Security shield assembly

Patent metadata

Field	Value
Publication number	US-9450586-B2
Application number	US-201214432910-A
Country	US
Kind code	B2
Filing date	Oct 2, 2012
Priority date	Oct 2, 2012
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A security shield assembly has a printed circuit board having a plurality of layers, the plurality of layers including an electrically conductive penetration sensor layer, dielectric layers, and at least one signal layer. An electronic unit is mounted to the printed circuit board and electrically connected to the signal layer.

First claim

What is claimed is:

1. A security shield assembly, comprising:
a first printed circuit board having a plurality of layers, the plurality of layers including an electrically conductive penetration sensor layer, dielectric layers, and at least one signal layer, the electrically conductive penetration sensor layer having a predetermined patterns to detect penetration tampering through the first printed circuit board;
an electronic unit mounted to the first printed circuit board and electrically connected to the signal layer;
a second printed circuit board having a plurality of layers including an electrically conductive penetration sensor layer and dielectric layers, the electrically conductive penetration layer of the second printed circuit board having a predetermined pattern to detect penetration tampering through the second printed circuit board; and
a connector mechanism to connect the first and second printed circuit boards, wherein disconnection of the connector mechanism resulting from separation of the first and second printed circuit boards provides a separation indication.

2. The security shield assembly of claim 1 , further comprising a ground ring surrounding a perimeter of the electrically conductive penetration sensor layer of the first printed circuit board.

3. The security shield assembly of claim 1 , wherein the first printed circuit board is for engagement with a main circuit board having circuitry that is to be protected by the security shield assembly, and wherein the plurality of layers further include a ground layer, the electrically conductive penetration sensor layer arranged between the ground layer and a module.

4. The security shield assembly of claim 1 , wherein the electronic unit is to detect the separation indication and to perform a security action in response to the separation indication.

5. The security shield assembly of claim 1 , wherein the electronic unit is to receive an indication of penetration tampering through the first printed circuit board detected by the electrically conductive penetration sensor layer of the first printed circuit board, and to perform a security action in response to the indication of penetration tampering through the first printed circuit board.

6. The security shield assembly of claim 1 , wherein the first printed circuit board is for engagement with a main circuit board having electronic circuitry, and wherein the security shield assembly further comprises:
multiple layers of the main circuit board, the multiple layers including an electrically conductive penetration sensor layer to detect penetration tampering.

7. The security shield assembly of claim 1 , wherein the first printed circuit board is for engagement with a main circuit board having electronic circuitry that is to be protected by the security shield assembly, and the security shield assembly further comprises an electrically conductive barrier provided between the first printed circuit board and the main circuit board to provide a barrier to drilling penetration.

8. The security shield assembly of claim 7 , wherein the electrically conductive barrier comprises a wire arranged in a ring.

9. A method of making a security shield assembly, comprising:
forming a plurality of layers of a printed circuit board, wherein the plurality of layers comprise dielectric layers, electrically conductive penetration sensor layers between successive dielectric layers, and at least one signal layer;
patterning the electrically conductive penetration sensor layers to have respective predetermined patterns that allow for detection of penetration tampering through the printed circuit board;
mounting an electronic unit to the printed circuit board and electrically connecting the electronics layer to the signal layer, the electronic unit to receive an indication of penetration tampering detected by at least one of the electrically conductive penetration sensor layers; and
connecting, with a connector mechanism, the printed circuit board to another structure, wherein the connector mechanism is to provide a separation indication in response to disconnection of the connector mechanism, and the electronic unit is to perform a security action in response to the separation indication.

10. The method of claim 9 , wherein forming the dielectric layers comprise forming dielectric layers including a fiber glass material.

11. The method of claim 9 , wherein the electronic unit is to further perform a security action in response to the indication of penetration tampering.

12. A security module comprising:
a main circuit board having electronic components including storage to store secret information;
a security shield assembly having:
a first printed circuit board to detect unauthorized physical access of the security module, the first printed circuit board having a plurality of layers, the plurality of layers including electrically conductive penetration sensor layers, dielectric layers, and at least one signal layer, the electrically conductive penetration sensor layers having respective predetermined patterns to detect penetration tampering through the first printed circuit board and
a second printed circuit board having a plurality of layers including an electrically conductive penetration sensor layer and dielectric layers, the electrically conductive penetration layer of the second printed circuit board having a predetermined pattern to detect penetration tampering through the second printed circuit board;

an electronic unit mounted to the first printed circuit board and electrically connected to the signal layer; and
a connector mechanism to connect the first and second printed circuit boards, wherein disconnection of the connector mechanism resulting from separation of the first and second printed circuit boards provides a separation indication.

13. The security module of claim 12 , further comprising a ground ring surrounding a perimeter of the electrically conductive penetration sensor layers of the first printed circuit board.

14. The security module of claim 12 , wherein the first printed circuit board is for engagement with a main circuit board having circuitry that is to be protected by the security shield assembly, and wherein the plurality of layers further include a ground layer, the electrically conductive penetration sensor layers arranged between the ground layer and the module.

15. The security module of claim 12 , wherein the electronic unit is to detect the separation indication and to perform a security action in response to the separation indication.

16. The security module of claim 12 , wherein the electronic unit is to receive an indication of penetration tampering through the first printed circuit board detected by the electrically conductive penetration sensor layers of the first printed circuit board, and to perform a security action in response to the indication of penetration tampering through the first printed circuit board.

17. The security module of claim 12 , wherein the first printed circuit board is for engagement with a main circuit board having electronic circuitry, and wherein the security shield assembly further comprises:
multiple layers of the main circuit board, the multiple layers including an electrically conductive penetration sensor layer to detect penetration tampering.

18. The security module of claim 12 , wherein the first printed circuit board is for engagement with a main circuit board having electronic circuitry that is to be protected by the security shield assembly, and the security shield assembly furt

Assignees

• Hewlett Packard Development Co Lp
• Hewlett Packard Entpr Dev Lp

Inventors

• Hadley Ted A

Classifications

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title

• H03K19/1778

  Structural details for adapting physical parameters · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K1/0278

  Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material · CPC title