Adhesive agent, adhesive material using the same, and method of use thereof

Patent metadata

Field	Value
Publication number	US-9446576-B2
Application number	US-201213445344-A
Country	US
Kind code	B2
Filing date	Apr 12, 2012
Priority date	Apr 12, 2011
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3):
(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

First claim

What is claimed is:

1. A method of using an adhesive agent comprising:
an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent;
a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive layer is 200° C. or higher; and
a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step;
wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting the following (1), (2), and (3), or the following (2) and (3):
(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.;
(2) the condensation resin has a polyoxyalkanediyl group; and
(3) the monomer (A) contains an isophthalic acid; and

wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.

2. The method according to claim 1 , wherein the first adherend and the second adherend are applied at 0 to 50° C. in the application step.

3. The method according to claim 1 , wherein the adhesive layer and the second adherend are peeled from the first adherend at 0 to 50° C. in the peeling step.

4. The method according to claim 1 , wherein the adhesive layer peeled in the peeling step is reused in another application step.

5. A method of using an adhesive material comprising:
an application step of applying the adhesive material to an adherend such that the adhesive layer is disposed on a side of the adherend;
a heating step of heating the adherend under a condition such that the temperature of the adhesive material is 200° C. or higher; and
a peeling step of peeling the adhesive material from the adherend subjected to the heating step;
wherein the adhesive material comprises a substrate and an adhesive layer containing an adhesive agent formed on the substrate;
wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting the following (1), (2), and (3), or the following (2) and (3):
(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.;
(2) the condensation resin has a polyoxyalkanediyl group; and
(3) the monomer (A) contains an isophthalic acid; and

wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.

6. The method according to claim 5 , wherein the adhesive material is applied to the adherend at 0 to 50° C. in the application step.

7. The method according to claim 5 , wherein the adhesive material is peeled from the adherend at 0 to 50° C. in the peeling step.

8. The method according to claim 5 , wherein the adhesive material peeled in the peeling step is reused in another application step.

Assignees

• Masuda Katsuyuki
• Yamaguchi Masatoshi
• Shinada Eiichi
• Fukuyama Takehiro
• SAKAIRI Yoshihiro
• Hitachi Chemical Co Ltd

Inventors

• Masuda Katsuyuki
• Yamaguchi Masatoshi
• Shinada Eiichi
• Fukuyama Takehiro
• SAKAIRI Yoshihiro

Classifications

• C09J177/06

  Polyamides derived from polyamines and polycarboxylic acids (C09J177/10 takes precedence) · CPC title

• C08G73/14

  Polyamide-imides · CPC title

• C08G69/40

  Polyamides containing oxygen in the form of ether groups (C08G69/12, C08G69/32 take precedence) · CPC title

• C09J179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G69/265 Primary

  from at least two different diamines or at least two different dicarboxylic acids · CPC title