Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
US-12142594-B2 · Nov 12, 2024 · US
US9446524B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9446524-B2 |
| Application number | US-201314079840-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 14, 2013 |
| Priority date | Nov 14, 2013 |
| Publication date | Sep 20, 2016 |
| Grant date | Sep 20, 2016 |
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Official abstract text for this publication.
A wire clamp includes a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface.
Opening claim text (preview).
The invention claimed is: 1. A wire clamp, comprising: a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end; wherein the second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and wherein the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface. 2. A wire clamp according to claim 1 , wherein the inclined surface has an angle of inclination which is less than a critical angle required for self-locking. 3. A wire clamp according to claim 1 , wherein the mating inclined surface is a mating inclined surface of another wedge. 4. A wire clamp according to claim 3 , wherein the other wedge is removable from the clamp body. 5. A wire clamp according to claim 1 , wherein the preload mechanism is disposed in a gap between the second end of the actuator and the clamp body. 6. A wire clamp according to claim 1 , wherein the at least one wedge is slidably insertable into a gap between the mating inclined surface and the piezoelectric actuator, or a gap between the clamp body and the mating inclined surface, to apply the preload force. 7. A wire clamp according to claim 1 , wherein the at least one wedge comprises at least one lug which is engageable to withdraw the at least one wedge from the wire clamp.
Apparatus therefor · CPC title
with gripping surfaces having special shapes · CPC title
Means comprising hand-manipulatable implement · CPC title
Means comprising hand-manipulatable implement · CPC title
Means comprising hand-manipulatable implement · CPC title
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