Lead frame with deflecting tie bar for IC package

Patent metadata

Field	Value
Publication number	US-9449901-B1
Application number	US-201514887304-A
Country	US
Kind code	B1
Filing date	Oct 19, 2015
Priority date	Apr 3, 2015
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A packaged integrated circuit (IC) device having a heatsink mounted onto an IC die, itself mounted onto a die pad, is assembled using a lead frame having tie bars that deflect during an encapsulation phase of the device assembly, which enables the die pad, the die, and the heatsink to move relative to the lead frame support structure when compressive force is applied by the molding tool. This movement results in negligible relative displacement between the heatsink and the die during encapsulation, which reduces the probability of physical damage to the die. Each tie bar has a number of differently angled sections that enable it to deflect when compressive force is applied to it.

First claim

The invention claimed is:

1. An article of manufacture comprising a lead frame for a packaged device, the lead frame comprising:
a rectangular die pad; and
a plurality of tie bars connected to the die pad at proximal ends of the tie bars, wherein, during assembly of the packaged device, (i) distal ends of the tie bars are connected to a dam bar of the lead frame and (ii) the tie bars are configured to deflect to enable the die pad to move relative to the dam bar,
wherein:
the lead frame comprises four tie bars extending from four corners of the die pad,
each tie bar is perpendicular from an end of the die pad to the dam bar,
the die pad defines a die-pad plane, and
each tie bar has one or more sections that are not parallel to the die-pad plane and that enable the tie bars to deflect when the die pad moves relative to the lead frame support structure during the assembly.

2. The article of claim 1 , wherein each tie bar comprises:
a proximal section that extends from the proximal end of the tie bar at a downward angle;
an intermediate section connected to the proximal section, wherein the intermediate section is substantially parallel to and lower than the die-pad plane; and
a distal section that extends from the intermediate section at an upward angle to the distal end of the tie bar.

3. The article of claim 2 , wherein the distal end of each tie bar lies above the die-pad plane such that, during the assembly, the die pad is lower than the dam bar.

4. The article of claim 1 , further comprising:
a die mounted on the die pad;
bond wires electrically connecting the die to leads of the lead frame;
a heatsink mounted on the die; and
molding compound encapsulating the die, the bond wires, and the die pad.

5. The article of claim 4 , wherein the tie bars deflect and the die pad, the die, and the heatsink move relative to the dam bar during an encapsulation phase of the assembly process, such that there is negligible relative displacement between the heatsink and the die during the encapsulation phase.

6. The article of claim 4 , wherein the heatsink is exposed at an outer surface of the packaged device.

7. The article of claim 4 , wherein a section of each tie bar is exposed at a different outer surface of the packaged device.

8. A method for assembling a packaged device, the method comprising:
mounting a die by a bottom surface thereof on a die pad of a lead frame, wherein the die pad is rectangular and the lead frame has a plurality of tie bars connected to the die pad at proximal ends of the tie bars and to a dam bar at distal ends of the tie bars, and wherein there are four tie bars extending from four corners of the die pad;
electrically connecting the die to leads of the lead frame with bond wires;
mounting a heatsink onto a top surface of the die to provide a sub-assembly; and
encapsulating the sub-assembly with a molding compound, wherein the tie bars deflect and the die pad moves relative to the dam bar during the encapsulating step, wherein:
the die pad defines a die-pad plane; and
each tie bar has one or more sections that are not parallel to the die-pad plane and that enable the tie bars to deflect when the die pad moves relative to the dam bar during the assembly.

9. The method of claim 8 , wherein each tie bar comprises:
a proximal section that extends from the proximal end of the tie bar at a downward angle;
an intermediate section connected to the proximal section, wherein the intermediate section is substantially parallel to and lower than the die-pad plane; and
a distal section that extends from the intermediate section at an upward angle to the distal end of the tie bar.

10. The method of claim 8 , wherein the tie bars deflect and the die pad, the die, and the heatsink move relative to the dam bar during the encapsulating step such that there is negligible relative displacement between the heatsink and the die during the encapsulating step.

11. The method of claim 10 , wherein the die pad is not directly supported from below during the encapsulating step.

12. The method of claim 8 , wherein, during the encapsulating step, a molding tool applies compressive force to the sub-assembly to inhibit the molding compound from covering an outer surface of the heatsink, wherein the compressive force causes the tie bars to deflect and the die pad to move relative to the dam bar.

13. The packaged device assembled using the method of claim 12 .

Assignees

• Freescale Semiconductor Inc

Inventors

• Wang Zhijie
• Bai Zhigang
• Ge You
• Lye Meng Kong

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/07188

  Apparatus chuck · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title