and said ultrasonic oscillating and receiving unit alternately receives said first ultrasonic wave and said second ultrasonic wave,
said first ultrasonic wave oscillated by said ultrasonic oscillating unit and applied obliquely to said wafer is propagated in said wafer and irregularly reflected by the crack in said wafer, and said crack determining unit determines the presence of the crack in said wafer in the case that said ultrasonic oscillating and receiving unit receives a reflected wave obtained by the irregular reflection of said first ultrasonic wave, and
said second ultrasonic wave oscillated by said ultrasonic oscillating and receiving unit and applied perpendicularly to said wafer is reflected on the upper surface of said wafer to generate an upper surface reflected wave, propagated in said wafer and also reflected on the lower surface of said wafer to generate a lower surface reflected wave, and said thickness calculating unit calculates the thickness of said wafer from a time difference between the reception of said upper surface reflected wave and the reception of said lower surface reflected wave by said ultrasonic oscillating and receiving unit.

2. The crack and thickness detecting apparatus according to claim 1 , wherein when there is a variation in the waveform information on said lower surface reflected wave received by said ultrasonic oscillating and receiving unit in calculating the thickness of said wafer, said thickness calculating unit determines that the crack is present in said wafer.

3. The crack and thickness detecting apparatus according to claim 1 , wherein the ultrasonic oscillating unit comprises an ultrasonic vibrator that is obliquely mounted with respect to the upper surface of the wafer.

Assignees

• Disco Corp

Inventors

• Masada Takayuki

Classifications

• G01N2291/2697

  Wafer or (micro)electronic parts · CPC title

• G01N2291/044

  Internal reflections (echoes), e.g. on walls or defects · CPC title

• G01B17/02

  for measuring thickness · CPC title

• G01N2291/02854

  Length, thickness · CPC title

• G01N29/07 Primary

  by measuring propagation velocity or propagation time of acoustic waves · CPC title