Composite molding and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9444153-B2
Application number	US-201414913087-A
Country	US
Kind code	B2
Filing date	Jul 17, 2014
Priority date	Aug 21, 2013
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.

First claim

The invention claimed is:

1. A composite molding comprising:
an insulative molded body molded into a prescribed shape;
an insulative base film covering at least part of a front surface of the molded body and having an electrode pattern layer disposed on the front surface side of the molded body;
an electrically conductive contact pin having one end side which is buried in the molded body and fixed thereto and an other end which pierces through the base film and is exposed; and
an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin.

2. The composite molding according to claim 1 , wherein
the contact pin has a portion wherein a latching part having an unevenness or a hole that latches to the molded body is buried in the molding body.

3. The composite molding according to claim 1 , wherein
in the contact pin, unevenness is provided in a bonding area that bonds to the electrically conductive bonding agent such that the surface area of the bonding area is increased by the unevenness more than in the case in which the unevenness is not present.

4. The composite molding according to claim 1 , wherein
the molded body has a support protruding part formed at a perimeter of the contact pin and that supports the contact pin.

5. The composite molding according to claim 1 , wherein
the contact pin has a spring part, which has a spring characteristic, at a portion at which the contact pin is stuck out from the molded body.

6. A composite molding comprising:
an insulative molded body molded into a prescribed shape;
an insulative transfer layer covering at least part of a front surface of the molded body;
an electrode pattern layer formed between the molded body and the transfer layer;
an electrically conductive contact pin having one end side which is buried in the molded body and fixed thereto and an other end which is stuck out from the molded body; and
an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin.

7. The composite molding according to claim 6 , wherein
the other end of the contact pin pierces through the transfer layer, the electrode pattern layer, and the electrically conductive bonding agent, and sticks out from the molded body.

8. The composite molding according to claim 6 , wherein
the one end side of the contact pin is bonded to the electrode pattern layer by the electrically conductive bonding agent and the other end of the contact pin sticks out from a front surface of the molded body on the side opposite the transfer layer.

9. The composite molding according to claim 6 , wherein
the contact pin has a portion in which a latching part having an unevenness or a hole that latches to the molded body is buried in the molded body.

10. The composite molding according to claim 6 , wherein
in the contact pin, unevenness is provided in a bonding area that bonds to the electrically conductive bonding agent such that the surface area of the bonding area is increased by the unevenness more than in the case in which the unevenness is not present.

11. The composite molding according to claim 6 , wherein
the molded body has a support protruding part formed at a perimeter of the contact pin and that supports the contact pin.

12. The composite molding according to claim 6 , wherein
the contact pin has a spring part, which has a spring characteristic, at a portion at which the contact pin is stuck out from the molded body.

13. A composite molding manufacturing method comprising:
a disposing process during which a base film having an electrode pattern layer to which an electrically conductive bonding agent has been applied is disposed in a first mold, and an electrically conductive contact pin is disposed in a second mold;
a mold clamping process during which the contact pin pierces through the base film at a position at which the electrically conductive bonding agent is applied, and mold clamping of the first mold and the second mold is performed;
an injecting process during which, by the injection of a resin melt into a cavity part formed between the first mold and the second mold, the resin melt flows in along a front surface on which the electrode pattern layer of the base film is formed, and the electrically conductive bonding agent is softened by the heat of the resin melt to bond the electrode pattern layer and the contact pin with the electrically conductive bonding agent; and
a cooling process during which, by the cooling and solidification of the resin melt, a molded body is formed in which at least part of the front surface is covered by the base film, one end side of the contact pin is buried, an other end of the contact pin is stuck out from the base film, and the electrically conductive bonding agent solidifies.

14. The composite molding manufacturing method according to claim 13 , wherein
the mold clamping process includes a contact pin positioning process during which the contact pin is positioned such that the one end side of the contact pin is located inside the cavity part.

15. The composite molding manufacturing method according to claim 13 , wherein
in the electrically conductive bonding agent, the thickness of the electrically conductive bonding agent in a lamination direction of the molded body and the electrode pattern layer is 3 μm or greater and less than or equal to 300 μm.

16. A composite molding manufacturing method comprising:
a disposing process during which a base film having a transfer layer and an electrode pattern layer to which an electrically conductive bonding agent has been applied is disposed in a first mold, and an electrically conductive contact pin is disposed in a second mold;
a mold clamping process during which mold clamping of the first mold and the second mold is performed such that the contact pin contacts the electrically conductive bonding agent or such that the contact pin pierces through the base film;
an injecting process during which, by the injection of a resin melt into a cavity part formed between the first mold and the second mold, the resin melt flows in along a front surface on which the electrode pattern layer of the base film is formed, and the electrically conductive bonding agent is softened by the heat of the resin melt to bond the electrode pattern layer and the contact pin with the electrically conductive bonding agent; and
a cooling process during which, by the cooling and solidification of the resin melt, a molded body is formed in which at least part of the front surface is covered by the transfer layer, one end side of the contact pin is buried, an other end of the contact pin is exposed, and the electrically conductive bonding agent solidifies.

17. The composite molding manufacturing method according to claim 16 , wherein
in the electrically conductive bonding agent, the thickness of the electrically conductive bonding agent in a lamination direction of the molded body and the electrode pattern layer is 3 μm or greater and less than or equal to 300 μm.

Assignees

• Nissha Printing

Inventors

• Yamazaki Seiichi
• Higashikawa Toshihiro

Classifications

• B29C45/14639

  for obtaining an insulating effect, e.g. for electrical components · CPC title

• B29C45/14016

  Intermittently feeding endless articles, e.g. transfer films, to the mould (B29C45/14262 takes precedence) · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• B29L2031/3437

  Cellular phones · CPC title