Molded printhead

Patent metadata

Field	Value
Publication number	US-9446587-B2
Application number	US-201314770945-A
Country	US
Kind code	B2
Filing date	Nov 5, 2013
Priority date	Feb 28, 2013
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead.

First claim

What is claimed is:

1. A printhead, comprising:
a molding having a channel therein;
a printhead die molded in the molding such that the molding covers a back and sides of the die, the die having a ratio of length to width of at least 50, the die also having a front part exposed outside the molding along which fluid may be dispensed from the die, the channel of the molding being fluidly connected to a back part of the die such that fluid may pass directly to the back part of the die, and the back part of the die covered by the molding except at the channel;
electrical contacts to connect to circuitry external to the printhead; and
electrical connections between terminals at the front part of the die and the contacts.

2. The printhead of claim 1 , wherein the front part of the die is co-planar with a surface of the molding surrounding the die.

3. The printhead of claim 1 , wherein the electrical connections include conductors along a surface of the molding.

4. The printhead of claim 3 , wherein the printhead die is positioned in an opening of the printed circuit board.

5. The printhead of claim 3 , wherein the molding, the printhead die, and the printed circuit board form a single uninterrupted planar surface.

6. The printhead of claim 1 , further comprising a printed circuit board molded into the molding and wherein the electrical connections include conductors in the printed circuit board.

7. The printhead of claim 6 , wherein the contacts are a part of a tape automated bond circuit.

8. The printhead of claim 6 , wherein each connection includes a bond wire connecting a terminal on the printhead die to a conductor in the printed circuit board.

9. The printhead of claim 6 , wherein the printed circuit board surrounds the die.

10. The printhead of claim 1 , further comprising a tape automated bond circuit affixed to the molding and wherein electrical contacts are part of the tape automated bond circuit and the electrical connections include conductors in the tape automated bond circuit.

11. The printhead of claim 10 , wherein each terminal is connected to a conductor in the tape automated bond circuit with a bond wire.

12. The printhead of claim 1 , wherein:
the printhead die comprises multiple printhead die slivers arranged parallel to one another laterally across the molding; and
the channel comprises multiple channels each through which fluid may pass directly to the back part of a corresponding one of the die slivers.

13. The printhead of claim 1 , wherein the printhead die comprises multiple printhead dies arranged generally end to end along the molding in a staggered configuration in which one or more of the dies overlaps an adjacent one or more of the dies.

14. The printhead of claim 1 , wherein front faces of the molding and the printhead die form a single uninterrupted planar surface.

15. A printing fluid cartridge, comprising:
a container to contain a printing fluid; and
a printhead that includes:
a printhead die sliver having a ratio of length to width of at least 50, the printhead die sliver being molded in a monolithic molding mounted to the container, the molding covering a back and sides of the die sliver leaving a front of the die sliver exposed along a front face of the die sliver and a front face of the molding surrounding the front face of the die sliver, the molding having an opening therein through which fluid may pass to a back part of the die sliver;
electrical printhead contacts to connect to circuitry external to the printhead; and
electrical connections between terminals at the front part of the die and the printhead contacts.

16. The cartridge of claim 15 , wherein;
the die sliver comprises multiple die slivers arranged parallel to one another laterally across the molding along a bottom part of the container; and
the opening comprises multiple elongated channels each positioned at the back part of a corresponding one of the die slivers.

17. The cartridge of claim 15 , wherein the multiple printhead die slivers arrange generally end to end along the molding in a staggered configuration in which one or more of the die slivers overlaps an adjacent one or more of the die slivers.

18. The cartridge of claim 15 , wherein the electrical connections include one or more of:
conductors along the surface of the molding;
conductors in a printed circuit board molded into the molding; and
conductors in a tape automated bond circuit affixed to the molding.

19. A print bar, comprising multiple printhead dies embedded in a molding with electrical conductors that extend from a front part of each of the dies to an electrical contact, the dies and the molding together defining an exposed planar surface surrounding dispensing orifices at the front part of each of the dies and the molding having a channel therein through which fluid may pass to a back part of the dies, and wherein the electrical conductors include one more of:
the conductors along the surface of the molding;
the conductors in a printed circuit board molded into the molding; and
the conductors in a tape automated bond circuit affixed to the molding.

20. The print bar of claim 19 , wherein each printhead die comprises a printhead die sliver and the die slivers are arranged generally end to end along the molding in a staggered configuration in which one or more of the die slivers overlaps an adjacent one or more of the die slivers.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Chen Chien-Hua
• Cumbie Michael W

Classifications

• B41J2/1637

  molding · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2/14024

  Assembling head parts · CPC title

• B41J2/1601

  Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence) · CPC title

• B41J2002/14491

  Electrical connection · CPC title