Light-emitting diode package and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9450159-B2
Application number	US-201214355521-A
Country	US
Kind code	B2
Filing date	Oct 9, 2012
Priority date	Oct 31, 2011
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

First claim

The invention claimed is:

1. A light emitting diode package, comprising:
a package body comprising a cavity and an air discharge channel connected to the cavity;
a light emitting diode disposed in the cavity;
a transparent member covering an upper side of the cavity;
a bonding agent disposed between the transparent member and the package body;
a sealing material disposed in the air discharge channel and blocking the air discharge channel; and
a sealing material blocking dam disposed on the package body between the sealing material and the cavity,
wherein the cavity comprises a closed space.

2. The light emitting diode package of claim 1 , wherein the air discharge channel extends from the cavity to an outside of the transparent member.

3. The light emitting diode package of claim 2 , wherein a first portion of the air discharge channel disposed outside the transparent member has a greater width than a second portion of the air discharge channel disposed near the cavity.

4. The light emitting diode package of claim 1 , wherein the package body comprises a plurality of air discharge channels, each of the plurality of air discharge channels being blocked by the sealing material.

5. The light emitting diode package of claim 1 , wherein the transparent member comprises a planar sheet-shaped lens, a semi-spherical lens, or a spherical lens.

6. The light emitting diode package of claim 1 , wherein the bonding agent comprises a thermosetting resin or a UV curable resin.

7. The light emitting diode package of claim 1 , wherein the air discharge channel comprises a groove extending from the cavity, and the bonding agent connects the transparent member to the package body in a region surrounding the cavity and excluding the air discharge channel.

8. The light emitting diode package of claim 7 , wherein the sealing material fills a space between the transparent member and the groove, and blocks the air discharge channel.

9. The light emitting diode package of claim 1 , wherein the light emitting diode is configured to emit UV light having a wavelength ranging from 250 nm to 365 nm.

10. The light emitting diode package of claim 1 , further comprising a sub-mount substrate,
wherein the light emitting diode is flip-chip bonded to the sub-mount substrate.

11. The light emitting diode package of claim 1 , wherein the package body comprises a ceramic.

Assignees

• Seoul Viosys Co Ltd

Inventors

• Jung Hee Cheul
• Chae Jung Hye
• Jang Bo Ram I
• Park Jun Yong
• Suh Dae Woong

Classifications

• H10H20/8506

  Containers · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/036

  of packages · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/85 Primary

  Packages · CPC title