LED with IC integrated lighting module

Patent metadata

Field	Value
Publication number	US-9449954-B2
Application number	US-201313955353-A
Country	US
Kind code	B2
Filing date	Jul 31, 2013
Priority date	Mar 14, 2013
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED.

First claim

What is claimed is:

1. A method of packaging, comprising:
providing a substrate, the substrate having a first side and a second side opposite the first side wherein the substrate is a metal core printed circuit board (MCPCB), wherein the MCPCB contains: a metal base, a thermally conductive but electrically insulating dielectric layer disposed on the metal base, and a metal layer disposed on the thermally conductive but electrically insulating dielectric layer;
bonding an integrated circuit (IC) die to the first side of the substrate, wherein the IC die includes at least one of: a wireless data control IC, a network data control IC, a power converter IC, a linear regulator IC, or rectifiers;
applying a packaging material over the first and second sides of the substrate through a molding process, wherein the IC die is enclosed by the packaging material, and wherein a portion of the packaging material is molded into a concave structure over the second side of the substrate;
bonding a light-emitting diode (LED) to the second side of the substrate, wherein the LED is circumferentially surrounded by sidewalls of the concave structure; and
forming a lens over the second side of the substrate, wherein the LED is disposed below the lens.

2. The method of claim 1 , wherein the IC die includes electronic circuitry configured to control operations of the LED.

3. The method of claim 1 , wherein the sidewalls of the concave structure are configured to reflect light emitted by the LED.

4. The method of claim 1 , wherein the LED is phosphor-coated before being bonded to the second side of the substrate.

5. The method of claim 1 , wherein the bonding the LED comprises flip-chip bonding or wire-bonding the LED to the second side of the substrate.

6. The method of claim 5 , further comprising: before the forming the lens, bonding a further LED to the second side of the substrate, wherein the further LED is also circumferentially surrounded by sidewalls of the concave structure.

7. The method of claim 6 , wherein the LED and the further LED are bonded differently to the second side of the substrate.

8. The method of claim 1 , wherein the forming the lens comprises:
forming a transparent material in the concave structure and over the LED die; and
shaping an upper surface of the transparent material to have a concave or convex cross-sectional profile.

9. The method of claim 1 , wherein the substrate includes a plurality of conductive interconnect elements, and wherein the bonding the IC and the bonding the LED are performed such that the IC die and the LED are electrically coupled together through the interconnect elements.

10. A method of packaging, comprising:
providing a carrier having a first side and a second opposite the first side, wherein the carrier is a metal core printed circuit board (MCPCB), wherein the MCPCB contains: a metal base, a thermally conductive but electrically insulating dielectric layer disposed on the metal base, and a plurality of conductive interconnect elements;
bonding, through one or more solder bumps, an integrated circuit (IC) die to the first side of the carrier, wherein the IC die includes one of: a wireless data control IC, a network data control IC, a power converter IC, a linear regulator IC, or rectifiers;
molding a packaging material having light-reflective properties over the first and second sides of the carrier in a manner such that the IC die is sealed by the packaging material, and
wherein a portion of the packaging material is molded into a reflective cap structure;
bonding a light-emitting diode (LED) to the second side of the carrier, wherein sidewalls of the reflective cap structure circumferentially surround the LED, and wherein the bonding the IC die and the bonding the LED are performed such that the LED and the IC die are electrically coupled together through the plurality of conductive interconnect elements in the carrier;
forming transparent material in the reflective cap structure and over the LED; and
shaping an upper surface of the transparent material into a curved lens for focusing light emitted by the LED.

11. The method of claim 10 , wherein the IC die includes electronic circuitry configured to control operations of the LED.

12. The method of claim 10 , wherein the bonding the LED comprises flip-chip bonding or wire-bonding the LED to the second side of the carrier.

13. The method of claim 10 , wherein the LED is phosphor-coated before being bonded to the second side of the carrier.

14. A method of packaging, comprising:
providing a substrate, the substrate having a first side and a second side opposite the first side wherein the substrate is a metal core printed circuit board (MCPCB), wherein the MCPCB contains: a metal base, a thermally conductive but electrically insulating dielectric layer disposed on the metal base, and a metal layer disposed on the thermally conductive but electrically insulating dielectric layer;
attaching an integrated circuit (IC) die to the first side of the substrate, wherein the IC die includes at least one of: a wireless data control IC, a network data control IC, a power converter IC, a linear regulator IC, or rectifiers;
applying a packaging material over the first and second sides of the substrate through a molding process, wherein the IC die is enclosed by the packaging material, and wherein a portion of the packaging material is molded into a concave structure over the second side of the substrate, the concave structure having light-reflective sidewalls;
attaching a light-emitting diode (LED) to the second side of the substrate in a manner such that the LED is encircled by the light-reflective sidewalls of the concave structure, and
wherein operations of the LED are controlled by the IC die; and forming a lens over the second side of the substrate, wherein the LED is disposed below the lens.

15. The method of claim 14 , further comprising: phosphor coating the LED before the attaching of the LED to the second side of the substrate.

16. The method of claim 14 , wherein the attaching of the LED comprises flip-chip bonding the LED to the second side of the substrate.

17. The method of claim 14 , wherein the attaching of the LED comprises wire-bonding bonding the LED to the second side of the substrate.

18. The method of claim 14 , wherein the attaching of the LED comprises attaching a plurality of further LEDs to the second side of the substrate, wherein the plurality of further LEDs are also encircled by the light-reflective sidewalls of the concave structure.

19. The method of claim 14 , wherein the forming the lens comprises:
forming a transparent material in the concave structure and over the LED die; and
shaping an upper surface of the transparent material to have a concave or convex cross-sectional profile.

20. The method of claim 14 , wherein the substrate includes a plurality of conductive interconnect elements, and wherein the attaching of the IC and the attaching of the LED are performed such that the IC die and the LED are electrically coupled together through the interconnect elements.

Assignees

• Tsmc Solid State Lighting Ltd
• Epistar Corp

Inventors

• Lin Chih-Chia
• Hsia Hsing-Kuo
• Chen Ching-Hui
• Tarn Jacob C

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10545

  Related components mounted on both sides of the PCB · CPC title