Solid state power source with frames for attachment to an electronic circuit

Patent metadata

Field	Value
Publication number	US-9450267-B2
Application number	US-201514622428-A
Country	US
Kind code	B2
Filing date	Feb 13, 2015
Priority date	Dec 3, 2012
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

First claim

What is claimed is:

1. A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and
a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions,
wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

2. The power source for a solid state device according to claim 1 , wherein a third portion of the electrolyte layer is positioned between the first pole and the second pole.

3. The power source for a solid state device according to claim 1 , wherein the first contact portion is attached to the first pole layer with a first conductive adhesive layer and the second contact portion is attached to the second pole layer with a second conductive adhesive layer.

4. The power source for a solid state device according to claim 1 , further comprising a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the first and second contact portions.

5. The power source for a solid state device according to claim 1 , wherein the electrolyte layer, including the first and second portions, encapsulates the first and second poles.

6. The power source for a solid state device according to claim 1 , further comprising:
an electronic circuit, wherein the first bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the second bonding portion is electrically and mechanically bonded to the electronic circuit with a second conductive connection adhesive.

7. The power source for a solid state device according to claim 6 , further comprising
a third frame having a third contact portion, a third bonding portion and a third extension portion between the third contact portion and the third bonding portion;
a fourth frame having a fourth contact portion, a fourth bonding portion and a fourth extension portion between the fourth contact portion and the fourth bonding portion; and
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the third and fourth contact portions,
wherein the third bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the fourth bonding portion is electrically and mechanically bonded to the electronic circuit with a second conductive connection adhesive.

8. The power source for a solid state device according to claim 6 , wherein the first frame, second frame, first pole layer, electrolyte layer, second pole layer and electronic circuit are hermetically sealed in an enclosure.

9. A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
first and second side encapsulant regions positioned between the first and second contact portions, and
a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second contact portions, and between the first and second side encapsulant regions.

10. The power source for a solid state device according to claim 9 , wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer, and the first and second side encapsulant regions include the first polymer.

11. The power source for a solid state device according to claim 10 , further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

12. The power source for a solid state device according to claim 9 , wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer and the first and second side encapsulant regions include a second polymer different than the first polymer.

13. The power source for a solid state device according to claim 12 , further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

14. The power source for a solid state device according to claim 9 , wherein the first contact portion is attached to the first pole layer with a first conductive adhesive layer and the second contact portion is attached to the second pole layer with a second conductive adhesive layer.

15. The power source for a solid state device according to claim 9 , further comprising;
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the first and second contact portions.

16. The power source for a solid state device according to claim 9 , further comprising:
an electronic circuit, wherein the first bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the second bonding portion is electrically and mechanically connected to the electronic circuit with a second conductive connection adhesive.

17. The power source for a solid state device according to claim 16 , further comprising:
a third frame having a third contact portion, a third bonding portion and a third extension portion between the third contact portion and the third bonding portion;
a fourth frame having a fourth contact portion, a fourth bonding portion and a fourth extension portion between the fourth contact portion and the fourth bonding portion; and
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the third and fourth contact portions,
wherein the third bonding portion is electrically and mechanically bonded to the electronic circuit with a third conductive connection adhesive and the fourth bonding portion is electrically and mechanically bonded to the electronic circuit with a forth conductive connection adhesive.

18. The power source for a solid state device according to claim 16 , wherein the first frame, second frame, first side encapsulant region, second encapsulant region, first pole layer, electrolyte layer, second pole layer and electronic circuit are hermetically sealed in an enclosure.

19. A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions; and
an encapsulant between the first and second contact portions,
wherein the first and second bonding portions are aligned in

Assignees

• Medtronic Inc
• Sapurast Res Llc

Inventors

• Day John K
• Barror Michael W
• Snyder Shawn W
• Laguardia Alexandra Z
• Lytle Damon E
• Neudecker Bernd J

Classifications

• H01M50/103

  prismatic or rectangular (H01M50/109, H01M50/11 take precedence) · CPC title

• H01M2/0292

  Electricity · mapped topic

• H01M10/0436 Primary

  Small-sized flat cells or batteries for portable equipment · CPC title

• Y10T428/24331

  including nonapertured component · CPC title

• H01M6/181

  with polymeric electrolytes · CPC title